The R660 is Dell’s 1U two-socket server for 4th and 5th Gen Intel Xeon Scalable, carrying the same 51-processor list and 32 DDR5 slots as the 2U R760 in less than half the height. This page maps everything Dell documents for it, and where the 1U chassis draws its lines: drive bays, PCIe slots, GPUs and the cooling rules for 300 W and 350 W processors.
1U Rack1 or 2 socketsXeon Max (HBM)4th Gen Xeon Scalable5th Gen Xeon ScalableiDRAC9
Our read of Dell’s documentation: where the R660 is strong, and the limits worth knowing before you spec one.
Strengths
+The same 51 processors and 32 DDR5 slots as the 2U R760 in a 1U chassis, with up to 64 cores per socket and 8 TB of memory.
+EDSFF E3.S Gen5 layouts put 16 NVMe bays in one rack unit, where the R650 stopped at ten 2.5-inch front bays.
+Eight power supply options, from 700 W to 1800 W AC, plus −48 to −60 V DC and 277 VAC / 336 V HVDC units.
+NEBS Level 3 and ETSI validation for a defined parts list, aimed at communications service providers’ telecom sites.
+Direct Liquid Cooling is optional, and Dell’s main air-cooling matrix names it as the route for 350 W parts in the denser drive layouts.
Watch-outs
!Air-cooled 350 W processors are limited to the no-backplane and 8 × 2.5-inch fronts at 30°C inlet; the 9480, 9470, 8470Q and 6458Q need liquid cooling in every layout.
!No 3.5-inch drives at all — the R650’s 4 × 3.5-inch option did not carry over — and 2.5-inch storage tops out at ten front plus two rear bays.
!Three PCIe slots at most, only two of them Gen5, and rear drives work with just two riser configurations.
!GPUs stop at three single-wide 75 W cards, and three L4s bring processor TDP caps with them.
!At 822.88 mm with the bezel it is 50.77 mm deeper than the R650, so check rack depth before a like-for-like swap.
Processors51 SKUs
Cores / CPU8–64
DIMM slots32
Drive layouts13
Max bays16
GPUsup to 3
PSU options8 · to 1,800 W
02 — Processors
51 supported processors, mapped
Dell lists 51 processors for the R660: 37 4th Gen Xeon Scalable and Xeon Max parts and 14 5th Gen parts. The chart plots each by cores and TDP. The list is identical to the R760’s, but in 1U the drive layout and cooling decide which of them a given chassis can actually run, so read the thermal notes before choosing anything above 250 W.
Processor landscape — cores × TDP
51 SKUs · 3 families
Xeon Max (HBM) 44th Gen Xeon Scalable 335th Gen Xeon Scalable 14Bubble size = L3 cache · hover a bubble for the full SKU
Processor explorer
filter · sort · compare
Processor
Cores / threads
Base
L3 cache
TDP
W / core
Memory
Intel Xeon Platinum 8592+
64 / 128
1.9 GHz
320 MB
350 W
5.5
DDR5-5600
Intel Xeon Platinum 8580
60 / 120
2 GHz
300 MB
350 W
5.8
DDR5-5600
Intel Xeon Max 9480 *
56 / 112
1.9 GHz
113 MB
350 W
6.3
DDR5-4800
Intel Xeon Platinum 8480+
56 / 112
2 GHz
105 MB
350 W
6.3
DDR5-4800
Intel Xeon Max 9470 *
52 / 104
2 GHz
105 MB
350 W
6.7
DDR5-4800
Intel Xeon Platinum 8470Q *
52 / 104
2.1 GHz
105 MB
350 W
6.7
DDR5-4800
Intel Xeon Platinum 8470
52 / 104
2 GHz
105 MB
350 W
6.7
DDR5-4800
Intel Xeon Platinum 8471N
52 / 104
1.8 GHz
98 MB
300 W
5.8
DDR5-4800
Intel Xeon Platinum 8470N
52 / 104
1.7 GHz
98 MB
300 W
5.8
DDR5-4800
Intel Xeon Platinum 8468
48 / 96
2.1 GHz
105 MB
350 W
7.3
DDR5-4800
Intel Xeon Platinum 8568Y+
48 / 96
2.3 GHz
300 MB
350 W
7.3
DDR5-5600
Intel Xeon Platinum 8558U
48 / 96
2 GHz
260 MB
300 W
6.3
DDR5-4800
Intel Xeon Max 9460
40 / 80
2.2 GHz
98 MB
350 W
8.8
DDR5-4800
Intel Xeon Platinum 8460Y+
40 / 80
2 GHz
105 MB
300 W
7.5
DDR5-4800
Intel Xeon Platinum 8452Y
36 / 72
2 GHz
68 MB
300 W
8.3
DDR5-4800
Intel Xeon Max 9462
32 / 64
2.7 GHz
75 MB
350 W
10.9
DDR5-4800
Intel Xeon Gold 6458Q *
32 / 64
3.1 GHz
60 MB
350 W
10.9
DDR5-4800
Intel Xeon Platinum 8462Y+
32 / 64
2.8 GHz
60 MB
300 W
9.4
DDR5-4800
Intel Xeon Gold 6454S
32 / 64
2.2 GHz
60 MB
270 W
8.4
DDR5-4800
Intel Xeon Gold 6430
32 / 64
2.1 GHz
60 MB
270 W
8.4
DDR5-4800
Intel Xeon Gold 6414U
32 / 64
2 GHz
60 MB
250 W
7.8
DDR5-4800
Intel Xeon Gold 6448Y
32 / 64
2.2 GHz
60 MB
225 W
7.0
DDR5-4800
Intel Xeon Gold 6438Y+
32 / 64
2 GHz
60 MB
205 W
6.4
DDR5-4800
Intel Xeon Gold 6438N
32 / 64
2 GHz
60 MB
205 W
6.4
DDR5-4800
Intel Xeon Gold 6438M
32 / 64
2.2 GHz
60 MB
205 W
6.4
DDR5-4800
Intel Xeon Gold 6428N
32 / 64
1.8 GHz
60 MB
185 W
5.8
DDR5-4800
Intel Xeon Gold 6421N
32 / 64
1.8 GHz
60 MB
185 W
5.8
DDR5-4800
Intel Xeon Platinum 8562Y+
32 / 64
2.8 GHz
60 MB
300 W
9.4
DDR5-5600
Intel Xeon Gold 6548N
32 / 64
2.8 GHz
60 MB
250 W
7.8
DDR5-5200
Intel Xeon Gold 6548Y+
32 / 64
2.5 GHz
60 MB
250 W
7.8
DDR5-5200
Intel Xeon Gold 5420+
28 / 56
2 GHz
53 MB
205 W
7.3
DDR5-4400
Intel Xeon Gold 5512U
28 / 56
2.1 GHz
52.5 MB
185 W
6.6
DDR5-4800
Intel Xeon Gold 6442Y
24 / 48
2.6 GHz
60 MB
225 W
9.4
DDR5-4800
Intel Xeon Gold 5418Y
24 / 48
2 GHz
45 MB
185 W
7.7
DDR5-4400
Intel Xeon Gold 5412U
24 / 48
2.1 GHz
45 MB
185 W
7.7
DDR5-4400
Intel Xeon Gold 5418N
24 / 48
1.8 GHz
45 MB
165 W
6.9
DDR5-4400
Intel Xeon Gold 5411N
24 / 48
1.9 GHz
45 MB
165 W
6.9
DDR5-4400
Intel Xeon Gold 6542Y
24 / 48
2.9 GHz
60 MB
250 W
10.4
DDR5-5200
Intel Xeon Silver 4416+
20 / 40
2 GHz
38 MB
165 W
8.3
DDR5-4000
Intel Xeon Gold 6444Y
16 / 32
3.5 GHz
45 MB
270 W
16.9
DDR5-4800
Intel Xeon Gold 6426Y
16 / 32
2.6 GHz
38 MB
185 W
11.6
DDR5-4800
Intel Xeon Gold 5416S
16 / 32
2 GHz
30 MB
150 W
9.4
DDR5-4400
Intel Xeon Gold 6526Y
16 / 32
2.8 GHz
37.5 MB
195 W
12.2
DDR5-5200
Intel Xeon Silver 4514Y
16 / 32
2 GHz
30 MB
150 W
9.4
DDR5-4400
Intel Xeon Silver 4410Y
12 / 24
2 GHz
30 MB
150 W
12.5
DDR5-4000
Intel Xeon Silver 4510
12 / 24
2.4 GHz
30 MB
150 W
12.5
DDR5-4400
Intel Xeon Gold 6434
8 / 16
3.7 GHz
23 MB
205 W
25.6
DDR5-4800
Intel Xeon Gold 5415+
8 / 16
2.9 GHz
23 MB
150 W
18.8
DDR5-4400
Intel Xeon Bronze 3408U
8 / 16
1.8 GHz
23 MB
125 W
15.6
DDR5-4000
Intel Xeon Gold 6534
8 / 16
3.9 GHz
22.5 MB
195 W
24.4
DDR5-4800
Intel Xeon Silver 4509Y
8 / 16
2.6 GHz
23 MB
125 W
15.6
DDR5-4400
Every processor of 250 W or more is marked for the MAX system board; everything below 250 W is marked for the Mainstream (MS) board.
Processors above 185 W take the L-type heat sink; 185 W and below use the standard heat sink.
Four 350 W SKUs — 9480, 9470, 8470Q and 6458Q — have no air-cooled option; Dell supports them with Direct Liquid Cooling only.
Dell prints N/A in the UPI column for the 8558U and 5512U, and marks turbo only as yes or no, so no turbo clocks are shown.
03 — Memory
32 DIMM slots, 16 per processor
Thirty-two DDR5 ECC RDIMM slots flank the two sockets, 16 per processor. Every configuration drops to 4400 MT/s at two DIMMs per channel, so capacity beyond one DIMM per channel costs bandwidth.
Capacity with every slot filled
by DIMM size
Operating speed
per Dell memory tables
Processor
1 DIMM / channel
2 DIMMs / channel
4th Gen Xeon Scalable / Xeon Max
4800 MT/s
4400 MT/s
5th Gen Xeon Scalable
6400 / 5600 MT/s*
4400 MT/s
* These are the rated speeds of the DIMMs Dell lists for 5th Gen. Dell’s processor table has only four of the fourteen 5th Gen SKUs running memory at 5600 MT/s (the rest 4400–5200 MT/s), and the R670 guide gives the R660 as up to 5600 MT/s.
8 TB means 32 × 256 GB. Dell lists the 256 GB module only as an eight-rank 4800 MT/s RDIMM; its 6400/5600 MT/s DIMMs stop at 128 GB, which is 4 TB across 32 slots.
In the ten-bay 2.5-inch layouts, 256 GB RDIMMs lower the inlet ceiling to 30°C once processors exceed 250 W (225 W with rear drives).
RDIMMs of 128 GB and above are not supported in ASHRAE A3 or A4 conditions, and quad-rank 128 GB modules have reached end of life.
Unused DIMM slots need blanks when a processor uses the standard heat sink or is rated 250 W or higher.
04 — Storage
13 drive-bay layouts, up to 16 bays
Fourteen internal layouts, from a diskless chassis to sixteen EDSFF E3.S bays. There is no 3.5-inch option, and the front layout you choose also sets the thermal limits for processors, 256 GB memory and three-L4 GPU builds — the 8-bay front is the only drive layout that keeps 350 W parts on air.
Headline layouts
front panel view
Front panel
Rear module
The 2.5-inch maximum: ten front and two rear bays, built either all SAS4/SATA or all NVMe. Rear bays need the R3P or R2S+R3S riser layout.
SAS/SATANVMeSAS/SATA + NVMe
Controllers & boot
S160 — Software RAID. Entry tier (OS RAID)
PERC H355 — RAID. Value tier, PERC 11 (replaces H345 from Dec 2021)
HBA355i — HBA. Value tier, HBA 11 internal
HBA355e — HBA. Value tier, HBA 11 external
HBA465i — HBA. Value tier, HBA 12 internal (printed as HB465i in Table 8)
HBA465e — HBA. Value tier, HBA 12 external; available post-RTS
PERC H755 — RAID. Value Performance tier, PERC 11 (front PERC)
PERC H755N — RAID. Value Performance tier, PERC 11 NVMe
BOSS-N1 — boot
All 10 controllers and 1 boot options
PERC H965i — RAID, 8GB cache. Premium Performance tier, PERC 12 (Avenger), 8 GB DDR4 3200 MT/s cache, front PERC/adapter
PERC H965e — RAID, 8GB cache. Premium Performance tier, PERC 12 external, 8 GB DDR4 cache
E3.S drives, like the HBA465e, are listed as supported after the initial release (post-RTS).
Universal layouts give SAS/SATA drives hardware RAID; NVMe drives in those slots are direct-attached with no hardware RAID.
The front PERC mounts on the storage module rather than in a PCIe slot; the H965i carries 8 GB of DDR4 cache.
BOSS-N1 mirrors two M.2 NVMe drives (480 GB or 960 GB) in hardware RAID 1 for the operating system. It, rear drives and 2.5-inch NVMe are not supported in ASHRAE A4 conditions.
Every documented layout
13 with drive bays
2.5-inch3.5-inchEDSFF (E1.S / E3.S)
05 — Accelerators & I/O
GPUs, PCIe and networking
Single-wide cards only. Dell names two GPUs for the R660, the NVIDIA A2 and L4, rates the chassis for up to three 75 W cards, and offers no double-wide option; the 2U R760, by comparison, takes two double-wide cards at 350 W. Up to three single-wide 75 W cards; with three L4s, processor TDP is capped at 270 W, 225 W or 205 W depending on the drive layout.
NVIDIA A2
single-wide
up to 3
NVIDIA L4
single-wide
up to 3
I/O topology
80 lanes per CPU
Each processor supplies 80 lanes of PCIe 5.0, but the R660 exposes at most three slots at the rear. Dell documents eleven riser configurations, including running with no riser at all.
Network adapters Dell lists
26 options
Adapter
Ports
Form
Broadcom 2 x 100 GbE QSFP56 OCP 3.0
2 × 100GbE
OCP 3.0
Mellanox 2 x 100 GbE QSFP56 OCP 3.0
2 × 100GbE
OCP 3.0
Intel 4 x 25 GbE SFP28 OCP 3.0
4 × 25GbE
OCP 3.0
Broadcom 4 x 25 GbE SFP28 OCP 3.0
4 × 25GbE
OCP 3.0
Intel 2 x 25 GbE SFP28 OCP 3.0
2 × 25GbE
OCP 3.0
Broadcom 2 x 25 GbE SFP28 OCP 3.0
2 × 25GbE
OCP 3.0
Mellanox 2 x 25 GbE SFP28 OCP 3.0
2 × 25GbE
OCP 3.0
Broadcom 4 x 10 GbE BT OCP 3.0
4 × 10GbE
OCP 3.0
Intel 2 x 10 GbE BT OCP 3.0
2 × 10GbE
OCP 3.0
Intel 4 x 10 GbE BT OCP 3.0
4 × 10GbE
OCP 3.0
Broadcom 2 x 10 GbE BT OCP 3.0
2 × 10GbE
OCP 3.0
Broadcom 4 x 1 GbE BT OCP 3.0
4 × 1GbE
OCP 3.0
Intel 4 x 1 GbE BT OCP 3.0
4 × 1GbE
OCP 3.0
Broadcom 5720 (BCM5720) 2 x 1 GbE LOM (optional)
2 × 1GbE
LOM
Intel Ethernet 100G 2P E810-C Adapter (FH and LP)
2 × 100GbE
PCIe
Broadcom NetXtreme-E P2100D BCM57508 2 x 100G QSFP PCIe (LP)
2 × 100GbE
PCIe
Mellanox ConnectX-6 Dx Dual Port 100 GbE QSFP56 PCIe Adapter (FH and LP)
Intel E810-XXVDA4 Quad Port 10/25GbE SFP28 Adapter (FH)
4 × 25GbE
PCIe
Intel Ethernet 25G 4P E810-XXV OCP
4 × 25GbE
OCP 3.0
Broadcom BCM57414 25G SFP Dual Port OCP3 Mezz
2 × 25GbE
OCP 3.0
Processor-to-processor traffic uses up to four UPI links per socket: 16 GT/s on 4th Gen parts, 20 GT/s on most 5th Gen parts.
The OCP slot is wired x8 on the system board, so an x16 card falls back to x8 unless an OCP cable is fitted — possible only on the MAX board, and restricted where the storage configuration already uses the connectors involved.
Riser configurations R2R+R3R and R2A are single-processor layouts, and rear drive bays are possible only with R3P or R2S+R3S; Dell’s rear view of the 2 × 2.5-inch option shows a single low-profile slot left.
LOM plus OCP is a permitted pairing, but the LOM excludes the optional Management Interface Card used with a Dell DPU.
06 — Power & cooling
8 power supplies, 700–1,800 W
Up to two hot-plug supplies in Dell’s 60 mm form factor, running 1+1 redundant. The eight options cover standard and high-line-only AC, 277 VAC and 336 V HVDC, and −48 to −60 V DC (the 1100 W DC unit is on Dell’s NEBS parts list).
AC277 VAC / HVDC−48 V DC
At 100–120 V the 1100 W Titanium and 1400 W Platinum supplies deliver 1050 W; the 700 W and 1800 W units have no low-line rating and need 200–240 V AC or 240 V DC.
The 1800 W supply takes a C15 lead (or C13 with a C14-to-C15 jumper), and the 277 VAC / HVDC unit an APP 2006G1 cord; the other AC supplies use C13.
Fit matching supplies: with two different wattages at POST, only the larger is enabled and a mismatch warning appears, and a supply added at run-time must match the first or it stays disabled.
ASHRAE A3 and A4 operation needs both supplies installed.
07 — Management, security & OS
Run it, secure it, choose the OS
Management
iDRAC9 with Lifecycle Controller (Express as standard on 600-series; Enterprise and Datacenter upgrades)
iDRAC Direct (front micro-USB)
iDRAC RESTful API with Redfish
iDRAC Service Module
Quick Sync 2 wireless module
OpenManage Enterprise with Power Manager, Service and Update Manager plugins
CloudIQ for PowerEdge
OpenManage integrations for VMware vCenter, Microsoft System Center and Windows Admin Center
Data at Rest Encryption (SEDs, local or external key management)
System Lockdown (iDRAC9 Enterprise or Datacenter)
Secure Erase
TPM 2.0 FIPS, CC-TCG certified; TPM 2.0 China NationZ
Operating systems
Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi
08 — Compare
R650 → R660 → R670
The R660 between the previous-generation R650 and the Xeon 6 R670 that Dell compares it with. Every cell comes from Dell’s R660 and R670 technical guides, mostly their comparison tables.
2 × 4th Gen Xeon Scalable or Xeon Max (to 56 cores) · 2 × 5th Gen (to 64 cores)
2 × Intel Xeon 6 — up to 86 P-cores or 144 E-cores
Memory
32 × DDR4 · RDIMM 2 TB or LRDIMM 8 TB · up to 3200 MT/s · 16 × PMem 200
32 × DDR5 RDIMM · 8 TB · up to 5600 MT/s
32 × DDR5 RDIMM · up to 6400 MT/s
Front bays
Up to 4 × 3.5" or 10 × 2.5" SAS/SATA/NVMe
8 or 10 × 2.5" SAS/SATA/NVMe · 14 or 16 × E3.S Gen5
Up to 20 × E3.S NVMe · 8 or 10 × 2.5"
Rear bays
2 × 2.5" SAS4/SATA
2 × 2.5" SAS4/SATA or 2 × E3.S
2 × E3.S NVMe
PCIe
3 × Gen4
2 × Gen5 or 3 × Gen4
3 × x16 Gen5
Accelerators
Up to 3 × 75 W single-wide
Up to 3 × 75 W single-wide
Up to 3 × 75 W single-width
Networking
Optional 2 × 1GbE LOM · 1 × OCP 3.0
Optional 2 × 1GbE LOM · 1 × OCP 3.0
2 × OCP NIC 3.0, front or rear
Power
800–1400 W AC · 1100 W −48 V DC
700–1800 W AC · 800 / 1100 W −48 V DC · 1400 W 277 VAC / HVDC
800–1500 W · 1400 W −48 V DC · 1800 W HLAC and 1500 W 277 V / HVDC not at launch
Depth (with bezel)
772.11 mm
822.88 mm
816.92 mm (rear-I/O build)
Weight
—
22.51 kg
20.42 kg
Management
iDRAC9
iDRAC9
iDRAC10
Source: Dell PowerEdge R660 Technical Guide, Table 2 (R660 vs R650); Dell PowerEdge R670 Technical Guide (Rev. A07), Table 2 (R670 vs R660) and its iDRAC chapter.
The R660 family side by side
Around the R660 sit the pared-back R660xs, two AMD EPYC 1U machines (the two-socket R6625 and single-socket R6615), the 2U R760 on the same Xeon processors, and the Xeon 6 R670. The bars compare the limits documented for each.
This modelSiblings and successorEach value from that model’s own verified spec file · bars scale per column
Five 1U builds that stay inside the thermal rules Dell documents for the R660. Each uses only parts the configurator allows on this model and opens pre-filled, ready to change.
Virtualisation
Ten-bay NVMe hypervisor host
The R660’s core job: two 32-core 5th Gen processors, a terabyte of DDR5 and ten direct-attached NVMe drives for software-defined storage or a local datastore, with the boot mirror on BOSS-N1 instead of a front bay. At 250 W these processors are rated for 35°C inlet on air in the ten-bay chassis.
2 × Xeon Gold 6548Y+ — 32 cores @ 2.5 GHz, 250 W each
16 × 64 GB DDR5-6400 RDIMM — 1 TB (runs at up to 5200 MT/s with this processor)
Sixteen cores per socket at a 3.5 GHz base keep the licensable core count modest, and eight SAS SSDs sit behind the H965i front PERC and its 8 GB cache. At 270 W the 6444Y calls for High-performance Gold fans, which the 8 × 2.5-inch chassis supports at up to 35°C.
2 × Xeon Gold 6444Y — 16 cores @ 3.5 GHz, 270 W each
16 × 64 GB DDR5-4800 RDIMM — 1 TB
8 × 3.84 TB SAS SSD, read intensive — 30.72 TB raw
Three single-wide NVIDIA L4 cards fill all three low-profile slots, so the network uplink moves to the OCP bay. The 8 × 2.5-inch front keeps the highest processor ceiling Dell allows with three L4s, 270 W, which the 250 W 6542Y sits under.
2 × Xeon Gold 6542Y — 24 cores @ 2.9 GHz, 250 W each
3 × NVIDIA L4 (single-wide, 75 W class)
16 × 32 GB DDR5-6400 RDIMM — 512 GB
4 × 7.68 TB NVMe Gen4 U.2 — 30.72 TB raw
BOSS-N1 boot mirror (2 × 480 GB M.2 NVMe, RAID 1)
Intel 2 × 25GbE SFP28 OCP 3.0
2 × 1400 W Platinum (1+1)
With three L4s Dell caps processor TDP at 270 W in this layout, 225 W with ten 2.5-inch or 16 E3.S bays, and as low as 205 W once rear drives are added. GPUs are not supported in ASHRAE A3 or A4 environments.
Dell validates the R660 to NEBS Level 3 and ETSI, for −5°C to 40°C continuous operation with 96-hour excursions to 55°C. This build uses parts on that list — the 185 W 6428N, the PERC H755 and SATA SSDs — and runs from the 1100 W −48 to −60 V DC supplies.
2 × Xeon Gold 6428N — 32 cores @ 1.8 GHz, 185 W each
16 × 32 GB DDR5-4800 RDIMM — 512 GB
4 × 1.92 TB SATA SSD on the ten-bay SAS/SATA backplane
PERC H755 hardware RAID
Intel 4 × 25GbE SFP28 OCP 3.0
2 × 1100 W −48 to −60 V DC (1+1)
NEBS Level 3 covers a defined configuration: processors up to 185 W, the listed controllers and cards, HPR Gold fans and a filtered bezel. Two-post telco racks need Dell’s A14 static rails. Check each part against Dell’s NEBS list before ordering.
Two 64-core 8592+ processors put 128 cores in a single U. Dell’s 5th Gen thermal table allows 350 W parts on air only with the no-backplane or 8 × 2.5-inch front and inlet air at 30°C or below, so this build uses the eight-bay front with four NVMe drives and a 100GbE adapter for cluster traffic.
2 × Xeon Platinum 8592+ — 64 cores @ 1.9 GHz, 350 W each
16 × 64 GB DDR5-6400 RDIMM — 1 TB (runs at up to 5600 MT/s with this processor)
Above 30°C inlet, or with the ten-bay or E3.S fronts, 350 W 5th Gen parts are not listed for air cooling. Empty DIMM slots need blanks at 250 W and above, and the 1800 W supply needs a C15 lead, or a C13 lead with a C14-to-C15 jumper.
42.8 × 482 × 822.88 mm with bezel · 809.04 mm deep without
Weight
Up to 22.51 kg with drives fully populated · 18.5 kg without drives and PSUs
Cooling
Air, or optional Direct Liquid Cooling (needs rack manifolds and a CDU)
Fans
Up to four hot-plug dual-fan modules — Standard or High-performance Gold · N+1 fan redundancy
Bezel
Optional LCD bezel or security bezel
Rails
A15 ReadyRails II or A16 Stab-in/Drop-in sliding rails · A14 static rails (required for 2-post racks) · optional CMA (not with DLC) or strain relief bar
Processor
Sockets
One or two
Families
4th Gen Intel Xeon Scalable, Intel Xeon Max, 5th Gen Intel Xeon Scalable
Cores per processor
Up to 56 (4th Gen / Xeon Max) · up to 64 (5th Gen)
Maximum TDP
350 W
UPI
Up to 4 links per processor · up to 16 GT/s (4th Gen) or 20 GT/s (5th Gen)
BOSS-N1: hardware RAID 1, 2 × M.2 NVMe (480 or 960 GB) · internal USB
External
USB tape, NAS software stack, 12Gb MD-series JBODs
Expansion & networking
PCIe slots
Up to three: 2 × Gen5 or 3 × Gen4 · 11 riser configurations including no riser
OCP
1 × OCP NIC 3.0 (SFF, Gen4): 4 × 1GbE, 2 or 4 × 10GbE, 2 or 4 × 25GbE, 2 × 100GbE
LOM
Optional 2 × 1GbE (Broadcom BCM5720)
DPU
Optional Management Interface Card for a Dell DPU (not together with the LOM)
Accelerators
GPU envelope
Up to 3 × single-wide 75 W — NVIDIA A2 or NVIDIA L4
Restrictions
Not supported in ASHRAE A3/A4 · processor TDP caps with three L4s
Power
Supplies
Up to two hot-plug, 1+1 redundant, 60 mm form factor
AC options
700 W Titanium (200–240 V) · 800 W Platinum · 1100 W Titanium · 1400 W Platinum · 1800 W Titanium (200–240 V)
277 VAC / HVDC
1400 W Titanium, 277 VAC or 336 V DC
DC input
800 W and 1100 W, −48 to −60 V DC
Ports & video
Front
1 × USB 2.0 · 1 × VGA · 1 × iDRAC Direct (micro-USB)
Rear
1 × USB 2.0 · 1 × USB 3.1 · 1 × VGA (optional with DLC) · 1 × dedicated iDRAC Ethernet · optional serial
Internal
1 × USB 3.0 (optional)
Video
Integrated Matrox G200, 16 MB
Environment
ASHRAE A2
10–35°C below 900 m, de-rated 1°C per 300 m above
ASHRAE A3 / A4
5–40°C with configuration restrictions
NEBS Level 3 / ETSI
−5 to 40°C continuous · 96-hour excursions to 55°C (validated configuration)
12 — FAQ
R660 questions, answered from the documentation
What is the maximum memory of the Dell PowerEdge R660?
The R660 has 32 DDR5 RDIMM slots, 16 per processor, and reaches 8 TB with 32 × 256 GB modules. Dell lists the 256 GB module only as a 4800 MT/s part; the 6400/5600 MT/s modules it lists for 5th Gen Xeon go up to 128 GB, or 4 TB across all 32 slots.
Which processors does the R660 support?
Fifty-one in total. Thirty-seven come from Dell’s 4th Gen table (including four Xeon Max parts) and fourteen are 5th Gen Xeon Scalable. Core counts run from 8 to 64 and TDP from 125 W up to 350 W. Anything rated 250 W or higher sits on the MAX system board, and four SKUs — 9480, 9470, 8470Q and 6458Q — are liquid-cooled only.
Can the R660 run 350 W processors with air cooling?
Only with two front configurations. Dell’s thermal tables allow air-cooled 350 W processors with no drive backplane or with the 8 × 2.5-inch front, and then only at an inlet temperature of 30°C or less. Dell’s main air-cooling matrix marks the ten-bay and E3.S layouts as needing Direct Liquid Cooling at 350 W, and its separate 5th Gen table lists no 350 W air support in them.
How many drive bays does the R660 have?
Up to 16: either 16 EDSFF E3.S Gen5 NVMe bays at the front, or 14 at the front plus two at the rear. With 2.5-inch drives the maximum is ten at the front and two at the rear. There is no 3.5-inch option.
How many GPUs does the R660 support?
Up to three single-wide 75 W cards, and Dell names the NVIDIA A2 and L4. With three L4s, processor TDP is limited to 270 W with no backplane or the 8 × 2.5-inch front, and to 225 W or 205 W in the larger layouts. There is no double-wide GPU option in this chassis.
How many PCIe slots does the R660 have?
Up to three: two at PCIe Gen5 or three at Gen4, depending on the riser configuration. Each processor provides 80 lanes of PCIe 5.0, and there is one OCP NIC 3.0 slot (Gen4, x8, or x16 with a cable on the MAX system board) plus an optional 2 × 1GbE LOM.
How big and heavy is the PowerEdge R660?
It is 42.8 mm high, 482 mm wide and 822.88 mm deep with the bezel, or 809.04 mm without it. A system with every drive bay filled weighs up to 22.51 kg; without drives and power supplies it is 18.5 kg.
How does the R660 differ from the R760 and R660xs?
The 2U R760 takes the same 51 processors and 32 DDR5 slots but offers up to 28 drive bays and 12 × 3.5-inch layouts, up to eight PCIe slots, double-wide GPUs and supplies up to 3200 W. The R660xs is the pared-back 1U sibling, with 16 DIMM slots and 1.5 TB, processors of up to 32 cores (4th Gen) or 28 (5th Gen), and a 4 × 3.5-inch layout the R660 does not offer. The R660 keeps full core counts and memory capacity in 1U.
What changed from the R660 to the R670?
The R670 is Dell’s 1U Xeon 6 server, and its technical guide compares it directly with the R660. Per socket it offers 86 P-cores or 144 E-cores, memory reaches 6400 MT/s (the R660 tops out at 5600), and the front takes as many as 20 E3.S drives. It also brings three x16 Gen5 slots, two OCP NIC 3.0 slots and iDRAC10, while GPU support is unchanged at three 75 W single-width cards.
Is the Dell PowerEdge R660 end of life?
Dell’s R660 technical guide does not give a model-wide end-of-sale or end-of-service date. Its service appendix describes Post Standard Support, which extends hardware cover by up to five years beyond an initial seven years of ProSupport. Our end-of-life checker tracks dates as Dell publishes them.
Specifications are extracted from Dell’s published documents and independently re-checked line by line. Configurations are quote-based; availability and exact options are confirmed at quotation. Last reviewed 2026-09-11.