The R6615 is Dell’s one-socket 1U server for 4th Generation AMD EPYC 9004 processors: a single CPU of up to 128 cores, twelve DDR5 slots, and every riser wired to that one chip. Below is the full envelope from Dell’s guide — 23 processors, fronts from four 3.5-inch bays to sixteen E3.S, the slot and GPU limits — and where the thermal tables narrow the choice.
Our read of Dell’s documentation: where the R6615 is strong, and the limits worth knowing before you spec one.
Strengths
+One socket spans the whole EPYC 9004 range Dell lists here, from 16-core parts to the 128-core 9754, in a single rack unit.
+All twelve DDR5 channels get their own slot, and 256 GB RDIMMs take the server to 3 TB.
+Broad storage choice for 1U: four 3.5-inch bays for bulk disk, eight or ten 2.5-inch SAS/SATA/NVMe, or 14 or 16 EDSFF E3.S Gen5, with two rear bays on most riser layouts.
+Eight power supplies, from a 700 W Titanium unit up to 1800 W, including units for 277 VAC, HVDC and telco DC feeds.
+Nine riser configurations, a no-riser build among them, and every one is driven by the single processor.
Watch-outs
!Memory stops at 12 DIMMs and 3 TB: the platform runs one DIMM per channel, so there is no second slot per channel to grow into.
!On air, no 400 W-class processor is rated above 30°C inlet, and Dell marks the 9554/9554P, 9474F, 9754 and 9684X as needing Direct Liquid Cooling.
!GPUs stop at two single-wide 75 W cards. Dell’s GPU thermal table only covers layouts without rear drives, and marks the diskless chassis and every 400 W processor as unsupported.
!The guide carries no processor table: per-model clocks, cache and default TDP are absent, leaving only core count and cTDP class.
!Depth depends on the chassis: Table 2 quotes 772.13 mm with bezel, yet Table 20 puts drive-equipped chassis at 787.05 mm from ear to PSU handle before the 35.84 mm bezel.
Processors23 SKUs
Cores / CPU16–128
DIMM slots12
Drive layouts16
Max bays16
GPUsup to 2
PSU options8 · to 1,800 W
02 — Processors
23 supported processors, mapped
Dell’s R6615 guide has no processor table. The 23 EPYC 9004 models charted here are taken from its air-cooling thermal matrix, which gives only model, core count and cTDP class — 240 W, 300 W or 400 W — so the power axis shows that class ceiling rather than a default TDP.
Processor landscape — cores × TDP
23 SKUs · 1 family
AMD EPYC 9004 23Bubble size = L3 cache · hover a bubble for the full SKU
Processor explorer
filter · sort · compare
Processor
Cores / threads
Base
L3 cache
TDP
W / core
Memory
AMD EPYC 9754
128
—
—
400 W
3.1
—
AMD EPYC 9734
112
—
—
400 W
3.6
—
AMD EPYC 9654
96
—
—
400 W
4.2
—
AMD EPYC 9654P
96
—
—
400 W
4.2
—
AMD EPYC 9684X
96
—
—
400 W
4.2
—
AMD EPYC 9634
84
—
—
300 W
3.6
—
AMD EPYC 9554
64
—
—
400 W
6.3
—
AMD EPYC 9554P
64
—
—
400 W
6.3
—
AMD EPYC 9534
64
—
—
300 W
4.7
—
AMD EPYC 9474F
48
—
—
400 W
8.3
—
AMD EPYC 9454
48
—
—
300 W
6.3
—
AMD EPYC 9454P
48
—
—
300 W
6.3
—
AMD EPYC 9374F
32
—
—
400 W
12.5
—
AMD EPYC 9384X
32
—
—
400 W
12.5
—
AMD EPYC 9354
32
—
—
300 W
9.4
—
AMD EPYC 9354P
32
—
—
300 W
9.4
—
AMD EPYC 9334
32
—
—
240 W
7.5
—
AMD EPYC 9224
24
—
—
240 W
10.0
—
AMD EPYC 9254
24
—
—
240 W
10.0
—
AMD EPYC 9274F
21
—
—
400 W
19.0
—
AMD EPYC 9174F
16
—
—
400 W
25.0
—
AMD EPYC 9184X
16
—
—
400 W
25.0
—
AMD EPYC 9124
16
—
—
240 W
15.0
—
The matrix prints the 9454/9454P, 9354/9354P, 9654/9654P and 9554/9554P as shared rows; each P model is shown with its twin’s figures.
The R6615 guide gives the 9274F as 21 cores; Dell’s R7615 guide lists the same model with 24 cores and 48 threads.
Air-cooled builds all use the 1U extended heat sink; Direct Liquid Cooling swaps it for a DLC module on the processor.
Processors above 240 W bring a DIMM-blank requirement, which Dell lifts for liquid-cooled systems.
03 — Memory
12 DDR5 DIMM slots
Twelve DDR5 RDIMM slots, one for each memory channel, all attached to the single processor. Dell quotes speeds of up to 6400 MT/s, yet its notes say a 5600 MT/s RDIMM is clocked down to the 4800 MT/s the platform supports at one DIMM per channel.
Capacity with every slot filled
by DIMM size
3 TB is 12 × 256 GB. The guide prints no per-module speed table; the 16, 32, 64, 96, 128 and 256 GB sizes appear in its thermal matrix.
AMD’s notes in the guide list 2-, 4-, 6-, 8-, 10- and 12-channel performance-optimisation options; the builds on this page fill all twelve.
On air, modules larger than 128 GB call for High-performance Gold fans in every chassis except the 4 × 3.5-inch (which runs Standard fans), and anything from 128 GB up is excluded under ASHRAE A3 or A4.
Unbuffered DIMMs are not supported; every module is a 1.1 V registered part.
04 — Storage
16 drive-bay layouts, up to 16 bays
Front options run from no backplane through four 3.5-inch, eight or ten 2.5-inch, to fourteen or sixteen EDSFF E3.S Gen5 bays. Two rear bays, 2.5-inch SAS/SATA or E3.S, fit with six of the nine riser configurations.
Headline layouts
front panel view
Front panel
Sixteen EDSFF E3.S Gen5 NVMe bays — the largest front the R6615 takes, with a 122.88 TB maximum in Dell’s comparison table.
SAS/SATANVMeSAS/SATA + NVMe
Controllers & boot
S160 — Software RAID. Entry tier; 'S160_NVMe' in storage matrix for NVMe direct configurations
PERC H355 — RAID. Value tier, PERC 11 (front PERC)
HBA355i — HBA. Value tier, HBA 11 internal (front PERC form factor)
HBA355e — HBA. Value tier, HBA 11 external adapter
PERC H755 — RAID. Premium Performance tier per Table 4, PERC 11 (front PERC)
PERC H755N — RAID. Premium Performance tier per Table 4, PERC 11 NVMe (front PERC); 8 x 2.5 Universal NVMe RAID and E3.S configs
BOSS-N1 — boot
All 10 controllers and 1 boot options
PERC H965i — RAID. Premium Performance tier, PERC 12 (Harpoon-based), front PERC
PERC H965e — RAID. Premium Performance tier, PERC 12 external adapter
The E3.S rows of Dell’s storage matrix print the backplane as “8xE3.S”, although the overview and chassis figures show 14 and 16 bays.
A diskless chassis must boot from BOSS-N1; in every other layout BOSS is optional.
The front PERC uses its own board connector, not a PCIe slot. The H755N and H965i give hardware RAID for NVMe on the 8 × 2.5-inch Universal backplane.
External storage covers USB tape, a NAS software stack and 12Gb MD-series JBODs.
Every documented layout
16 with drive bays
2.5-inch3.5-inchEDSFF (E1.S / E3.S)
05 — Accelerators & I/O
GPUs, PCIe and networking
The R6615 is not built as a GPU platform. Dell rates it for two single-wide 75 W cards, names no models in the guide, and its GPU thermal table adds conditions on chassis and processor. Up to two single-wide 75 W cards — no rear drives, no diskless chassis, no 400 W processors, and no 300 W processors with the 4 × 3.5-inch front.
Single-wide 75 W GPU (model not named in guide; feature table: 'Up to 2 x 75 W (SW)')
single-wide
up to 2
I/O topology
128 lanes per CPU
Genoa integrates up to 128 PCIe 5.0 lanes, and in a one-socket chassis every riser is fed by that processor. The 1U height turns them into at most three rear slots plus an OCP 3.0 bay.
Network adapters Dell lists
16 options
Adapter
Ports
Form
Broadcom 2 x 100 GbE Q56 (QSFP56) OCP 3.0
2 × 100GbE
OCP 3.0
Mellanox 2 x 100 GbE SFP56 OCP 3.0 (as printed)
2 × 100GbE
OCP 3.0
Mellanox 2 x 25 GbE SFP28 OCP 3.0
2 × 25GbE
OCP 3.0
Broadcom 4 x 25 GbE SFP28 OCP 3.0
4 × 25GbE
OCP 3.0
Broadcom 2 x 25 GbE SFP28 OCP 3.0
2 × 25GbE
OCP 3.0
Intel 2 x 25 GbE SFP28 OCP 3.0
2 × 25GbE
OCP 3.0
Intel 4 x 25 GbE SFP28 OCP 3.0
4 × 25GbE
OCP 3.0
Broadcom 4 x 10 GbE BT OCP 3.0
4 × 10GbE
OCP 3.0
Intel 2 x 10 GbE BT OCP 3.0
2 × 10GbE
OCP 3.0
Broadcom 2 x 10 GbE BT OCP 3.0
2 × 10GbE
OCP 3.0
Broadcom 4 x 1 GbE BT OCP 3.0
4 × 1GbE
OCP 3.0
Intel 4 x 1 GbE BT OCP 3.0
4 × 1GbE
OCP 3.0
Intel 4 x 1 GbE BT OCP 3.0 (duplicate row in Table 9)
4 × 1GbE
OCP 3.0
Broadcom 4 x 1 GbE BT OCP 3.0 (duplicate row in Table 9)
4 × 1GbE
OCP 3.0
Broadcom 5720 (BCM5720) 2 x 1 GbE LOM (optional)
2 × 1GbE
LOM
Management Interface Card (MIC) for Dell DPU card, 2 x 25 GbE or 2 x 100 GbE (optional; model not named)
2 × 25GbE/100GbE
PCIe
Rear drives are possible with riser configurations 1, 2, 4, 5, 7 and 8; configurations 0 (no riser), 3 and 6 leave them out.
An x16 OCP card fitted without the OCP cable runs at x8.
The LOM and an OCP card can share the chassis, but the LOM and the Management Interface Card for a Dell DPU cannot.
OCP 3.0 options span 1, 10, 25, 50 and 100 GbE, and the slot supports NC-SI and Wake-on-LAN.
06 — Power & cooling
8 power supplies, 700–1,800 W
Two hot-plug 60 mm supplies run 1+1 redundant. The eight choices start at a 700 W Titanium unit; one 1400 W Titanium model takes 277 V AC or 336 V DC high-voltage feeds, and an 1100 W unit serves −48 to −60 V DC telco power.
AC277 VAC / HVDC−48 V DC
Low-line 100–120 V input caps the 1100 W and 1400 W supplies at 1050 W each, while Dell prints N/A for low-line operation of the 700 W and 1800 W units.
Cords: C13 for the 700–1400 W AC units, C15 for 1800 W (or C13 through a C14-to-C15 jumper), APP 2006G1 for the 277 VAC / HVDC supply.
With unequal wattages at POST only the larger supply comes up and a mismatch warning appears; a supply added while running must match or stays off.
ASHRAE A3 and A4 operation needs both supplies fitted.
07 — Management, security & OS
Run it, secure it, choose the OS
Management
iDRAC9 (Express as standard on 600-series; Enterprise and Datacenter upgrades)
iDRAC Direct (front micro-USB)
iDRAC RESTful API with Redfish
iDRAC Service Module
Quick Sync 2 wireless module
OpenManage Enterprise with Power Manager, Services and Update Manager plug-ins
CloudIQ
Integrations for VMware vCenter/vROps, Microsoft System Center, Windows Admin Center, ServiceNow and Ansible
Security
AMD Secure Encrypted Virtualization (SEV) and Secure Memory Encryption (SME)
SEV-SNP (AMD Infinity Guard)
Silicon Root of Trust
Cryptographically signed firmware
Secure Boot
Secured Component Verification
Data at Rest Encryption (SEDs, local or external key management)
System Lockdown (iDRAC9 Enterprise or Datacenter)
Secure Erase
TPM 2.0 FIPS, CC-TCG certified; TPM 2.0 China NationZ
Operating systems
Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware vSAN / ESXi
Citrix XenServer
08 — Compare
R6515 → R6615 → R6715
Dell’s R6615 guide sets it against the Rome-based R6515, and the R6715 guide sets the R6615 against its EPYC 9005 successor. * The R6715 table credits the R6615 with three 75 W GPUs and three fan modules; the R6615’s own guide says two GPUs and four fan modules, which is what is shown.
The R6615 shares the SP5 socket with the two-socket 1U R6625 and the one- and two-socket 2U R7615 and R7625. The EPYC 9005 R6715 follows it, and the Xeon-based R660 fills the same height. The bars compare what Dell documents for each.
This modelSiblings and successorEach value from that model’s own verified spec file · bars scale per column
Four one-socket builds that stay within the R6615’s thermal tables. Every part below is on the R6615’s configurator list; open any build to change drives, memory or network cards.
VDI & virtualisation
Twelve-channel NVMe hypervisor
Dell names VDI and virtualisation among the R6615’s target workloads. A 32-core 240 W processor keeps the 35°C rating in the ten-bay NVMe chassis, each of the twelve channels gets a 64 GB module, and the datastore runs on ten direct-attached U.2 drives.
1 × AMD EPYC 9334 — 32 cores, 240 W
12 × 64 GB DDR5 RDIMM — 768 GB, one per channel at 4800 MT/s
The 4 × 3.5-inch front holds 80 TB of 20 TB SATA disks on an HBA355i, and two rear E3.S Gen5 drives on S160 give a fast tier for incoming backups. Sixteen cores are plenty for a repository, and the 240 W class is the only one Dell’s air table rates for this front-and-rear pairing.
1 × AMD EPYC 9124 — 16 cores, 240 W
12 × 32 GB DDR5 RDIMM — 384 GB
4 × 20 TB 7.2K SATA 3.5-inch — 80 TB raw, on the HBA355i
2 × 7.68 TB E3.S Gen5 NVMe in the rear bays, on S160
BOSS-N1 boot module (hardware RAID, 2 × M.2)
Intel 2 × 25GbE SFP28 OCP 3.0
2 × 800 W Platinum (1+1)
Canonical Ubuntu Server 24.04 LTS · ProSupport, 3 years
Dell’s air table rates this front-and-rear combination at 30°C inlet with 240 W processors and does not support 256 GB RDIMMs in it. Rear drives need riser configuration 1, 2, 4, 5, 7 or 8.
The 96-core 9654 belongs to the 400 W class, and the R6615 air table rates it at 30°C inlet only with no backplane or the 8 × 2.5-inch U.2 front. This build takes the U.2 front, fills all twelve channels and puts cluster traffic on a 100GbE OCP card.
1 × AMD EPYC 9654 — 96 cores, 400 W
12 × 64 GB DDR5 RDIMM — 768 GB
4 × 7.68 TB NVMe Gen4 U.2 — 30.72 TB raw
BOSS-N1 boot module (hardware RAID, 2 × M.2)
Broadcom 2 × 100GbE (Q56) OCP 3.0
2 × 1400 W Titanium (1+1)
Red Hat Enterprise Linux 9 · ProSupport, 3 years
Above 30°C inlet the 400 W class drops off the air-cooled list, and the 9554, 9474F, 9754 and 9684X need Direct Liquid Cooling regardless. The OCP bay reaches 100GbE only with the OCP cable fitted.
A 32-core 9374F, 1.5 TB of DDR5 and eight U.2 drives behind the H965i front PERC, which Dell’s storage matrix lists for NVMe RAID on the 8 × 2.5-inch Universal backplane. That front is also one of the two where the 9374F is rated for air cooling.
1 × AMD EPYC 9374F — 32 cores, 400 W
12 × 128 GB DDR5 RDIMM — 1.5 TB
8 × 3.84 TB NVMe Gen4 U.2 — 30.72 TB raw, hardware RAID on the PERC H965i
BOSS-N1 boot module (hardware RAID, 2 × M.2)
Broadcom 4 × 25GbE SFP28 OCP 3.0
2 × 1400 W Platinum (1+1)
Microsoft Windows Server 2025 · ProSupport, 3 years
Air cooling holds the 400 W class to 30°C inlet at most. Modules of 128 GB and above rule out ASHRAE A3 and A4 operation.
BOSS-N1 (hardware RAID, 2 × M.2, 480 or 960 GB) · internal USB
External
USB tape, NAS software stack, 12Gb MD-series JBODs
Expansion & networking
PCIe slots
Up to 3: 2 × Gen5 or 3 × Gen4 · 9 riser configurations
OCP
1 × OCP NIC 3.0 SFF, Gen4 x8 (x16 with cable): 1, 10, 25, 50 or 100 GbE
LOM
Optional 2 × 1GbE (Broadcom BCM5720)
DPU
Management Interface Card for a Dell DPU, 2 × 25 or 2 × 100 GbE (not with the LOM)
Accelerators
GPUs
Up to 2 × single-wide 75 W
Limits
No rear drives or diskless chassis · no 400 W CPUs · not in ASHRAE A3/A4
Power
Supplies
Two hot-plug 60 mm, 1+1 redundant
AC
700 W Titanium (200–240 V) · 800 W Platinum · 1100 W Titanium · 1400 W Platinum · 1400 W Titanium · 1800 W Titanium (200–240 V)
277 VAC / HVDC
1400 W Titanium, 277 VAC or 336 V DC
Telco DC
1100 W, −48 to −60 V DC
Ports & video
Front
1 × USB 2.0 · 1 × VGA · iDRAC Direct (micro-AB USB)
Rear
1 × USB 2.0 · 1 × USB 3.0 · 1 × VGA (optional with DLC) · dedicated iDRAC Ethernet · optional serial
Internal
1 × USB 3.0
Video
Matrox G200, 16 MB
Environment
ASHRAE A2
10–35°C up to 900 m · 1°C lower per 300 m above
ASHRAE A3
5–40°C · no 3.5", ten-bay 2.5", NVMe or E3.S fronts · no rear drives or GPUs · CPUs ≤ 240 W · HPR Gold fans
ASHRAE A4
5–45°C · same front, rear-drive and GPU limits as A3 · CPUs ≤ 200 W · no OCP card or BOSS-N1
Max operating altitude
3,050 m
12 — FAQ
R6615 questions, answered from the documentation
What is the maximum memory of the Dell PowerEdge R6615?
Three terabytes. The single processor has twelve DDR5 channels with one RDIMM slot each, and twelve 256 GB modules fill them. Dell quotes memory speeds of up to 6400 MT/s, but its notes clock the modules down to the 4800 MT/s the processor allows at one DIMM per channel.
Which processors does the R6615 support?
Dell’s thermal matrix lists 23 EPYC 9004 models, from 16-core parts such as the 9124 up to the 128-core 9754, grouped into 240 W, 300 W and 400 W cTDP classes. The guide has no separate processor table, so it gives no clock speeds or cache sizes.
Can the R6615 run 400 W processors on air?
Some of them, at 30°C inlet or below. The air-cooling table never rates a 400 W-class part above 30°C and marks the 9554/9554P, 9474F, 9754 and 9684X as requiring Direct Liquid Cooling. For comparison, 300 W parts keep a 35°C rating only with no backplane or the 8 × 2.5-inch U.2 front.
How many drive bays does the R6615 have?
Sixteen at most, using the 16 × EDSFF E3.S Gen5 NVMe front. A 2.5-inch build peaks at twelve — ten in front plus a rear pair of 2.5-inch or E3.S drives — and the four-bay 3.5-inch front can also take two rear E3.S drives.
How many GPUs does the R6615 support?
Two single-wide 75 W cards at most. Dell’s GPU thermal table excludes the diskless chassis, rear drives and 400 W processors, and limits 3.5-inch builds to 240 W processors at 30°C inlet. GPUs are not supported under ASHRAE A3 or A4.
How many PCIe slots does the R6615 have?
Up to three — two PCIe Gen5 or three Gen4 — across nine riser configurations, all run from the one processor. Networking adds one OCP NIC 3.0 bay, wired Gen4 x8 unless an OCP cable brings it to x16, and an optional two-port 1GbE LOM.
How big and heavy is the PowerEdge R6615?
The chassis stands 42.8 mm tall in a 482 mm width. Dell’s comparison table gives the depth as 772.13 mm with the bezel, while its dimensions table measures 736.29 mm from ear to PSU handle for the diskless chassis and 787.05 mm with 4, 8 or 10 drives, plus 35.84 mm for the bezel. Fully populated it weighs up to 20.2 kg.
How does the R6615 differ from the R6625 and R7615?
The R6625 adds a second socket in the same 1U height, doubling memory to 24 slots and 6 TB. The R7615 stays single-socket with the same 23 processors, but its 2U chassis takes up to 24 × 2.5-inch, 12 × 3.5-inch or 32 × E3.S front drives, as many as eight PCIe slots and three double-wide 300 W GPUs.
What changed in the R6715 successor?
In the R6715 guide’s comparison table, Dell moves the single socket to EPYC 9005 with up to 160 Zen5 cores, doubles the DIMM slots to 24 and raises memory speed to 5200 MT/s. The front grows to 20 E3.S drives, all three PCIe slots are Gen5, networking moves to two OCP NIC 3.0 slots, and management to iDRAC10.
Is the Dell PowerEdge R6615 end of life?
The R6615 technical guide does not state an end-of-sale or end-of-service date for the model. Dell’s service appendix in it offers Post Standard Support, adding as many as five years of hardware coverage once the first seven years of ProSupport run out. For dated notices as they appear, use our end-of-life checker.
Specifications are extracted from Dell’s published documents and independently re-checked line by line. Configurations are quote-based; availability and exact options are confirmed at quotation. Last reviewed 2026-09-11.
