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Technical data sheet · PowerEdge Xeon 6 6900-series · 2U dual-socket

Dell PowerEdge R770APSpecifications, configurations & comparisons

The R770AP is the 2U PowerEdge for Intel’s Xeon 6 6900-series: up to 128 P-cores per socket, twelve memory channels and 96 PCIe lanes per processor, in a chassis that drops GPUs and SATA to concentrate on compute, memory bandwidth and NVMe. This page covers every option Dell lists for it, and the points on which it departs from the standard R770.

2U Rack2 socketsXeon 6 6900PiDRAC10
128P-cores per CPU256 per server · Xeon 6980P
3TBDDR5 maximum24 × 128 GB at 6400 MT/s
32E3.S NVMe baysor 16 × 2.5" Gen5 NVMe
96PCIe 5.0 lanesper processor · 5 x16 slots
12memory channelsper processor · 1 DIMM each
3,200Wlargest PSUTitanium · 5 options
Configure an R770AP →Get a UK quoteRefurbished alternatives ↓

Every figure checked against the Dell PowerEdge R770AP Technical Guide (May 2026)

Dell PowerEdge R770AP front view with 32 EDSFF E3.S NVMe bays in four groups of eight around a blank centre panel123
  1. 1EDSFF E3.S NVMe bays (32 in total)
  2. 2Blank centre panel in the 32-bay build
  3. 3Right control panel: power, system ID and USB Type-C

Image: Dell Technologies

Form factor
2U Rack · 2 sockets
Processors
Xeon 6 6900P
Memory
24 × DDR5 RDIMM · up to 3 TB
Drive bays
Up to 32 · 4 drive-bay layouts
Expansion
5 × PCIe · 2 × OCP 3.0
Boot
BOSS-N1 DC-MHS (optional, rear)
Management
iDRAC10
01 — Overview

The R770AP at a glance

Our read of Dell’s documentation: where the R770AP is strong, and the limits worth knowing before you spec one.

Strengths

  • Up to 128 P-cores and 504 MB of cache per socket, with 72- and 96-core parts for workloads that favour clock speed over core count.
  • Twelve DDR5 channels per processor at 6400 MT/s, with each of the 24 slots on a channel of its own.
  • All-NVMe storage on PCIe Gen5 — 32 E3.S bays or 16 × 2.5-inch drives — with the H975i adding hardware RAID on the 16-bay x2 layout.
  • Five x16 Gen5 slots plus two OCP 3.0 bays; Dell’s OCP feature table allows cards of up to 80 W and 400 GbE, although its current card list stops at 200GbE.
  • Every processor is air-cooled in every storage layout, on HPR Gold fans for the 400 W 6952P and HPR Platinum fans for the 500 W parts.

Watch-outs

  • Memory stops at 3 TB (24 × 128 GB), well short of the standard R770’s 8 TB, and there is no two-DIMMs-per-channel option.
  • No GPUs of any kind: Dell’s spec sheet gives GPU options as N/A.
  • NVMe only — no SATA or SAS drives, no rear drive bays, no external storage controllers and no software RAID.
  • VMware ESXi and vSAN were marked as unavailable at launch, as were Gen4 U.2 drives and the smaller Gen5 U.2 capacities.
  • It runs loud even at idle: Dell’s quietest tested build measures 6.7 B sound power at 25°C against 4.7 B for the R770, and Dell notes idle fan speed usually won’t drop without a configuration change.
Processors5 SKUs
Cores / CPU72–128
DIMM slots24
Drive layouts4
Max bays32
PSU options5 · to 3,200 W
02 — Processors

5 supported processors, mapped

Five Xeon 6 6900-series P-core processors, each with two threads per core: the 400 W 6952P and four 500 W parts from 72 to 128 cores. They use Intel’s BR1A socket with 7529 pins, and none of the five appears in the R770 or R670 processor lists. The chart plots each by cores and power.

Processor landscape — cores × TDP

5 SKUs · 1 family
Dell PowerEdge R770AP: every supported processor by cores and TDP081624324048566472808896104112120128400 W450 W500 WCores per processorIntel Xeon 6 6980P — 128 cores / 256 threads · 500 W · 2 GHz base · 504 MB cache · DDR5-6400Intel Xeon 6 6978P — 120 cores / 240 threads · 500 W · 2.1 GHz base · 504 MB cache · DDR5-6400Intel Xeon 6 6972P — 96 cores / 192 threads · 500 W · 2.4 GHz base · 480 MB cache · DDR5-6400Intel Xeon 6 6952P — 96 cores / 192 threads · 400 W · 2.1 GHz base · 480 MB cache · DDR5-6400Intel Xeon 6 6960P — 72 cores / 144 threads · 500 W · 2.7 GHz base · 432 MB cache · DDR5-64006 6980P128 cores · 3.9 W/core — top SKU and most efficient
Xeon 6 6900P 5Bubble size = L3 cache · hover a bubble for the full SKU

Processor explorer

filter · sort · compare
ProcessorCores / threadsBaseL3 cacheTDPW / coreMemory
Intel Xeon 6 6980P128 / 2562 GHz504 MB500 W3.9DDR5-6400
Intel Xeon 6 6978P120 / 2402.1 GHz504 MB500 W4.2DDR5-6400
Intel Xeon 6 6972P96 / 1922.4 GHz480 MB500 W5.2DDR5-6400
Intel Xeon 6 6952P96 / 1922.1 GHz480 MB400 W4.2DDR5-6400
Intel Xeon 6 6960P72 / 1442.7 GHz432 MB500 W6.9DDR5-6400
  • Four SKUs list a 3.9 GHz turbo alongside their base clock; the 6978P row gives only its 2.1 GHz base.
  • The processor table quotes 4 TB of memory per processor, but this chassis holds 12 × 128 GB per socket, so 1.5 TB per socket is the practical ceiling.
  • The two sockets are linked by up to six UPI 2.0 links, listed at 24 GT/s.
  • Processors cannot be mixed, and both riser configurations Dell lists require two of them.
03 — Memory

24 DIMM slots, 12 per processor

Twenty-four DDR5 RDIMM slots: twelve channels per processor, one DIMM on each. There is no second DIMM per channel to trade speed for capacity, so every configuration uses modules rated at 6400 MT/s, subject to what the processor supports.

Capacity with every slot filled

by DIMM size
32 GB768 GB64 GB1.5 TB96 GB2.3 TB128 GB3 TB24 slots · 12 per processor · each tick = one DIMM

Operating speed

per Dell memory tables
Processor1 DIMM / channel2 DIMMs / channel
Xeon 6 6900-series (P-core)6400 MT/sNot supported
  • Module sizes are 32, 64, 96 and 128 GB, all dual-rank 1.1 V parts; there is no 16 GB or 256 GB option.
  • 3 TB is 24 × 128 GB. With 64 GB modules the system holds 1.5 TB, and with 96 GB modules 2.25 TB.
  • The processor notes mention CXL 2.0 through Intel Flex Bus, but the R770AP guide documents no CXL memory configuration.
  • Dell’s spec sheet cautions that the installed processor may lower the DIMMs’ operating speed.
04 — Storage

4 drive-bay layouts, up to 32 bays

Every bay is NVMe. Dell offers no backplane, 8 or 16 × 2.5-inch Gen5 x4 bays, a 16-bay Gen5 x2 layout with RAID, or 32 E3.S Gen5 bays — and no rear bays at all.

Headline layouts

front panel view

Front panel

32 × EDSFF NVMe at the front — 32 bays in total.

SAS/SATANVMeSAS/SATA + NVMe

Controllers & boot

  • PERC H975i DC-MHS Front — RAID, 192MB cache. Avenger 2 (PERC 13); 1 GB DDR4-2400 memory, 192 MB on-chip cache, x16 PCIe 5.0; NVMe only (Gen3/4/5), RAID 0/1/5/6/10/50/60, 16 x PCIe SSD; the only internal controller; external controllers N/A
  • BOSS-N1 DC-MHS (optional, rear) — boot
  • The only internal controller is the front PERC H975i: 1 GB of DDR4 at 2400 MT/s, 192 MB of on-chip cache, a Gen5 x16 host link and RAID 0, 1, 5, 6, 10, 50 and 60 across up to 16 NVMe SSDs. It does not handle SAS.
  • Raw ceilings on Dell’s spec sheet are 245.76 TB for 16 × 2.5-inch and 491.52 TB for 32 × E3.S — 15.36 TB per drive, the largest capacity in the R770AP drive list.
  • Gen5 U.2 drives from 3.84 TB to 15.36 TB were available at launch; Gen4 U.2 and the 800 GB to 3.2 TB Gen5 sizes were marked as later additions.
  • Boot uses an optional rear BOSS-N1 DC-MHS, mirroring two M.2 NVMe SSDs in RAID 1, or USB.

Every documented layout

4 with drive bays
16 x 2.5-inch Gen5 x2 NVMe (with RAID)16 x 2.5-inch Gen5 x2 NVMe (with RAID)1616 x 2.5-inch Gen5 x4 NVMe16 x 2.5-inch Gen5 x4 NVMe168 x 2.5-inch Gen5 x4 NVMe8 x 2.5-inch Gen5 x4 NVMe832 x EDSFF E3.S NVMe32 x EDSFF E3.S NVMe32Bays · solid = front · dashed = rear · brighter = NVMe-only
2.5-inch3.5-inchEDSFF (E1.S / E3.S)
05 — I/O & networking

PCIe and networking

I/O topology

96 lanes per CPU
CPU 196 × PCIe 5.012 ch · 12 DIMMCPU 296 × PCIe 5.012 ch · 12 DIMMUPI 2.0 · up to 6 links · 24 GT/s5 × PCIe Gen5 x16slots 2, 3, 5, 7 and 92 riser configurationsboth two-processor, no rear bays2 × OCP NIC 3.0 (Gen5)slot 4 x8/x16 · slot 10 x16Rear BOSS-N1 DC-MHSoptional M.2 NVMe boot mirror

The 6900-series processors bring 96 PCIe 5.0 lanes each. Dell routes them to five x16 Gen5 slots and two OCP 3.0 bays, every one of them at the rear of the chassis.

Network adapters Dell lists

12 options
AdapterPortsForm
NVIDIA 2 x 25GbE SFP28 OCP 3.02 × 25GbEOCP 3.0
Broadcom 4 x 1GbE BT OCP 3.04 × 1GbEOCP 3.0
NVIDIA 2 x 100GbE QSFP56 OCP 3.02 × 100GbEOCP 3.0
Broadcom 4 x 25GbE SFP28 OCP 3.04 × 25GbEOCP 3.0
Broadcom 2 x 100GbE QSFP56 OCP 3.02 × 100GbEOCP 3.0
Broadcom 4 x 10GbE BT OCP 3.04 × 10GbEOCP 3.0
Broadcom 2 x 10GbE BT OCP 3.02 × 10GbEOCP 3.0
Broadcom 2 x 25GbE SFP28 OCP 3.02 × 25GbEOCP 3.0
Intel 2 x 10GbE BT OCP 3.02 × 10GbEOCP 3.0
Intel 4 x 10GbE BT OCP 3.04 × 10GbEOCP 3.0
Intel 4 x 1GbE BT OCP 3.04 × 1GbEOCP 3.0
Broadcom 2 x 200GbE QSFP112 OCP 3.02 × 200GbEOCP 3.0
  • The OCP bays take cards drawing 15 W to 80 W, and only the card in slot 10 can serve as a shared iDRAC NIC.
  • In rear-I/O use, cards of 25 Gb and faster need DAC cabling or active optics rated to 85°C; Dell names part 4WGYD for QSFP+.
  • Dell’s riser table lists two layouts: R1b+R2b+R3e+R4b+R5b and R1b+R2a+R3g+R4a+R5b.
  • There is no front-I/O version; the front carries only the USB Type-C port on the right control panel.
06 — Power & cooling

5 power supplies, 1,500–3,200 W

Five supplies, all Titanium: 1500 W and 1800 W units in the 60 mm size, 2400 W and 3200 W units in the 73.5 mm size, and a 3200 W 277 VAC / HVDC unit that Dell marked as not available at launch. Two are fitted, 1+1 redundant or non-redundant.

05001000150020002500300035001500 W Titanium — 100-240 VAC (derated to 1050 W at 100-120 VAC); 240 VDC HVDC variant China only; 60 mm; C131500Titanium1800 W Titanium — 200-240 VAC HLAC; 240 VDC HVDC variant China only; 60 mm; C151800Titanium2400 W Titanium — 100-240 VAC (1400 W lowline); 240 VDC HVDC variant China only; 73.5 mm; C192400Titanium3200 W Titanium — 200-240 VAC (2900 W / 3200 W by input voltage); 240 VDC HVDC variant China only; 73.5 mm; C193200Titanium3200 W Titanium — 277 VAC or 336 VDC HVDC; 73.5 mm; APP/Saf-D-Grid; not available at product launch3200TitaniumWatts · dashed line = output at 100–120 V low line
AC277 VAC / HVDC
  • On a 100–120 V supply the 1500 W unit is derated to 1050 W and the 2400 W unit to 1400 W. The 1800 W and 3200 W units are high-line only, and the 3200 W gives 2900 W at 200–220 V.
  • Cords: C13 for the 1500 W, C15 for the 1800 W, C19 for the 2400 W and 3200 W, and APP / Saf-D-Grid for the 277 VAC / HVDC unit.
  • 240 V DC variants of the four AC supplies are listed for China only.
  • Dell’s acoustic test builds pair 1500 W supplies with 400 W processors in its entry configurations, and use 3200 W supplies in the 16-drive and 500 W configurations.
07 — Management, security & OS

Run it, secure it, choose the OS

Management

  • iDRAC10 (Core, Enterprise and Datacenter licences)
  • iDRAC Direct
  • iDRAC RESTful API with Redfish
  • RACADM CLI
  • iDRAC Service Module
  • OpenManage Enterprise with Update Manager, Services and Power Manager plugins
  • Zero-Touch Provisioning (iDRAC10 Enterprise)

Security

  • Silicon Root of Trust
  • Cryptographically signed firmware
  • Secure Boot
  • Secured Component Verification (hardware integrity check)
  • Data at Rest Encryption (SEDs, local or external key management)
  • System Lockdown (iDRAC10 Enterprise or Datacenter)
  • Secure Erase
  • TPM 2.0 FIPS, CC-TCG certified
  • Chassis intrusion detection

Operating systems

  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server (including Datacenter)
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi and vSAN (post-launch)
08 — Compare

How the R770AP compares with its family

Its closest relative is the standard R770, which has the same 2U dimensions but uses 6700/6500-series Xeon 6 with GPUs and 32 DIMM slots. The 1U R670, the AMD EPYC 9005 R7725 and the R760 — the model Dell’s R770 guide measures against — give the wider comparison.

R770APR770R670R7725R760Cores / CPUR770AP: 128128R770: 144144R670: 144144R7725: 192192R760: 6464DIMM slotsR770AP: 2424R770: 3232R670: 3232R7725: 2424R760: 3232Max memoryR770AP: 3 TB3R770: 8 TB8R670: 8 TB8R7725: 6 TB6R760: 8 TB8Max drive baysR770AP: 3232R770: 4444R670: 2222R7725: 4040R760: 2828Max GPUsR770AP: 00R770: 66R670: 33R7725: 66R760: 66Largest PSUR770AP: 3,200 W3,200R770: 3,200 W3,200R670: 1,800 W1,800R7725: 3,200 W3,200R760: 3,200 W3,200
This modelSiblings and successorEach value from that model’s own verified spec file · bars scale per column
R770 data sheetR670 data sheetR7725 data sheetR760 data sheetLenovo ThinkSystem SR650 V4 data sheet (2U Xeon 6)
09 — Use cases

Four builds that suit the R770AP

Four builds for the jobs Dell names for the R770AP — HPC, virtualisation and data-intensive analytics. All of them stay within this model’s configurator options, and a single click loads any of them for editing.

HPC

256-core compute node

Two 128-core 6980P processors give 256 cores and 512 threads, and 64 GB modules in all 24 slots keep every memory channel populated. Dell cools these 500 W parts on air with HPR Platinum fans in every storage layout.

  • 2 × Xeon 6 6980P — 128 cores @ 2 GHz, 500 W each
  • 24 × 64 GB DDR5-6400 RDIMM — 1.5 TB, every channel populated
  • 4 × 3.84 TB E3.S Gen5 NVMe scratch — 15.36 TB raw
  • BOSS-N1 DC-MHS mirrored boot
  • Broadcom 2 × 200GbE QSFP112 OCP 3.0
  • 2 × 3200 W Titanium (200–240 V)
  • Red Hat Enterprise Linux 9

The 3200 W supply delivers 2900 W on 200–220 V feeds. Cluster interconnect cards go in the x16 slots, and we confirm the riser layout when we quote.

Open this build in the configurator →
In-memory analytics

3 TB in-memory database

The 72-core 6960P has the highest base clock of the five, 2.7 GHz, and 24 × 128 GB fills the chassis to its 3 TB limit. Sixteen 2.5-inch NVMe drives on the x2 RAID layout sit behind the H975i for persistence and logs.

  • 2 × Xeon 6 6960P — 72 cores @ 2.7 GHz, 500 W each
  • 24 × 128 GB DDR5-6400 RDIMM — 3 TB, the chassis maximum
  • 16 × 7.68 TB NVMe U.2 — 122.88 TB raw
  • PERC H975i front NVMe RAID
  • BOSS-N1 DC-MHS mirrored boot
  • Broadcom 2 × 100GbE QSFP56 OCP 3.0
  • 2 × 3200 W Titanium
  • SUSE Linux Enterprise Server 15

Dell lists Gen5 U.2 drives for this chassis and marks Gen4 U.2 as a later addition; the configurator currently offers Gen4 parts, so we confirm the drive generation when we quote.

Open this build in the configurator →
Virtualisation

Dense Windows Server consolidation host

Ninety-six cores per socket at a 2.4 GHz base, and 96 GB modules give 2.25 TB without leaving a channel empty. Windows Server is on Dell’s operating-system list, while ESXi was marked as post-launch for this model.

  • 2 × Xeon 6 6972P — 96 cores @ 2.4 GHz, 500 W each
  • 24 × 96 GB DDR5-6400 RDIMM — 2.25 TB
  • 16 × 7.68 TB E3.S Gen5 NVMe — 122.88 TB raw, 16 bays free
  • BOSS-N1 DC-MHS mirrored boot
  • Broadcom 4 × 25GbE SFP28 OCP 3.0
  • 2 × 2400 W Titanium (1400 W each at 100–120 V)
  • Windows Server 2025 Datacenter

Dell documents hardware RAID for the 16 × 2.5-inch x2 layout; with the E3.S front, plan on OS-level or software-defined data protection.

Open this build in the configurator →
Data analytics

Entry 400 W analytics server

The 6952P is the only 400 W part and the only one Dell’s thermal table cools with HPR Gold rather than Platinum fans, and Dell’s own entry test configuration pairs it with 1500 W supplies. Ninety-six cores per socket and twelve E3.S drives suit column-store scans.

  • 2 × Xeon 6 6952P — 96 cores @ 2.1 GHz, 400 W each
  • 24 × 32 GB DDR5-6400 RDIMM — 768 GB
  • 12 × 15.36 TB E3.S Gen5 NVMe — 184.32 TB raw
  • BOSS-N1 DC-MHS mirrored boot
  • NVIDIA 2 × 25GbE SFP28 OCP 3.0
  • 2 × 1500 W Titanium (1050 W each at 100–120 V)
  • Ubuntu Server 24.04 LTS

Moving to a 500 W processor later means HPR Platinum fans, and Dell’s 500 W test build uses 3200 W supplies.

Open this build in the configurator →
10 — Refurbished alternatives

When a refurbished PowerEdge makes more sense

Nothing refurbished matches a 128-core Xeon 6 socket, but for smaller compute or memory-bound jobs an older two-socket 2U PowerEdge can stand in at a fraction of the core count.

14G · re-certified

PowerEdge R7425

  • 2U · 2 × AMD EPYC 7001
  • Up to 64 cores
  • 32 DIMMs · up to 4 TB DDR4
  • GPU-capable · iDRAC9

Budget HPC or analytics nodes that need two sockets and more memory capacity than the R770AP’s 3 TB.

Configure a refurbished R7425 →
14G · re-certified

PowerEdge R740

  • 2U · 2 × Xeon Scalable
  • 24 DIMMs · up to 3 TB DDR4
  • 16 × 2.5" or 8 × 3.5"
  • GPU-capable · iDRAC9

General-purpose compute where room for a GPU or 3.5-inch drives matters more than core density.

Configure a refurbished R740 →
Refurbished Dell PowerEdge serversRefurbished PowerEdge configuratorNew vs refurbished cost calculator
11 — Full specifications

Dell PowerEdge R770AP specifications

Chassis & cooling

Form factor2U rack server · rear I/O only
Dimensions (H × W × D)86.8 × 482 mm · 802.40 mm deep with bezel, 801.51 mm without
Weight24.74 kg (8 × 2.5") · 27.34 kg (16 × 2.5") · 29.30 kg (32 × E3.S), fully populated
CoolingAir only
FansUp to six hot-swap · HPR Gold (400 W) or HPR Platinum (500 W) · N+1 redundancy
BezelOptional metal bezel
RailsB21 ReadyRails sliding · B22 Stab-in/Drop-in sliding · B20 static · optional CMA or SRB

Processor

SocketsTwo · Intel BR1A, 7529 pins
FamilyIntel Xeon 6 6900-series (P-core)
Cores per processor72, 96, 120 or 128
TDP400 W or 500 W
UPIUp to 6 × UPI 2.0 links, 24 GT/s
PCIe lanes96 × PCIe 5.0 per processor

Memory

Slots24 DDR5 RDIMM · 12 channels × 1 DIMM per processor
DIMM sizes32, 64, 96 and 128 GB
Speed6400 MT/s (one DIMM per channel only)
Maximum3 TB (24 × 128 GB)

Storage

FrontNo backplane · 8 or 16 × 2.5" Gen5 x4 NVMe · 16 × 2.5" Gen5 x2 NVMe with RAID · 32 × E3.S Gen5 NVMe
RearNone
Drive types2.5" U.2 Gen5 NVMe · 2.5" U.2 Gen4 NVMe (post-launch) · E3.S Gen5 NVMe, up to 15.36 TB
ControllerPERC H975i front (NVMe only) · no external controllers · no software RAID
BootOptional BOSS-N1 DC-MHS (RAID 1, 2 × M.2 NVMe) · USB

Expansion & networking

PCIe5 × x16 Gen5 (slots 2, 3, 5, 7 and 9) · 2 riser configurations
OCP2 × OCP NIC 3.0 · slot 4 x8 or x16, slot 10 x16 · 15–80 W cards
OCP cards1, 10, 25, 100 and 200 GbE
GPUsNot supported

Power

SuppliesTwo hot-plug · 1+1 redundant, or 1+0 / 2+0
AC1500 W and 1800 W (60 mm) · 2400 W and 3200 W (73.5 mm) · all Titanium
HVDC3200 W 277 VAC / 336 V DC (post-launch) · 240 V DC variants for China only

Ports & video

Front1 × USB 2.0 Type-C
Rear2 × USB 3.1 Type-A · VGA · dedicated iDRAC (BMC) Ethernet
Internal1 × USB 3.1 Type-A
VideoIntegrated Matrox G200, 16 MB

Environment & acoustics

ASHRAE A210–35°C up to 900 m · −1°C per 300 m above
ASHRAE A35–40°C up to 900 m · −1°C per 175 m above
ASHRAE A45–45°C up to 900 m · −1°C per 125 m above
Maximum operating altitude3048 m
Sound powerQuietest tested build 6.7 B idle · entry build 8.4 B at full load, 35°C
12 — FAQ

R770AP questions, answered from the documentation

What is the maximum memory of the Dell PowerEdge R770AP?

3 TB, using 24 × 128 GB RDIMMs. Each processor has 12 memory channels with one DIMM slot per channel, so there is no two-DIMMs-per-channel mode and every build uses modules rated at 6400 MT/s. Module sizes are 32, 64, 96 and 128 GB.

Which processors does the R770AP support?

Five: the 6952P (96 cores, 400 W), 6972P (96 cores, 500 W), 6960P (72 cores, 500 W), 6978P (120 cores, 500 W) and 6980P (128 cores, 500 W). All are P-core parts with two threads per core, and the two sockets must hold matching models.

Does the R770AP support GPUs?

No. Dell’s R770AP spec sheet lists GPU options as N/A, and the technical guide has no accelerator tables. For GPUs in a 2U Xeon 6 server, the standard R770 takes up to two double-wide 450 W cards.

How many drive bays does the R770AP have?

Up to 32 EDSFF E3.S Gen5 NVMe drives, or 16 × 2.5-inch Gen5 NVMe in x4 or x2 (RAID) form, or 8 × 2.5-inch. There are no rear bays and no SATA, SAS or hard-disk support.

How many PCIe slots does the R770AP have?

Five PCIe Gen5 x16 slots plus two OCP NIC 3.0 bays, one at x8 or x16 and one at x16. Each processor provides 96 PCIe 5.0 lanes, eight more per socket than the Xeon 6 processors in the R770.

Is the R770AP air-cooled or liquid-cooled?

Air only; Dell describes no liquid-cooling configuration for it. The 400 W 6952P uses High-performance Gold fans and the 500 W parts High-performance Platinum fans, and Dell’s table supports every processor with every storage layout.

What power supplies does the R770AP use?

Five Titanium options: 1500 W, 1800 W, 2400 W and 3200 W AC, and a 3200 W 277 VAC / HVDC unit that was not available at launch. At 100–120 V the 1500 W unit is rated 1050 W and the 2400 W unit 1400 W; the 1800 W and 3200 W units need high-line power.

How does the R770AP differ from the R770?

The standard R770 runs 6700- and 6500-series Xeon 6 (86 P-cores or 144 E-cores at most, 350 W maximum) with 32 DIMM slots for 8 TB, up to eight Gen5 slots, GPU options and SATA layouts. This model instead takes 6900-series chips of up to 128 cores and 500 W, fills 12 channels per socket from 24 slots for 3 TB, and offers five x16 slots with NVMe-only storage. Both are 2U, and both measure 802.40 mm deep with the bezel (the R770 in its rear-I/O form).

How big and heavy is the PowerEdge R770AP?

It is 86.8 mm high, 482 mm wide and 802.40 mm deep with the bezel (801.51 mm without). A fully populated system weighs 24.74 kg with eight 2.5-inch drives, 27.34 kg with sixteen, and 29.30 kg with 32 E3.S drives.

Is the Dell PowerEdge R770AP end of life?

Dell’s R770AP guide does not state an end-of-sale or end-of-support date, and its May 2026 edition still marks some options as coming after launch. Dell’s base hardware warranty is a one- or three-year term that varies by model, and ProSupport contracts run beyond it. Our end-of-life checker adds dates when Dell publishes them.

Sources & verification

Where these figures come from

Specifications are extracted from Dell’s published documents and independently re-checked line by line. Configurations are quote-based; availability and exact options are confirmed at quotation. Last reviewed 2026-09-11.

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