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Head-to-head · every figure from the vendor documents

HPE XD685 vs Lenovo SR860 V4

A specification-by-specification comparison of the HPE ProLiant Compute XD685 and the Lenovo ThinkSystem SR860 V4, built from HPE’s and Lenovo’s own documents. None of the headline measures favour the XD685; 6 favour the SR860 V4, and they share no processors.

Bottom line. SR860 V4 leads on virtualisation, databases and in-memory work, storage density. Neither vendor publishes benchmarks for these machines, so every call here is made on what their documents state.

HPE ProLiant Compute XD685 front: twelve E3.S NVMe bays, NS204 boot module, iLO, VGA and USB 3.0 ports, PCIe bays at each side, badge on the ear
HPE ProLiant
XD685
5U Rack2 sockets24 DIMMHPE iLO 6
VS
Lenovo ThinkSystem SR860 V4 4U four-socket rack server, front three-quarter view with the optional lockable bezel fitted
Lenovo ThinkSystem
SR860 V4
4U Rack4 sockets64 DIMMXClarity Controller 3
01 — Scoreboard

The measures that decide it

Each row is a figure both vendors publish. Bars show the split between the two; a badge marks the larger figure, which is not always the better buy — a shallower chassis or a lower power ceiling can matter more.

2
Processor sockets
Higher4
192
Cores, fully populated
Largest listed processor × its socket count
Higher344
3 TB
Memory ceiling
As each document states it
Higher16 TB
12
Drive bays
Higher56
Up to 8
Accelerators
Up to 8
3,000 W
Largest power supply
Higher3,200 W
5U Rack
Rack height
Higher4U Rack
400 GbE class
Fastest network option
400 GbE class
02 — Verdict

Which one, and why

Drawn from the measures above and each model’s own data sheet. Neither vendor publishes benchmark results for these servers, so nothing here claims one is “faster”.

Choose the XD685 if…

  • Four eight-GPU boards on one platform — NVIDIA HGX H200, B200 and HGX B300, or AMD Instinct MI355X — with B200, B300 and MI355X each tied to its own DLC or power kit.

Choose the SR860 V4 if…

  • Processor sockets: 4 against 2 on the XD685
  • Cores, fully populated: 344 against 192 on the XD685
  • Memory ceiling: 16 TB against 3 TB on the XD685
  • Fifty-six front drives in one chassis: 32 E3.S 1T NVMe bays over 24 × 2.5-inch SAS/SATA bays, or 48 × 2.5-inch with up to 24 of them NVMe.
03 — By workload

Where each one pulls ahead

Calls made on documented capacity only — cores, memory, bays, accelerators and network options — with the figures behind each one shown.

VirtualisationXD685: 192 cores with 3 TB. SR860 V4: 344 cores with 16 TB.SR860 V4
Databases & in-memoryMemory ceiling 3 TB against 16 TB, across 24 and 64 DIMM slots.SR860 V4
Storage density12 bays in 5U against 56 in 4U.SR860 V4
AI & acceleration8 accelerators against 8 in the vendor documents.Line ball
Network throughputFastest card listed: 400 GbE class against 400 GbE class.Line ball
04 — Specifications

Side by side, differences first

Everything both documents state, grouped. The default view hides rows where the two machines are identical.

Processors

Every processor each vendor lists for the model, from its own document.

SpecificationXD685SR860 V4
Processors listed97
Most cores per processor9686
Highest processor TDP400 W350 W
Processor familiesAMD EPYC 9005Xeon 6 P-core

Memory

SpecificationXD685SR860 V4
DIMM slots2464
Slots per processor1216
Largest module listed128 GB256 GB
Memory typesRDIMM DDR5-6400RDIMM DDR5-6400 · 3DS RDIMM DDR5-6400 · CXL 2.0 memory module (E3.S 2T)

Storage

Bay counts are the maximum each document states, including rear and mid-chassis positions.

SpecificationXD685SR860 V4
Maximum bays1256
Documented layouts24
Bay sizesE3.S2.5-inch · E3.S
Boot devicesHPE ProLiant Compute XD NS204i-u 960GB Boot Device (S4R99A) - 2x 480 GB M.2 NVMe RAID 1 · HPE ProLiant Compute XD NS204i-u 2x 960GB Boot Device (S6A36A) - 2x 960 GB M.2 NVMe RAID 1M.2 RAID B550i-2i SATA/NVMe Enablement Kit (internal, 2 x NVMe M.2, Broadcom SAS3808N RAID) · M.2 RAID B545i-2i SATA/NVMe Adapter (internal, 2 x SATA or NVMe M.2, Broadcom SAS3808N RAID) · M.2 B350i-2i NVMe Enablement Kit (internal, 2 x NVMe M.2, optional VROC RAID) + 2 more
Storage controllers315

Accelerators & I/O

SpecificationXD685SR860 V4
Double-wide cards listed01
OCP slots02
PCIe network slots1218
Network cards listed2014

Power & platform

SpecificationXD685SR860 V4
Power-supply options110
Output range3,000–3,000 W1,300–3,200 W
Input types−48 V DCAC · 277 VAC / HVDC · −48 V DC
ManagementHPE iLO 6XClarity Controller 3
Chassis depthVendors measure depth differently — see each data sheet1049 mm (L) deep906 mm (2.5-inch chassis) / 946 mm (E3.S chassis)
05 — The data

Processors, memory, bays and power

The same charts each data sheet carries, drawn to the same scale so the two ranges can be read against each other.

XD685: processors by cores and TDP

HPE ProLiant Compute XD685 processors081624324048566472808896250 W300 W350 W400 WCores per processorAMD EPYC 9655 — 96 cores · 400 W · 2.6 GHz base · 384 MB cache · DDR5-6400AMD EPYC 9645 — 96 cores · 320 W · 2.3 GHz base · 256 MB cache · DDR5-6400AMD EPYC 9565 — 72 cores · 400 W · 3.15 GHz base · 384 MB cache · DDR5-6400AMD EPYC 9575F — 64 cores · 400 W · 3 GHz base · 256 MB cache · DDR5-6400AMD EPYC 9555 — 64 cores · 360 W · 3.2 GHz base · 256 MB cache · DDR5-6400AMD EPYC 9535 — 64 cores · 300 W · 2.4 GHz base · 256 MB cache · DDR5-6400AMD EPYC 9455 — 48 cores · 300 W · 3.15 GHz base · 256 MB cache · DDR5-6400AMD EPYC 9365 — 36 cores · 300 W · 3.4 GHz base · 192 MB cache · DDR5-6400AMD EPYC 9355 — 32 cores · 280 W · 3.6 GHz base · 256 MB cache · DDR5-6400EPYC 965596 cores — the top SKUEPYC 96453.3 W/core — most efficient
AMD EPYC 9005 9Bubble size = L3 cache · hover a bubble for the full SKU

SR860 V4: processors by cores and TDP

Lenovo ThinkSystem SR860 V4 processors0816243240485664728088150 W200 W250 W300 W350 WCores per processorIntel Xeon 6 6788P — 86 cores / 172 threads · 350 W · 2 GHz base · 336 MB cache · DDR5-6400Intel Xeon 6 6768P — 64 cores / 128 threads · 330 W · 2.4 GHz base · 336 MB cache · DDR5-6400Intel Xeon 6 6748P — 48 cores / 96 threads · 300 W · 2.5 GHz base · 192 MB cache · DDR5-6400Intel Xeon 6 6738P — 32 cores / 64 threads · 270 W · 2.9 GHz base · 144 MB cache · DDR5-6400Intel Xeon 6 6728P — 24 cores / 48 threads · 210 W · 2.7 GHz base · 144 MB cache · DDR5-6400Intel Xeon 6 6724P — 16 cores / 32 threads · 210 W · 3.6 GHz base · 72 MB cache · DDR5-6400Intel Xeon 6 6714P — 8 cores / 16 threads · 165 W · 4 GHz base · 48 MB cache · DDR5-64006 6788P86 cores · 4.1 W/core — top SKU and most efficient
Xeon 6 P-core 7Bubble size = L3 cache · hover a bubble for the full SKU

XD685: memory with every slot filled

64 GB1.5 TB96 GB2.3 TB128 GB3 TB24 slots · 12 per processor · each tick = one DIMM

SR860 V4: memory with every slot filled

32 GB2 TB64 GB4 TB96 GB6 TB128 GB8 TB256 GB16 TB64 slots · 16 per processor · each tick = one DIMM

XD685: drive bays

Front panel

8 × EDSFF NVMe at the front — 8 bays in total.

SAS/SATANVMeSAS/SATA + NVMe

SR860 V4: drive bays

Front panel

8 × 2.5" SAS/SATA at the front — 8 bays in total.

SAS/SATANVMeSAS/SATA + NVMe

XD685: power supplies

0500100015002000250030003000 W Titanium — Option name 'HPE ProLiant Compute XD 3000W 54VDC Power Supply' (54VDC = output); Standard Features name 'HPE 3000 W CRPS Titanium Hot Plug Power Supply Kit'. Family: CRPS as printed (not HPE Flex Slot; the doc does not say M-CRPS). Rated input 200-277 VAC; PMAX 2900 W at 200 VAC, 3000 W at 207-277 VAC. Max BTU 6497 BTU/hr @200 VAC, 7230 @220 VAC, 7962 @240 VAC. No -48 VDC or HVDC unit listed. 'The PSU model will differ based on the total number of PSUs in the system.' B200/B300/MI355X configs default to 12 PSUs; 10 PSUs can be deployed where PDUs/manifolds do not allow 12; B200 base 6-PSU (S4X40A) with S6V19A for 12-PSU N+3.3000TitaniumWatts · dashed line = output at 100–120 V low line
−48 V DC

SR860 V4: power supplies

05001000150020002500300035001300 W not stated — -48V DC CRPS Premium (-44V to -54V DC), BizLink connector; efficiency rating not stated in doc; max 41300DC1300 W Platinum — 230V/115V CRPS v1.5, C14; 1000W at 115V; max 41300Platinum1300 W Platinum — 230V/115V CRPS v2.4, C14; 1000W at 115V; max 41300Platinum1300 W Platinum — HVAC/HVDC CRPS Premium, 200-277V AC / 240-380V DC, Amphenol connector; max 41300Platinum1300 W Titanium — 230V/115V CRPS Premium, C14; 1000W at 115V; max 41300Titanium2000 W Titanium — 230V CRPS Premium, C14; max 42000Titanium2700 W Platinum — 230V CRPS v2.3, C20; max 42700Platinum2700 W Platinum — 230V CRPS v2.4, C20; max 42700Platinum2700 W Titanium — 230V CRPS Premium, C20; max 42700Titanium3200 W Titanium — 230V CRPS Premium, C20; max 43200TitaniumWatts · dashed line = output at 100–120 V low line
AC277 VAC / HVDC−48 V DC
07 — Questions

XD685 vs SR860 V4, answered

Is the XD685 or the SR860 V4 the faster server?

Neither document publishes benchmark results, so this page compares what they do state. The XD685 lists 9 processors up to 96 cores at 400 W; the SR860 V4 lists 7 up to 86 cores at 350 W. Fully populated that is 192 cores against 344.

Which holds more memory?

The XD685 has 24 DIMM slots and a stated ceiling of 3.0 TB. The SR860 V4 has 64 and 16 TB.

Which takes more drives?

XD685: 12 bays across 2 documented layouts. SR860 V4: 56 across 4. Counts include rear and mid-chassis positions where the vendor documents them.

Can either take GPUs?

XD685: up to 8 accelerators, 0 double-wide cards listed. SR860 V4: up to 8, 1 double-wide listed.

Do they share any processors?

No. The two documents list different processors, so a like-for-like processor build is not possible across these two.

Where these figures come from. XD685: HPE ProLiant Compute XD685 QuickSpecs (V15 - 03-August-2026) (HPE document). SR860 V4: Lenovo ThinkSystem SR860 V4 Server (September 7, 2026) (Lenovo document). Each claim on this page is derived from those documents, checked page by page on the two data sheets, and carries no pricing.

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