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Technical data sheet · ThinkSystem V4 Neptune · GB200 NVL4 water-cooled tray

Lenovo ThinkSystem SC777 V4 NeptuneSpecifications, configurations & comparisons

The ThinkSystem SC777 V4 is Lenovo’s NVIDIA GB200 NVL4 server: a single water-cooled tray with two Grace processors, four Blackwell B200 GPUs and memory fixed on the boards, eight of them to a 13U N1380 Neptune enclosure. It is built for AI training and GPU-accelerated HPC, and this page sets out its two I/O layouts, storage, power and cooling as Lenovo documents them.

Multi-Node (water-cooled tray)2 socketsNVIDIA GraceXClarity Controller 3
4B200 GPUs per tray186 GB HBM3e each · 744 GB total
2Grace processors72 Arm Neoverse V2 cores each
960GBLPDDR5X, fixed480 GB per processor · 4266 MT/s
5,480WGPU board power1,200 W TGP per B200
10E3.S NVMe drives8 data + 2 boot · internal
8trays per 13U enclosure32 GPUs per N1380
Configure an SC777 V4 →Get a UK quote

Every figure checked against the Lenovo ThinkSystem SC777 V4 Neptune Server (July 15, 2026)

Front of the Lenovo ThinkSystem SC777 V4 tray: six low-profile PCIe 5.0 x16 slots above VGA, USB, 2 × 25GbE SFP28 and management ports

Image: Lenovo

Form factor
Multi-Node (water-cooled tray) · 2 sockets
Processors
NVIDIA Grace
Drive bays
Up to 10 · 1 backplane option
Expansion
6 × PCIe
GPUs
Up to 4 · 1 listed
Boot
2 x E3.S 1T NVMe boot drives
Management
XClarity Controller 3
01 — Overview

The SC777 V4 at a glance

Our read of Lenovo’s documentation: where the SC777 V4 is strong, and the limits worth knowing before you spec one.

Strengths

  • Two GB200 NVL4 boards put four B200 GPUs and two Grace processors in one tray; NVLink joins the GPUs in a 1.8 TB/s full mesh, and each GPU has 450 GB/s of NVLink to the processors.
  • Lenovo offers two I/O designs: HPC and AI for Science, with up to six PCIe 5.0 x16 adapters wired to the processors, and AI Training, where ConnectX-8 switches link each GPU to its own 800 Gb OSFP port and local drives for GPUDirect.
  • GPU memory is 186 GB of HBM3e per B200 at 8 TB/s — 744 GB across the tray — alongside 960 GB of LPDDR5X attached to the processors.
  • The tray is 100% direct warm-water cooled with no system fans and inlet water up to 45 °C, and the enclosure’s power conversion stations are cooled by water as well.
  • XCC3 Premier is built in, so remote console, virtual media, System Guard and power capping need no licence upgrade; only the guide’s specification table still calls Premier optional.

Watch-outs

  • The tray depends entirely on the N1380: its 48 V busbar, water manifold and SMM3. Budget for the enclosure, a coolant distribution unit, three-phase 380–480 V feeds and hoses as well as the trays.
  • Nothing on the GB200 boards is optional. Processors, GPUs and memory are fixed, there are no DIMM slots, and the Grace chip is soldered on, so a processor fault means replacing the whole module.
  • Power redundancy is N+1 only: Lenovo does not support N+0 or N+N with the SC777 V4, and after a station fault GPU trays are hard-throttled.
  • In the HPC and AI for Science layout, adapters and data drives compete for the same processor lanes — six adapters leave room for no data drives, eight data drives for two adapters.
  • Lenovo excludes GPU-related requests from its onsite response targets, handling them on a commercially reasonable basis, and the node carries export classification 5A992.z.
Processors1 SKU
Cores / CPU72
Backplanes1
Max bays10
GPUsup to 4
Enclosure power parts1 · to 15,000 W
02 — Processors

1 supported processor, mapped

There is no processor choice to make. Each of the two GB200 NVL4 boards carries one NVIDIA Grace processor with 72 Arm Neoverse V2 cores and 4 × 128-bit SVE2, a 3.1 GHz base and 3.0 GHz all-core SIMD frequency, and a 300 W TDP that already includes its memory.

Processor landscape — cores × TDP

1 SKUs · 1 family
Lenovo ThinkSystem SC777 V4 Neptune: every supported processor by cores and TDP081624324048566472300 WCores per processorNVIDIA Grace — 72 cores · 300 W · 3.1 GHz base · 114 MB cache · DDR5-4266NVIDIA Grace72 cores · 4.2 W/core — top SKU and most efficient
NVIDIA Grace 1Bubble size = L3 cache · hover a bubble for the full SKU

Processor explorer

filter · sort · compare
ProcessorCores / threadsBaseL3 cacheTDPW / coreMemory
NVIDIA Grace723.1 GHz114 MB300 W4.2DDR5-4266
  • Caches: 64 KB instruction plus 64 KB data L1 and 1 MB of L2 per core, and 114 MB of L3.
  • Each Grace has 64 PCIe Gen5 lanes arranged as eight x8 links, a 300 GB/s bi-directional NVLink-C2C link to the other processor and 450 GB/s of NVLink to each of its two GPUs.
  • NVIDIA’s Scalable Coherency Fabric ties cores, memory and I/O together with 3.2 TB/s of bisection bandwidth.
  • The processor is BGA-soldered to the board; replacing it means replacing the complete GB200 NVL4 module.
  • Lenovo’s guide gives no thread count and no turbo frequency for Grace, so neither is shown here.
03 — Memory

Memory built onto the processor board — no DIMM slots

There are no DIMM slots. The processors use LPDDR5X ECC memory soldered onto the GB200 boards in a fixed configuration — 960 GB per tray, 480 GB per processor — running at 4266 MT/s with up to 384 GB/s of peak bandwidth per processor.

Integrated memory

fixed at the factory

960 GB LPDDR5X (CPU) + 744 GB HBM3e (GPU)

Rated memory speed

from the processor table
Processor familyUp to
NVIDIA Grace4266 MT/s
  • Lenovo also describes the memory as eight 128 GB modules, four per processor, which would total 1,024 GB rather than the 960 GB (480 GB per processor) it quotes elsewhere; this page uses 960 GB.
  • The specification table calls it LPDDR5 at 4266 MHz, while the memory section calls it LPDDR5X at 4266 MT/s.
  • Reliability features: ECC with single-error correction and double-error detection, plus parity, scrubbing, poisoning and page off-lining.
  • GPU memory is separate: 186 GB of HBM3e per B200 with 8 TB/s of bandwidth and ECC on by default — 744 GB and 32 TB/s per tray.
04 — Storage

1 backplane option, up to 10 bays

All storage is internal E3.S NVMe: up to ten E3.S 1T SSDs in five bays that are neither front-accessible nor hot-swappable. Eight positions hold data and two hold boot drives; each bay takes two E3.S 1T drives or one E3.S 2T drive, and any RAID has to come from the operating system.

Headline layouts

front panel view

Front panel

Every position used: eight data and two boot drives, 153.6 TB with 15.36 TB SSDs. The boot pair needs the PCIe Switch Board for Boot Drives (C51T), which cannot be added later. In the HPC and AI for Science layout this leaves two adapter slots; the AI Training layout sets no drive limit.

SAS/SATANVMeSAS/SATA + NVMe

Controllers & boot

  • Onboard NVMe ports (integrated NVMe storage controllers) — Software RAID. RAID provided by the operating system if desired; no hardware RAID/HBA options listed
  • 2 x E3.S 1T NVMe boot drives (bays 0-1) via ThinkSystem SC777 V4 Neptune PCIe Switch Board for Boot Drives (feature C51T), switched x4 to CPU 2 — boot
  • Listed SSDs are E3.S 1T PCIe 5.0 x4 trayless drives, all SED-capable: Mixed Use at 1.6, 3.2, 6.4 or 12.8 TB and Read Intensive at 1.92, 3.84, 7.68 or 15.36 TB, any of them up to ten per tray.
  • Boot drives 0–1 reach CPU 2 through a PCIe switch and may perform below the data drives; data drives 2–5 attach to CPU 2 and 6–9 to CPU 1.
  • Each bay is fitted with a single-drive cage (C77X) or a dual-drive cage (C51U, not usable with E3.S 2T drives), depending on how many drives it holds.
  • In the AI Training layout, two E3.S drives hang off each of the four ConnectX-8 switches.
05 — Accelerators & I/O

GPUs, PCIe and networking

The four B200 GPUs are mounted on the two GB200 NVL4 boards, two per board, and are standard in every configuration. Lenovo’s table gives each 186 GB of HBM3e at 8 TB/s and 1,200 W total graphics power, with 5,480 W for the complete board set. GPUs talk to each other over NVLink at 1.8 TB/s in a full mesh, each also has a PCIe Gen6 x16 interface rated at 256 GB/s, and each can be split into up to seven MIG instances — 28 per tray. Four fixed B200 GPUs per tray, 32 per N1380 · 744 GB HBM3e · Lenovo lists 40 TFLOPS FP64 per GPU (160 per tray).

NVIDIA Blackwell B200 (GB200 NVL4)

186GB HBM3e · 4 per tray (fixed)

I/O topology

64 lanes per CPU
CPU 164 × PCIe 5.00 DIMMCPU 264 × PCIe 5.00 DIMMNVLink-C2C · 300 GB/sHPC: 6 × PCIe 5.0 x16lanes shared with data drivesAI Training: 4 × 800Gb OSFP+ 2 × PCIe x16 (slots 2, 5)2 × 25GbE SFP28 onboardConnectX-6 Lx · NC-SI port 1XCC3 Premier · RJ-45AST2600 BMC · standard

Each Grace processor brings 64 PCIe Gen5 lanes, and the pair is linked by NVLink-C2C at 300 GB/s. At the front are up to six low-profile PCIe 5.0 x16 slots — 1 to 3 on CPU 1, 4 to 6 on CPU 2 — and two onboard 25GbE ports. The N1380 midplane carries no I/O, so all networking goes to top-of-rack switches.

Network adapters Lenovo lists

5 options
AdapterPortsForm
2 x 25GbE SFP28 onboard (NVIDIA ConnectX-6 Lx), 1/10/25Gb, port 1 supports NC-SI for XCC2 × 25GbELOM
ThinkSystem NVIDIA ConnectX-7 NDR OSFP400 1-port PCIe Gen5 x16 InfiniBand Adapter DWC (BKSN)1 × NDR 400GbPCIe
ThinkSystem NVIDIA ConnectX-7 NDR200/HDR/200GbE QSFP112 2-Port PCIe Gen5 x16 Adapter (SharedIO) DWC (BKSL)2 × NDR200/200GbEPCIe
ThinkSystem NVIDIA ConnectX-8 8180 800Gbs XDR IB / 2x400GbE OSFP 1-Port PCIe Gen6 x16 DWC (Generic FW) (CAGC)1 × 800Gb XDR / 2x400GbEPCIe
ThinkSystem SC777 V4 OSFP IO Kit (two OSFP 800Gb cages) (C8X0) - AI Training configuration only, 2 kits = 4 x OSFP 800Gb ports fed by 4 x ConnectX-8 I/O modules (C8WZ)2 × 800Gbembedded
  • AI Training (the DCSC default, feature C8WZ): four ConnectX-8 switches, each wired to one B200 over Gen6 x16, one Grace over Gen5 x16, one 800 Gb OSFP port and two E3.S drives. The two OSFP kits (C8X0) occupy slots 3 and 4, giving four ports and up to 3,200 Gb/s in total.
  • HPC and AI for Science (MCIO breakout boards, feature C8X1): the GPUs connect directly to the processors and the front slots take up to six ConnectX-7 adapters or three ConnectX-8 adapters, each ConnectX-8 using a Gen5 x32 connection across two x16 slots.
  • Adapter maxima, HPC / AI Training: ConnectX-7 NDR OSFP400 6 / 2, ConnectX-7 NDR200 two-port 6 / 2, ConnectX-8 8180 3 / 1. All are water-cooled (DWC) versions.
  • Slots use single-slot risers: C51P for slots 1 and 6, C51N for slots 2 to 5.
  • Port 1 of the onboard 25GbE pair supports NC-SI sharing with the XCC; a separate RJ-45 port provides dedicated management.
06 — Power & cooling

No supplies of its own — powered by the enclosure

The tray carries no power supplies; it takes 48 V from the busbar in the N1380 midplane. The enclosure is fitted with between two and four 15 kW Titanium conversion stations, hot-swappable and water-cooled, and with SC777 V4 trays installed the only permitted policy is N+1 with oversubscription.

0500100015002000250030003500400045005000550060006500700075008000850090009500100001050011000115001200012500130001350014000145001500015000 W Titanium — ThinkSystem N1380 Neptune 15kW 3-Phase 380-480V Titanium Power Conversion Station (4P57A82022 / BYKH); quantities 2, 3 or 4; input 380-480Vac 3-phase WYE, 30A per phase; Harting Han-ECO 10B connector; feeds a 48V busbar; N+1 only (N+0 and N+N not supported); chassis DC capacity 18 kW (1+1), 36 kW (2+1), 54 kW (3+1), with degraded capacity 15/30/45 kW15000TitaniumWatts · dashed line = output at 100–120 V low line
AC
  • Capacity is 18 kW DC with 1+1, 36 kW with 2+1 and 54 kW with 3+1. When a station fails, capacity falls back to 15, 30 or 45 kW in under one second, hard-throttling GPU trays through PWRBRK#.
  • Input to each station is 380–480 V three-phase WYE, 30 A per phase, on a Harting Han-ECO 10B plug; Lenovo’s electrical specifications give 342–528 V AC with 380–480 V nominal.
  • Stations draw 32 A each, but Y-splitter cables pair two of them on one 63 A data-centre supply — six supplies for a full rack of 12 stations. Lenovo points to its Capacity Planner for rack power sizing.
  • Water flow at 45 °C is 7.0 L/min per tray and 3.4 L/min per station — 69.6 L/min for eight trays and four stations — falling to 4.4 and 2.0 L/min at 27 °C.
  • Pressure drop across a full enclosure of eight trays at 45 °C is 0.84 bar with one station and 0.93 bar with four.
07 — Management, security & OS

Run it, secure it, choose the OS

Management

  • XClarity Controller 3 on an ASPEED AST2600, with XCC3 Premier built in (it does not appear as a configurator feature)
  • SMM3 in the N1380: remote XCC access, node virtual reseat, enclosure power and thermal management, leak detection
  • SMM3 daisy chain covering 3 enclosures and 48 nodes from one Ethernet link
  • NC-SI on 25GbE port 1 (BEXY) plus a dedicated RJ-45 XCC port
  • Redfish, IPMI 2.0 (IPMI-over-LAN disabled by default), SNMPv3 and CIM-XML
  • XClarity One with per-endpoint licences; XClarity Essentials OneCLI, UpdateXpress and BOMC
  • Lenovo HPC & AI Software Stack, NVIDIA CUDA and HPC SDK, and NVIDIA AI Enterprise
  • TI INA228 meter sampling DC power at up to 100 Hz with better than 97% accuracy

Security

  • Platform Firmware Resiliency hardware Root of Trust (NIST SP 800-193)
  • TPM 2.0, with Secure Boot enabled in the factory on request (BPKQ)
  • NIST SP 800-147B compliant; FIPS- and NIST-compliant firmware signing
  • System Guard, part of the included XCC3 Premier
  • Administrator and power-on passwords

Operating systems

  • Red Hat Enterprise Linux 9.6 and 10.0
  • Ubuntu 24.04 LTS
08 — Compare

How the SC777 V4 compares with its family

The SC777 V4 shares its N1380 enclosure with the SC750 V4, a Xeon 6 HPC tray without GPUs. Lenovo’s other GPU systems in our data are rack servers with up to eight GPUs — the 5U SR780a V3, the 8U SR680a V4 and the 3U SR675 V3 — and the SD665 V3 brings Neptune water cooling to AMD EPYC multi-node trays. Each bar is drawn from that server’s verified spec file.

SC777 V4 NeptuneSC750 V4 NeptuneSR780a V3SR680a V4SR675 V3SD665 V3 Neptune DWCCores / CPUSC777 V4 Neptune: 7272SC750 V4 Neptune: 288288SR780a V3: 6464SR680a V4: 8686SR675 V3: 160160SD665 V3 Neptune DWC: 160160DIMM slotsSC777 V4 Neptune: 00SC750 V4 Neptune: 2424SR780a V3: 3232SR680a V4: 3232SR675 V3: 2424SD665 V3 Neptune DWC: 2424Max memorySC777 V4 Neptune: 0.938 TB0.938SC750 V4 Neptune: 3 TB3SR780a V3: 4 TB4SR680a V4: 4 TB4SR675 V3: 6 TB6SD665 V3 Neptune DWC: 3 TB3Max drive baysSC777 V4 Neptune: 1010SC750 V4 Neptune: 66SR780a V3: 1212SR680a V4: 88SR675 V3: 88SD665 V3 Neptune DWC: 44Max GPUsSC777 V4 Neptune: 44SC750 V4 Neptune: 00SR780a V3: 88SR680a V4: 88SR675 V3: 88SD665 V3 Neptune DWC: 00Largest PSUSC777 V4 Neptune: 15,000 W15,000SC750 V4 Neptune: 15,000 W15,000SR780a V3: 3,200 W3,200SR680a V4: 3,800 W3,800SR675 V3: 2,600 W2,600SD665 V3 Neptune DWC: 7,200 W7,200
This modelSiblings and successorEach value from that model’s own verified spec file · bars scale per column
SC750 V4 data sheetSR780a V3 data sheetSR680a V4 data sheetSR675 V3 data sheetSD665 V3 data sheetDell PowerEdge XE9712 data sheet (GB300 NVL72 sled)
09 — Use cases

Three builds that suit the SC777 V4

Three tray builds, one per way Lenovo expects the SC777 V4 to be used. The processors, GPUs and memory are identical in all three; what changes is the I/O layout, the drives and the adapter. Memory is fixed on the boards, so no DIMMs are added in the configurator.

AI training

Scale-out training tray

This is Lenovo’s default AI Training layout: four ConnectX-8 switches give each B200 its own 800 Gb OSFP port and a Gen6 x16 GPUDirect path, with two local E3.S drives behind each switch. Slots 2 and 5 remain for two adapters, here a 400 Gb NDR InfiniBand card.

  • 2 × NVIDIA Grace, 72 cores each (fixed)
  • 4 × NVIDIA B200 (fixed)
  • 10 × 7.68 TB E3.S NVMe — 8 data, 2 boot
  • ConnectX-7 NDR OSFP400 InfiniBand adapter (DWC)
  • Ubuntu 24.04 LTS

The OSFP IO kits and ConnectX-8 IO modules belong to the AI Training configuration rather than the configurator’s option list; we specify them, together with the N1380 enclosure, power conversion stations and hoses, when we quote. The 960 GB of LPDDR5X is fixed on the boards.

Open this build in the configurator →
HPC · AI for Science

Adapter-rich simulation tray

With the MCIO breakout boards the GPUs connect straight to the processors and the front slots go to the cluster fabric. Four data drives plus the boot pair leave four slots for ConnectX-7 adapters, the balance Lenovo’s lane-sharing table allows.

  • 2 × NVIDIA Grace, 72 cores each (fixed)
  • 4 × NVIDIA B200 (fixed)
  • 6 × 3.84 TB E3.S NVMe — 4 data, 2 boot
  • ConnectX-7 NDR200/200GbE 2-port QSFP112 adapter (DWC)
  • Red Hat Enterprise Linux 9

Adapters and data drives share lanes in this layout: four data drives allow four adapters, eight allow two. The configurator carries one adapter; we add the others on the quote.

Open this build in the configurator →
Shared GPU service

Partitioned inference and development tray

Each B200 can be split into up to seven MIG instances, 28 per tray, so one tray can serve many smaller inference or development jobs, and Lenovo lists NVIDIA AI Enterprise with NIM microservices for the SC777 V4. Ten 15.36 TB drives keep 153.6 TB of models and data local.

  • 2 × NVIDIA Grace, 72 cores each (fixed)
  • 4 × NVIDIA B200 (fixed) — up to 28 MIG instances
  • 10 × 15.36 TB E3.S NVMe — 8 data, 2 boot
  • ConnectX-7 NDR OSFP400 InfiniBand adapter (DWC)
  • Ubuntu 24.04 LTS

Ten drives require the boot-drive PCIe switch board (C51T), which cannot be fitted later. If this tray uses the HPC and AI for Science layout, eight data drives limit it to two adapters.

Open this build in the configurator →
10 — Full specifications

Lenovo ThinkSystem SC777 V4 Neptune specifications

Tray, enclosure & cooling

Form factorGB200 NVL4 system in a water-cooled tray, installed vertically in the N1380
Machine types7DMP (3-year base warranty) · 7DKA (5-year warranty-ready) · N1380 enclosure 7DDH
Tray dimensions546 × 53 × 760 mm (W × H × D) · 799 mm with the rear water connections
Tray weight36.5 kg
N1380 enclosure13U · 540 × 572 × 1302 mm · 8 trays · up to 3 per 42U or 48U rack
Enclosure weight94 kg empty · 470 kg with 8 SC777 V4 trays and 4 stations
Cooling100% direct warm-water cooling; no system fans
Export controlClassification 5A992.z; an export licence may be required

Processor

Processors2 × NVIDIA Grace, one per GB200 NVL4 board, soldered (BGA)
Cores72 Arm Neoverse V2 per processor · 144 per tray
Frequency3.1 GHz base · 3.0 GHz all-core SIMD
TDP300 W, including memory
Cache114 MB L3 · 1 MB L2 per core
I/O64 PCIe Gen5 lanes per processor · NVLink-C2C 300 GB/s

Memory

TypeLPDDR5X ECC, soldered, fixed configuration
Capacity960 GB per tray · 480 GB per processor
Speed4266 MT/s · up to 384 GB/s per processor
ProtectionSEC/DED ECC, parity, scrubbing, poisoning, page off-lining

GPUs

GPUs4 × NVIDIA B200, fixed
GPU memory186 GB HBM3e each · 744 GB per tray · 8 TB/s per GPU
Power1,200 W TGP per GPU · 5,480 W total board
InterconnectNVLink 1.8 TB/s full mesh · 450 GB/s to the CPUs per GPU · PCIe Gen6 x16, 256 GB/s
MIGUp to 7 instances per GPU, 28 per tray
FP6440 TFLOPS per GPU · 160 TFLOPS per tray

Storage

DrivesUp to 10 × E3.S 1T NVMe (PCIe 5.0 x4) in 5 internal, non-hot-swap bays
Split8 data + 2 boot (boot pair needs the C51T switch board)
Maximum153.6 TB (10 × 15.36 TB)
RAIDOperating-system software RAID only
OpticalNone

Expansion & networking

PCIe slotsUp to 6 × PCIe 5.0 x16 low profile, front-accessible
AI Training I/O4 × 800 Gb OSFP through ConnectX-8 IO modules, plus 2 PCIe slots
Onboard2 × 25GbE SFP28 (NVIDIA ConnectX-6 Lx)
AdaptersConnectX-7 NDR OSFP400 · ConnectX-7 NDR200 2-port · ConnectX-8 8180 · all DWC

Power (N1380 enclosure)

Power conversion stations2, 3 or 4 × 15 kW Titanium · water-cooled · hot-swap
PolicyN+1 with oversubscription only (N+0 and N+N not supported)
Capacity18 / 36 / 54 kW DC (1+1 / 2+1 / 3+1)
Input380–480 V AC three-phase WYE · 30 A per phase

Ports & video

FrontVGA · USB-C (DisplayPort + 5 Gb/s data) · 2 × USB 3 (5 Gb/s) · RJ-45 XCC · diagnostics port
Video16 MB, integrated in XCC3 · up to 1920 × 1200 at 60 Hz

Environment & warranty

Air temperature5–40 °C operating (ASHRAE A3)
WaterInlet 2–45 °C (ASHRAE S45) · 7.0 L/min per tray at 45 °C
Altitude3,048 m maximum
Warranty3 or 5 years by machine type · CRU and onsite, 9 × 5 NBD · GPU requests outside onsite targets
11 — FAQ

SC777 V4 questions, answered from the documentation

What is the Lenovo ThinkSystem SC777 V4?

Lenovo’s water-cooled server based on NVIDIA’s GB200 NVL4 platform: one tray holding two Grace processors and four Blackwell B200 GPUs on two boards. Eight trays fit a 13U ThinkSystem N1380 Neptune enclosure, which provides their power, water and management.

How much memory does the SC777 V4 have?

The processors have 960 GB of LPDDR5X ECC, 480 GB each at 4266 MT/s, soldered in a fixed configuration with no DIMM slots. The GPUs carry their own 186 GB of HBM3e apiece, 744 GB per tray.

Can the processors or GPUs be changed?

No. The two Grace processors and four B200 GPUs are part of the GB200 NVL4 boards and are standard in every SC777 V4. The Grace chip is soldered on, so a processor fault is fixed by replacing the whole module.

How do the AI Training and HPC and AI for Science configurations differ?

AI Training, the default, adds four ConnectX-8 switches that give every GPU a Gen6 GPUDirect path to its own 800 Gb OSFP port and two drives, plus room for two PCIe adapters. HPC and AI for Science connects the GPUs directly to the processors and opens all six front slots to up to six ConnectX-7 or three ConnectX-8 adapters, which share lanes with the data drives.

How much storage does the SC777 V4 hold?

Up to ten internal E3.S 1T NVMe SSDs in five bays, eight for data and two for boot, which is 153.6 TB with 15.36 TB drives. None is hot-swap, and RAID is left to the operating system.

What power and cooling does an SC777 V4 enclosure need?

The N1380 runs two to four water-cooled 15 kW power conversion stations on 380–480 V three-phase WYE, in N+1 only, delivering up to 54 kW DC with four. Eight trays and four stations need 69.6 L/min of water at 45 °C, and inlet water can be anywhere from 2 °C to 45 °C.

Which operating systems does the SC777 V4 support?

Lenovo lists Red Hat Enterprise Linux 9.6 and 10.0 and Ubuntu 24.04 LTS. It also describes the server as designed for NVIDIA AI Enterprise, including Base Command Manager and NIM microservices.

How does the SC777 V4 differ from the SC750 V4?

Both are trays for the same N1380 enclosure. The SC750 V4 carries two separate CPU-only servers with Xeon 6900-series processors and up to 3 TB of DDR5 each, and offers no GPUs; the SC777 V4 is one GB200 NVL4 server with two Grace processors, four B200 GPUs and fixed memory. The SC777 V4 also allows only N+1 power, where SC750 V4 enclosures can run N+0, N+1 or N+N.

Is GPU support handled differently?

Yes. Lenovo states that onsite service-level targets such as next business day or 4-hour response do not apply to GPU-related requests on the SC777 V4, which are handled on a commercially reasonable basis; buying onsite spare parts can shorten the wait. The tray itself has a 3- or 5-year warranty depending on machine type.

Is the Lenovo SC777 V4 end of life?

Lenovo’s July 2026 product guide lists the SC777 V4 as a current configure-to-order product and gives no end-of-service date. Its export classification (5A992.z) may require a licence in some markets. Should Lenovo announce lifecycle dates, they will appear in the end-of-life checker linked below.

Sources & verification

Where these figures come from

  • Lenovo ThinkSystem SC777 V4 Neptune Server (July 15, 2026) — Tray and N1380 specifications (Tables 1–2), configurations (Table 4), GB200 NVL4 processors, memory and GPU specifications (Table 5), storage (Tables 6–9), slots, OSFP ports and adapters (Tables 10–14), cooling and water connections (Table 15), power conversion stations and policies (Tables 17–19), management, security, OS support, dimensions, water flow and warranty.
  • Lenovo ThinkSystem SC750 V4 Neptune Server (July 27, 2026) — SC750 V4 memory, GPU and power-policy facts used in the SC750 V4 comparison FAQ.

Specifications are extracted from Lenovo’s published documents and independently re-checked line by line. Configurations are quote-based; availability and exact options are confirmed at quotation. Last reviewed 2026-09-11.

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