The C6615 is a single-socket AMD EPYC 8004 compute sled. Up to four of them slide into one 2U PowerEdge C6600 chassis, which carries the front drive backplane and the power supplies. It is aimed at scale-out work — web tiers, containers, HPC nodes — spread across many independent nodes. This page separates what each sled brings from what the chassis has to provide.
Multi-Node1 socketAMD EPYC 8004iDRAC9
4sleds per chassis2U PowerEdge C6600 · hot-swappable
64cores per sledEPYC 8534P · 200 W, cTDP to 225 W
576GBDDR5 per sled6 × 96 GB RDIMM · one per channel
2PCIe Gen5 x16 slotslow profile, plus OCP 3.0 x16
16drive bays per chassis2.5-inch, or 8 × E3.S · not per sled
Our read of Dell’s documentation: where the C6615 is strong, and the limits worth knowing before you spec one.
Strengths
+Four independent single-socket nodes in 2U. Each hot-swappable sled has its own processor, memory, boot device, OCP slot, riser slots and iDRAC ports, so one node can be pulled without powering down the others.
+EPYC 8004 is a low-power part: the six SKUs in Dell’s guide run from 90 W to 200 W default TDP, and every one is rated to 35 °C ambient with DIMMs of 64 GB or less in each air-cooled chassis option.
+PCIe Gen5 on every slot — both low-profile x16 risers and the OCP 3.0 x16 connector — with an 8 × E3.S Gen5 NVMe backplane available for the chassis.
+Static tool-less rails adjust from 603 to 917 mm and fit 19-inch four-post racks with square or unthreaded round holes.
Watch-outs
!Six DIMM slots at one DIMM per channel cap each sled at 576 GB, and reaching it needs 96 GB RDIMMs — Dell’s ambient tables cover DIMMs of 64 GB or less and exclude the 96 GB Samsung module.
!Drives belong to the chassis backplane, not the sled. The guide quotes 16 × 2.5-inch or 8 × E3.S for the C6600 and does not say how the bays are divided between sleds.
!No GPU option and no PCIe SSD (both N/A in Dell’s comparison table), and none of the three riser configurations allows rear storage.
!In ASHRAE A3/A4 rooms NVMe and EDSFF drives, DIMMs over 64 GB and the PERC H755 are ruled out, and processors are capped at 150 W in the 2.5-inch chassis.
!Only the 8324P and 8534P appear in the main processor table; the other four SKUs come from the thermal tables, which give cores and TDP but no clock speeds.
Processors6 SKUs
Cores / CPU8–64
DIMM slots6
Drive layouts4
Max bays16
Chassis power parts8 · to 3,200 W
02 — Processors
6 supported processors, mapped
Every C6615 runs one AMD EPYC 8004 processor — the “Siena” SP6 part built on Zen 4c cores — with no second socket and no chipset. Dell’s guide names six SKUs from 8 to 64 cores; the chart plots them by core count and default TDP.
Processor landscape — cores × TDP
6 SKUs · 1 family
AMD EPYC 8004 6Bubble size = L3 cache · hover a bubble for the full SKU
Processor explorer
filter · sort · compare
Processor
Cores / threads
Base
L3 cache
TDP
W / core
Memory
AMD EPYC 8534P
64 / 128
2.3 GHz
128 MB
200 W
3.1
DDR5-4800
AMD EPYC 8434P
48
—
—
200 W
4.2
—
AMD EPYC 8324P
32 / 64
2.65 GHz
128 MB
180 W
5.6
DDR5-4800
AMD EPYC 8224P
24
—
—
160 W
6.7
—
AMD EPYC 8124P
16
—
—
125 W
7.8
—
AMD EPYC 8024P
8
—
—
90 W
11.3
—
Table 4 gives full figures only for the 8324P (32 cores, 2.65 GHz, 180 W) and the 8534P (64 cores, 2.3 GHz, 200 W). Both carry 128 MB of L3, a 155–225 W cTDP range and DDR5-4800 at one DIMM per channel.
The 8434P, 8224P, 8124P and 8024P appear only in the ambient-temperature tables, with cores and TDP. Their maximum cTDP there is 225 W, 225 W, 150 W and 100 W respectively.
Each processor has six DDR5 channels and 96 I/O lanes capable of PCIe Gen5.
03 — Memory
6 DDR5 DIMM slots
Six DDR5 RDIMM slots per sled, one on each of the processor’s six channels — there is no two-DIMMs-per-channel option, so capacity grows only with module size and count: six 16 GB modules give 96 GB, six 96 GB modules the 576 GB maximum.
Capacity with every slot filled
by DIMM size
Rated memory speed
from the processor table
Processor family
Up to
AMD EPYC 8004
4800 MT/s
Dell rates the platform at up to 4800 MT/s, configuration dependent. The 96 GB RDIMM is listed as a 5600 MT/s module, while both processors in Table 4 show DDR5-4800 as their maximum.
Registered ECC DDR5 only: the 16 GB module is single-rank, the 32, 64 and 96 GB modules dual-rank.
Unused DIMM slots must be fitted with blanks, and Dell applies the same rule to an empty BOSS slot and to empty sled, drive, E3.S and PSU slots.
04 — Storage
4 drive-bay layouts, up to 16 bays
Storage for a C6615 is chosen at chassis level: the C6600 is ordered diskless or with one of four front backplanes, and that backplane is shared by the sleds inside. Dell states the bay counts for the chassis, not for each sled.
Headline layouts
front panel view
Front panel
The chassis SAS/SATA backplane: sixteen hot-plug 2.5-inch bays for HDDs or SSDs, up to 61 TB in Dell’s spec sheet.
SAS/SATANVMeSAS/SATA + NVMe
Controllers & boot
PERC H755 — RAID. Internal controller (Table 10); adapter PERC on riser config 1/2 (Table 14); spec sheet lists it as 'PERC H755N'; not supported under ASHRAE A3/A4
PERC H355 — RAID. Internal controller (Table 10)
HBA355i — HBA. 12 Gbps SAS HBA (non-RAID)
S160 — Software RAID
BOSS-N1 — Boot. HWRAID 1, 2 x M.2 SSDs
BOSS-N1 (HWRAID 1, 2 x M.2 SSDs, 22 x 80 mm) — boot
uSD / MicroSD card (reader on Riser 1A; 16/32/64 GB supported at RTS) — boot
Boot lives in the sled: BOSS-N1 mirrors two 22 × 80 mm M.2 SSDs in hardware RAID 1, and Riser 1A carries a microSD reader that takes 16, 32 or 64 GB cards.
Controllers: internal PERC H755 or H355, the HBA355i, or S160 software RAID; riser configurations 1 and 2 also accept an adapter PERC.
Dell’s spec sheet quotes maximum capacities of 61 TB on the 16-bay SAS/SATA backplane and 15.36 TB on the Universal backplane.
Every documented layout
4 with drive bays
2.5-inch3.5-inchEDSFF (E1.S / E3.S)
05 — I/O & networking
PCIe and networking
I/O topology
96 lanes per CPU
All expansion hangs off the one processor. A sled is built with no riser, with Riser 1A (slot 1), or with Risers 1A and 2C (slots 1 and 2); each slot is a low-profile PCIe Gen5 x16 slot rated at 75 W.
Network adapters Dell lists
3 options
Adapter
Ports
Form
Broadcom OCP 3.0 NIC 25 GbE SFP28
× 25GbE
OCP 3.0
Broadcom OCP 3.0 NIC 25 GbE SFP28 (second listed Broadcom 25 GbE SFP28 entry in Table 12)
× 25GbE
OCP 3.0
1 GbE x1 LOM (embedded NIC)
1 × 1GbE
LOM
Dell’s OCP table lists two Broadcom 25 GbE SFP28 cards. The slot itself allows up to four ports and 100 GbE, with NC-SI, SNAPI and Wake-on-LAN, at 15–80 W.
The rear RJ45 port serves either the 1 GbE LOM or iDRAC. Video from the integrated Matrox G200 leaves through the Mini-DisplayPort.
Among its ASHRAE A3/A4 restrictions Dell notes that a single sled holds no more than two cards, PCIe and OCP combined.
06 — Power & cooling
No supplies of its own — powered by the chassis
The sled has no power supply of its own: it takes power through a connector and Power Interposer Board from the C6600, whose up to two hot-plug supplies feed every sled in the chassis. Four ratings are offered, each in an AC and a DC version — all eight are shown below.
AC277 VAC / HVDC
Dell warns that the supply must be sized with its Enterprise Infrastructure Planning Tool (EIPT) before ordering — every sled, drive and card in the chassis draws from the same one or two units.
Only the 2400 W Platinum supply accepts low-line 100–120 V, and there it is derated to 1400 W. The 1800 W and 2800 W units take 200–240 V AC in their AC versions and 240 V DC in their DC versions; the 3200 W pair runs on 277 V AC or 336 V DC.
Cord types: the 60 mm 1800 W supply uses C15, while the 86 mm supplies use C19 (2400 W), C21 (2800 W) and APP 2006G1 (3200 W). A C13 cord with a C14-to-C15 jumper can feed the 1800 W unit, and a C19 cord with a C20-to-C21 jumper the 2800 W unit.
07 — Management, security & OS
Run it, secure it, choose the OS
Management
iDRAC9 with Lifecycle Controller on every sled
iDRAC Direct (rear Micro-AB USB) and RJ45 iDRAC port per sled
iDRAC RESTful API with Redfish
iDRAC Service Module
OpenManage Enterprise with Power Manager, Update Manager and SupportAssist plug-ins
Data at Rest Encryption (SEDs, local or external key management)
System Lockdown (iDRAC9 Enterprise or Datacenter)
Secure Erase
TPM 2.0 FIPS, CC-TCG certified · TPM 2.0 China NationZ
Operating systems
Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi
Dell NativeEdge
08 — Compare
C6525 → C6615
Dell’s guide sets the C6615 against the C6525, the AMD sled it follows. The defining change is the move from two sockets per node to one, traded for DDR5, PCIe Gen5 and a lower power envelope.
previous generationPowerEdge C6525
PowerEdge 16GPowerEdge C6615
Processors
2 × AMD EPYC (Rome or Milan) per node · up to 280 W
1 × AMD EPYC 8004 · up to 64 cores
Memory
DDR4 · up to 16 RDIMM / LRDIMM
6 × DDR5 RDIMM · up to 576 GB
Front storage
24 × 2.5-inch (4 × 6) or 12 × 3.5-inch
16 × 2.5-inch (SAS/SATA, Universal or NVMe) or 8 × E3.S
PCIe
PCIe Gen4 x16 slots · OCP 3.0 SFF x16
2 × PCIe Gen5 x16 low profile · OCP 3.0 x16 Gen5
Boot
microSD · 240 or 480 GB M.2
BOSS-N1 (2 × M.2, RAID 1) or microSD
PCIe SSD / GPU
PCIe SSD on riser · 75 W low-profile GPU
Neither offered
Power supplies
1600, 2000, 2400 and 2600 W · 2000 W 240 V DC
1800, 2400, 2800 and 3200 W · AC and DC versions
Rack height
2U
2U
Source: Dell PowerEdge C6600 and C6615 Technical Guide, Table 2 (PowerEdge system comparison, C6615 vs C6525).
The C6615 family side by side
Against Dell’s single-socket EPYC rack servers (R6615, R7615, R6715), the C6615 gives up memory and PCIe slots in exchange for four nodes in 2U; the MX760c is the other modular sled shown, a two-socket Intel design. In the chart, the C6615’s drive count is the whole chassis’s, not one sled’s.
This modelSiblings and successorEach value from that model’s own verified spec file · bars scale per column
Four single-sled builds for the scale-out jobs Dell positions the C6615 for. Load any of them into the configurator to adjust it. The chassis, its backplane and its power supplies are common to every sled inside, so they sit outside these builds.
Containers
64-core container host
Dell pitches the C6615 at container density. A 64-core 8534P per sled with the full 576 GB gives each node plenty of room, and, as Dell’s spec sheet points out, keeping tenants on physically separate nodes cuts noisy-neighbour contention.
1 × AMD EPYC 8534P — 64 cores @ 2.3 GHz, 200 W
6 × 96 GB DDR5 RDIMM — 576 GB, the sled maximum
BOSS-N1: 2 × M.2 in hardware RAID 1 for the OS
Broadcom 25 GbE SFP28 OCP 3.0 NIC
Ubuntu Server 24.04 LTS
Dell’s ambient tables are written for DIMMs of 64 GB or less and exclude the 96 GB Samsung module, and ASHRAE A3/A4 sites cannot use DIMMs above 64 GB — we confirm the 96 GB part when we quote.
Modelled on the four-sled “Webtech” build Dell used for its acoustic tests — six 16 GB RDIMMs per sled, the 16-bay SAS/SATA chassis with 1.2 TB SAS drives and BOSS boot — here with a 32-core 8324P.
1 × AMD EPYC 8324P — 32 cores @ 2.65 GHz, 180 W
6 × 16 GB DDR5-4800 RDIMM — 96 GB
4 × 1.2 TB 2.5-inch SAS on the 16-bay SAS/SATA chassis backplane
PERC H355 internal RAID controller
BOSS-N1 boot mirror
Broadcom 25 GbE SFP28 OCP 3.0
The 16 bays belong to the chassis and Dell does not document a per-sled split; its tested chassis carried 16 drives for four sleds. We confirm drive allocation when we quote.
For HPC the no-backplane chassis keeps the widest processor choice in hot rooms — under ASHRAE A3/A4 Dell allows up to 225 W there, against 150 W with 2.5-inch drives — so nodes boot from BOSS-N1 and keep scratch data on shared storage.
Dell names databases and data warehouses among the C6615’s targets and pairs the platform with Gen5 E3.S flash. A 24-core 8224P keeps core-based licence counts modest while the sled still carries 384 GB of DDR5.
1 × AMD EPYC 8224P — 24 cores, 160 W
6 × 64 GB DDR5-4800 RDIMM — 384 GB
2 × 7.68 TB E3.S Gen5 NVMe on the 8-bay E3.S chassis backplane
BOSS-N1 boot mirror
Broadcom 25 GbE SFP28 OCP 3.0
Windows Server 2025
Dell excludes NVMe and EDSFF drives from ASHRAE A3/A4 rooms, and its guide does not say how the chassis’s eight E3.S bays map to individual sleds.
Up to 2 × PCIe Gen5 x16 low profile, 75 W each, both on the processor
OCP
1 × OCP 3.0 SFF, PCIe Gen5 x16 · up to 4 ports, 100 GbE
Embedded NIC
1 × 1 GbE LOM
GPU
None
Power (C6600 chassis)
Supplies
Up to two hot-plug, AC or DC
AC
1800 W Titanium (200–240 V) · 2400 W Platinum (100–240 V) · 2800 W Titanium (200–240 V) · 3200 W (277 V)
DC
1800, 2400 and 2800 W at 240 V DC · 3200 W at 336 V DC
Ports & video (per sled)
Rear
1 × USB 3.0 · 1 × Mini-DisplayPort · 1 × RJ45 (LOM or iDRAC) · 1 × iDRAC Direct Micro-AB USB · sled power button
Video
Integrated Matrox G200, up to 1920 × 1200 at 60 Hz
Environment
Standard range
10–35 °C
ASHRAE A3
5–40 °C
ASHRAE A4
5–45 °C
Maximum operating altitude
3,048 m
11 — FAQ
C6615 questions, answered from the documentation
Does the PowerEdge C6615 need a chassis?
Yes. The C6615 is a 1U compute sled and runs only inside a 2U PowerEdge C6600 chassis, which takes up to four hot-swappable sleds. The chassis carries the front drive backplane and up to two power supplies; each sled carries its own processor, memory, boot device, network cards and iDRAC.
What is the maximum memory of the C6615?
576 GB per sled, using six 96 GB DDR5 RDIMMs — one on each of the processor’s six channels. Dell also lists 16, 32 and 64 GB RDIMMs. Its ambient-temperature tables are written for DIMMs of 64 GB or less and exclude the 96 GB Samsung module.
Which processors does the C6615 support?
One AMD EPYC 8004 processor per sled. Dell’s guide names six: the 8534P (64 cores), 8434P (48), 8324P (32), 8224P (24), 8124P (16) and 8024P (8), with default TDPs from 90 W to 200 W and configurable TDP up to 225 W.
How many drives does each C6615 sled get?
Dell doesn’t say. Its guide gives drive counts for the C6600 chassis as a whole — 16 × 2.5-inch on a SAS/SATA, Universal or all-NVMe backplane, 8 × E3.S NVMe Gen5, or diskless — without a per-sled breakdown. We confirm the allocation for your configuration when we quote.
How many PCIe slots does a C6615 sled have?
Up to two low-profile PCIe Gen5 x16 slots on Risers 1A and 2C, both wired to the processor and rated at 75 W, plus one OCP 3.0 x16 Gen5 slot and a 1 GbE LOM. A sled can also be built with no riser at all.
Does the C6615 support GPUs?
No. Dell’s comparison table lists GPU options as N/A for the C6615, where the previous C6525 offered a 75 W low-profile card. PCIe SSDs are not offered either.
What power supplies does the C6600 chassis use?
Up to two hot-plug supplies in four ratings — 1800, 2400, 2800 and 3200 W — each offered in an AC and a DC version; Dell’s comparison table classes the 2400 W AC unit as Platinum and the 1800 W and 2800 W AC units as Titanium, and gives the 3200 W unit no class. Only the 2400 W unit runs on 100–120 V, where it is derated to 1400 W. Dell asks for the supply to be sized with its EIPT tool before ordering.
How big are the C6600 chassis and the C6615 sled?
The C6600 is 2U: 86.8 mm high, 489.0 mm wide at the ears and 763.2 mm deep from the ears to the rear wall (799.97 mm to the PSU handle). Each sled measures 174.4 × 40.0 mm across its face, 549.7–561.3 mm deep, and weighs up to 3.7 kg.
How does the C6615 differ from the C6525?
The C6525 put two AMD EPYC (Rome or Milan) processors in each node with DDR4 memory; the C6615 uses one EPYC 8004 per sled with six DDR5 slots and PCIe Gen5. The chassis stays 2U, but front storage changes from 24 × 2.5-inch or 12 × 3.5-inch to 16 × 2.5-inch or 8 × E3.S.
Is the PowerEdge C6615 end of life?
Dell hasn’t announced a date in its documentation: the June 2026 revision of the C6600 and C6615 guide contains no end-of-sale or end-of-service date for the sled or the chassis. Our server end-of-life checker is the place to look if Dell later publishes one.
Sources & verification
Where these figures come from
Dell PowerEdge C6600 and C6615 Technical Guide (Rev. A03, June 2026) — System overview, Table 2 (C6615 vs C6525), processor Table 4, memory Table 9, controller, OCP and riser tables, PSU Tables 17–18, thermal Tables 20–21 and A3/A4 restrictions, rails, chassis and sled dimensions, weight and environment.
Specifications are extracted from Dell’s published documents and independently re-checked line by line. Configurations are quote-based; availability and exact options are confirmed at quotation. Last reviewed 2026-09-11.
