Technical data sheet · ThinkSystem V4 Neptune · water-cooled tray, two 2-socket nodes

Lenovo ThinkSystem SC750 V4 NeptuneSpecifications, configurations & comparisons

The ThinkSystem SC750 V4 is a direct-water-cooled tray carrying two independent two-socket servers with Intel Xeon 6900-series processors. It works only inside Lenovo’s 13U N1380 Neptune enclosure, which holds up to eight trays (sixteen nodes), and is aimed at HPC and technical-computing clusters. Numbers below describe one node; tray and enclosure figures are labelled as such.

Multi-Node2 socketsXeon 6 E-coreXeon 6 6900PXClarity Controller 3

16nodes per 13U enclosure8 trays × 2 nodes in the N1380

288cores per processorXeon 6990E+ · 576 per node

3TBDDR5 per node24 × 128 GB RDIMM · 12 per CPU

45°Cwarmest inlet waterASHRAE S45 (formerly W45)

6internal E3.S NVMe SSDsper node · 92.16 TB maximum

54kWenclosure DC capacity4 × 15 kW stations · 3+1 policy

Configure an SC750 V4 →Get a UK quote

Every figure checked against the Lenovo ThinkSystem SC750 V4 Neptune Server (July 27, 2026)

Image: Lenovo

Form factor: Multi-Node · 2 sockets
Processors: Xeon 6 E-core · Xeon 6 6900P
Memory: 24 × DDR5 RDIMM · up to 3 TB
Drive bays: Up to 6 · 4 backplane options
Expansion: 2 × PCIe
Management: XClarity Controller 3

01 — Overview

The SC750 V4 at a glance

Our read of Lenovo’s documentation: where the SC750 V4 is strong, and the limits worth knowing before you spec one.

Strengths

Two full two-socket servers share each tray, so one 13U N1380 carries 16 nodes and 32 processors, and a 42U or 48U rack takes up to three enclosures.
The complete Xeon 6900-series memory layout is kept: 12 channels per processor with one DIMM each, 24 DIMMs and up to 3 TB per node, and 8800 MHz MRDIMMs with the 6900P processors.
Cold plates take water to the processors, DIMMs, drives and adapters, so the nodes have no fans at all and accept inlet water as warm as 45 °C; Lenovo says most sites will not need chillers.
The enclosure’s power conversion stations are water-cooled too. Lenovo quotes essentially complete heat recovery depending on water and room temperatures, typically about 95% with 45 °C water in a 30 °C room.
With Shared I/O a single NVIDIA adapter installed in one node carries traffic for both nodes of the tray; Socket Direct instead links one adapter to both processors of a node.

Watch-outs

A tray is useless on its own. It draws 48 V power, water and management from the N1380 enclosure, and that enclosure in turn needs a coolant distribution unit and 380–480 V three-phase supplies.
Both sockets must be populated and every channel filled: Lenovo supports neither one-processor nodes nor partial memory, and all 24 DIMMs must share one part number.
Storage is internal and small: up to six E3.S NVMe drives per node, none hot-swap or reachable from the front, RAID only through Intel VROC, and each front bay filled with drives costs a PCIe slot.
There are no GPUs. Lenovo sends buyers who need water-cooled NVIDIA GPUs to the SC777 V4, SR780a V3 or SD665-N V3 instead.
A tray weighs up to 37.2 kg, and Lenovo requires an onsite material lift if a single engineer is to service trays or power conversion stations.

Processors6 SKUs

Cores / CPU72–288

DIMM slots24

Backplanes4

Max bays6

Enclosure power parts1 · to 15,000 W

02 — Processors

6 supported processors, mapped

Lenovo lists six processors, and every node takes two of the same family. Five are Xeon 6900P parts with 72 to 128 performance cores at 400–550 W; the sixth is the Xeon 6990E+, with 288 efficiency cores at 450 W. All six are sold only in factory (CTO) builds, and the chart plots them by core count and power.

Processor landscape — cores × TDP

6 SKUs · 2 families

Xeon 6 E-core 1Xeon 6 6900P 5Bubble size = L3 cache · hover a bubble for the full SKU

Processor explorer

filter · sort · compare

Sort

Processor	Cores / threads	Base	L3 cache	TDP	W / core	Memory
Intel Xeon 6 6990E+	288 / 288	2.2 GHz	576 MB	450 W	1.6	DDR5-8000
Intel Xeon 6 6980P	128 / 256	2 GHz	504 MB	500 W	3.9	DDR5-6400
Intel Xeon 6 6966P-C	96 / 192	3.1 GHz	432 MB	550 W	5.7	DDR5-6400
Intel Xeon 6 6972P	96 / 192	2.4 GHz	480 MB	500 W	5.2	DDR5-6400
Intel Xeon 6 6952P	96 / 192	2.1 GHz	480 MB	400 W	4.2	DDR5-6400
Intel Xeon 6 6960P	72 / 144	2.7 GHz	432 MB	500 W	6.9	DDR5-6400

Every processor on the list has 12 DDR5 channels, six UPI 2.0 links at 24 GT/s and 96 PCIe 5.0 lanes, plus four instances of every built-in accelerator Lenovo tabulates: QAT, DLB, DSA and IAA.
The 6990E+ appears in Lenovo’s table with 288 cores and 288 threads, and it works only with the 64 GB 8000 MHz RDIMM; the P-core parts run 6400 MHz RDIMMs or 8800 MHz MRDIMMs.
The guide’s key-features list says a node supports one or two processors, but its processor section states that a one-processor configuration is not supported. This page follows the processor section.
Factory UEFI presets: the HPC profile (C3J8) is the default, with General Computing Power Efficiency, Peak Frequency and Max Performance as alternatives; Power Efficiency carries the ENERGY STAR and ErP Lot 9 settings.
Lenovo claims up to 10% more performance than an equivalent air-cooled system because the processors can stay in turbo continuously.

03 — Memory

24 DIMM slots, 12 per processor

Each processor drives 12 DDR5 channels at one DIMM per channel, which gives a node 24 slots. Lenovo supports only the fully populated case — 12 DIMMs per processor, all the same part number — and the processor family decides which DIMM you can use.

Capacity with every slot filled

by DIMM size

Rated memory speed

from the processor table

Processor family	Up to
Xeon 6 E-core	8000 MT/s
Xeon 6 6900P	6400 MT/s

With 6900P processors: RDIMMs of 32, 64, 96 or 128 GB at 6400 MHz, or a 64 GB MRDIMM at 8800 MHz. With the 6990E+: one 64 GB RDIMM at 8000 MHz, available in factory builds only.
The 3 TB node maximum is 24 × 128 GB RDIMMs and applies to 6900P processors; because the 6990E+ has only the 64 GB module, its nodes stop at 1.5 TB (24 × 64 GB).
The Double Sided Memory Cooling Kit — 16 cooling bars per tray, eight per server — is mandatory with any MRDIMM, with 128 GB RDIMMs, or when the inlet water is 40 °C or warmer.
Memory RAS: ECC and Bounded Fault correction, SDDC and ADDDC where x4 DIMMs are fitted, and mirroring, which halves usable capacity. Rank sparing is not supported.
Lenovo’s DCSC configurator shows four processors and 48 DIMM slots because it builds the whole two-node tray at once; per node the numbers are two and 24.

04 — Storage

4 backplane options, up to 6 bays

There are no hot-swap bays. A node holds up to six E3.S NVMe SSDs internally: two in each of its two front slot bays (or one E3.S 2T per bay) and one mounted on top of each processor. A front bay used for drives cannot also carry a PCIe adapter, so storage and networking trade against each other.

Headline layouts

front panel view

Front panel

Both front bays given to drives (2 + 2) plus the two processor-mounted drives: 92.16 TB with 15.36 TB SSDs. Only the onboard 25GbE and 1GbE ports remain for networking.

SAS/SATANVMeSAS/SATA + NVMe

Controllers & boot

Onboard NVMe ports (integrated in processor) — Boot. Drives connect to onboard NVMe controllers; RAID provided by Intel VROC
Intel VROC RAID1 Only (4L47A92670, BZ4W) — Software RAID. VROC NVMe RAID: RAID 1 only; Intel and non-Intel NVMe SSDs; FoD license
Intel VROC (VMD NVMe RAID) Standard (4L47A83669, BR9B) — Software RAID. VROC NVMe RAID: RAID 0/1/10; Intel and non-Intel NVMe SSDs; FoD license
Intel VROC (VMD NVMe RAID) Premium (4L47A39164, B96G) — Software RAID. VROC NVMe RAID: RAID 0/1/10/5; Intel and non-Intel NVMe SSDs; FoD license

Drive options are E3.S 1T PCIe 5.0 x4 trayless SSDs — Mixed Use at 1.6, 3.2, 6.4 and 12.8 TB, Read Intensive at 1.92, 3.84, 7.68 and 15.36 TB — every one SED-capable, with six per node at most.
Front bay 1 is wired to CPU 1; front bay 2 and both processor-mounted drives are wired to CPU 2.
RAID is Intel VROC on the onboard NVMe ports, sold as RAID1 Only, Standard (0, 1, 10) or Premium (adds RAID 5). RAID 1 arrays are capped at two drives and RAID 10 at four, ESXi supports RAID 1 only, and SED functions are unavailable with VROC RAID.
The guide lists no M.2 or other dedicated boot device, only the E3.S drives, and says VROC arrays can serve as boot volumes; the XCC3 MicroSD slot is for firmware and Remote Disc on Card storage.

Every documented backplane

4 with drive bays

2.5-inch3.5-inchEDSFF (E1.S / E3.S)

05 — I/O & networking

PCIe and networking

The SC750 V4 has no GPU support. For water-cooled NVIDIA GPUs Lenovo points to the SC777 V4 — a GB200 NVL4 tray that fits the same N1380 enclosure — and to the SR780a V3 and SD665-N V3.

I/O topology

96 lanes per CPU

The two Xeon 6900-series processors in a node talk over six UPI links at 24 GT/s, and each brings 96 PCIe 5.0 lanes and 12 memory channels. For connectivity each node has two front slots and three onboard network ports; the N1380 midplane carries power and control only, so every data link runs to top-of-rack switches.

Network adapters Lenovo lists

7 options

Adapter	Ports	Form
Broadcom 57414 2 x 25GbE SFP28 onboard	2 × 25GbE	LOM
Intel I210 1 x 1GbE RJ45 onboard	1 × 1GbE	LOM
ThinkSystem SC750 V4 NVIDIA ConnectX-7 NDR200/HDR/200GbE QSFP112 2-Port PCIe Gen5 x16 Adapter (SharedIO) DWC (4XC7A99370, BKSL)	2 × 200GbE / NDR200 InfiniBand	PCIe
ThinkSystem NVIDIA ConnectX-7 NDR OSFP400 1-Port PCIe Gen5 x16 InfiniBand Adapter DWC (4XC7A99368, BKSN)	1 × 400Gb NDR InfiniBand	PCIe
ThinkSystem NVIDIA ConnectX-7 NDR OSFP400 1-Port PCIe Gen5 x16 InfiniBand Adapter (SharedIO) DWC (4XC7A99369, BKSP)	1 × 400Gb NDR InfiniBand	PCIe
ThinkSystem NVIDIA ConnectX-8 8180 800Gbs XDR IB / 2x400GbE OSFP 1-Port PCIe Gen6 x16 DWC (Generic FW) (CTO only, CAGC)	1 × 800Gb XDR InfiniBand / 2x400GbE	PCIe
ThinkSystem Cornelis CN5000 Omni-Path 1-Port QSFP112 HFI SuperNIC DWC (Generic FW) (CTO only, CB7C)	1 × Omni-Path	PCIe

Adapters are all direct-water-cooled versions: ConnectX-7 NDR200/200GbE two-port and NDR OSFP400 one-port, ConnectX-8 8180 (800 Gb XDR InfiniBand or 2 × 400GbE, PCIe Gen6 x16) and the Cornelis CN5000 Omni-Path SuperNIC, at most two per node.
Shared I/O: the adapter sits in slot 1 of node B and an auxiliary cable connects it to the slot 1 connector of node A, one adapter per tray. The ConnectX-7 SharedIO versions and the ConnectX-8 support it.
Socket Direct: the adapter goes in slot 2 and a cable joins it to the slot 1 connector, which must then stay empty. By default the ConnectX-7 links at PCIe Gen5 and the auxiliary cable at Gen4, changeable in UEFI.
ConnectX-8 and CN5000 adapters use their own slot risers, which are CTO only; every other adapter uses the HHHL riser kits.
Lenovo describes the node as CXL 2.0 ready.

06 — Power & cooling

No supplies of its own — powered by the enclosure

Nothing in the tray converts mains power. The N1380 enclosure holds two, three or four hot-swap 15 kW Titanium power conversion stations, water-cooled like the nodes, which drive a 48 V busbar in the midplane that powers every tray from a single power domain.

Each station takes 380–480 V AC three-phase WYE at 30 A per phase through a Harting Han-ECO 10B connector; the physical-specifications section gives the input range as 180–528 V AC (200–480 V nominal).
Enclosure DC capacity by policy: without redundancy 15, 30 or 45 kW from one, two or three stations; N+1 gives 18 kW (1+1), 36 kW (2+1) or 54 kW (3+1); N+N with four stations gives 36 kW (2+2). Under N+1 a station fault cuts capacity to at most 15, 30 or 45 kW within one second, with Intel trays throttled proportionally; under 2+2 an AC-domain fault drops it to 30 kW.
Each station runs at 32 A, and Y-splitter cables let two stations share one 63 A feed, so a rack with 12 stations needs six data-centre connections.
Water: inlet from 2 °C to 45 °C (ASHRAE S45), bacteria-free below 100 CFU/ml, filtered to 50 microns and treated against biological growth and corrosion. At 45 °C each tray needs 3.0 L/min and each station 2.8 L/min — 35.2 L/min for eight trays and four stations.
Intermediate hose sets, stainless steel or EPDM, are chosen by the enclosure’s starting rack position (U1–U9, U10–U22 or U23–U36) and end in a 1.5-inch Tri-Clamp sanitary flange at the CDU side.
Lenovo quotes 7–10% direct energy savings against an air-cooled equivalent, from removing the fans and running the components cooler.

07 — Management, security & OS

Run it, secure it, choose the OS

Management

XClarity Controller 3 on an ASPEED AST2600 in every node; XCC3 Premier is an optional licence (7S0X000XWW)
System Management Module 3 in the N1380: enclosure power, thermal and inventory control, leak reporting and node virtual reseat
SMM3 daisy chain: a single Ethernet link manages up to 3 enclosures and 48 nodes
NC-SI management sharing on the onboard 1GbE port and 25GbE port 1 (factory features BEXZ / BEXY)
TI INA228 power meter sampling processor DC power at 100 Hz with better than 97% accuracy
Redfish, IPMI 2.0 (IPMI-over-LAN disabled by default), SNMPv3 and CIM-XML
Lenovo HPC & AI Software Stack with Confluent, Slurm, Slinky, Energy Aware Runtime and Open OnDemand
XClarity Administrator, Provisioning Manager (F1) and Energy Manager; OneCLI 5.x, UpdateXpress 5.x and BOMC 14.x or later

Security

Platform Firmware Resiliency hardware Root of Trust on the DC-SCM board (NIST SP 800-193)
TPM 2.0; Nationz TPM 2.0 module for China only
UEFI Secure Boot, which can be enabled in the factory (BPKQ)
NIST SP 800-147B compliant, with FIPS- and NIST-compliant firmware signing
System Guard with XCC3 Premier
Self-encrypting drives with KMIP key managers (IBM SKLM, Thales KeySecure)
Intel TDX, TME and TME-MK, CET, Boot Guard and SGX
CNSA Suite 1.0 cryptography for XCC; FIPS 140-3 validation listed as in progress

Operating systems

Red Hat Enterprise Linux 9.4, 9.6, 9.8, 10.0 and 10.2 with 6900P processors; 9.8 and 10.2 with the 6990E+
SUSE Linux Enterprise Server 15 SP6, 15 SP7 and 16 with 6900P processors; 16 with the 6990E+
Ubuntu 22.04, 24.04 and 26.04 LTS with 6900P processors; 24.04 and 26.04 with the 6990E+
VMware ESXi 9.1 (6900P processors only)
Rocky Linux and AlmaLinux certified or tested

08 — Compare

How the SC750 V4 compares with its family

The SC750 V4 shares the N1380 enclosure with the SC777 V4, Lenovo’s GB200 NVL4 tray. The SD665 V3 is a Neptune multi-node tray with AMD EPYC processors, the SD535 V3 a multi-node sled, the SR780a V3 one of the water-cooled GPU systems Lenovo suggests instead, and the SR650 V4 a Xeon 6 rack server for scale. The bars compare each model’s spec-file limits.

This modelSiblings and successorEach value from that model’s own verified spec file · bars scale per column

SC777 V4 data sheet SD665 V3 data sheet SD535 V3 data sheet SR780a V3 data sheet SR650 V4 data sheet Dell PowerEdge C6615 data sheet (multi-node)

09 — Use cases

Four builds that suit the SC750 V4

Four node builds for the cluster workloads Lenovo designs the SC750 V4 around, each drawn from the options our configurator allows on it. A node never ships alone: we quote the trays together with the N1380 enclosure, its power conversion stations and the hose sets for your rack position.

HPC · simulation

Bandwidth-hungry CFD node

Memory-bound codes such as CFD gain most from bandwidth, so this node pairs two 128-core 6980P processors with 24 MRDIMMs at 8800 MHz and a 400 Gb NDR InfiniBand link to the cluster fabric.

2 × Xeon 6 6980P — 128 cores @ 2 GHz, 500 W each
24 × 64 GB TruDDR5 MRDIMM at 8800 MHz — 1.5 TB
2 × 3.84 TB E3.S NVMe on the processor mounts
Intel VROC RAID1 Only — mirrored OS pair
ConnectX-7 NDR OSFP400 InfiniBand adapter (DWC)
Red Hat Enterprise Linux 9

MRDIMMs require the Double Sided Memory Cooling Kit. Both processor-mounted drives sit on CPU 2, which keeps the RAID 1 pair on one processor as Lenovo recommends.

Open this build in the configurator →

HPC · throughput

Core-dense grid and batch node

Two 288-core Xeon 6990E+ processors put 576 cores in one node for grid and financial-simulation farms that scale by core count. The 6990E+ takes only the 64 GB 8000 MHz RDIMM, so a full node has 1.5 TB.

2 × Xeon 6 6990E+ — 288 cores @ 2.2 GHz, 450 W each
24 × 64 GB TruDDR5 RDIMM at 8000 MHz — 1.5 TB
2 × 7.68 TB E3.S NVMe on the processor mounts
Intel VROC RAID1 Only
ConnectX-7 NDR200/200GbE 2-port QSFP112 adapter (DWC)
Ubuntu 24.04 LTS

The two-port ConnectX-7 is the SharedIO version, so one adapter can serve both nodes of a tray when fitted in node B’s slot 1 with the auxiliary cable; we confirm the per-tray cabling when quoting.

Open this build in the configurator →

Analytics · local scratch

Six-drive analytics node

Filling both front bays gives six E3.S SSDs per node — 92.16 TB with 15.36 TB drives — for local scratch or analytics data, at the cost of both PCIe slots, leaving the onboard 2 × 25GbE for traffic. The 96-core 6972P includes IAA for in-memory analytics and AMX for CPU-side deep learning.

2 × Xeon 6 6972P — 96 cores @ 2.4 GHz, 500 W each
24 × 96 GB TruDDR5 RDIMM at 6400 MHz — 2.25 TB
6 × 15.36 TB E3.S NVMe — 92.16 TB raw
Intel VROC Premium — adds RAID 5
Red Hat Enterprise Linux 9

Lenovo advises keeping each VROC array on one processor: here the drives in front bay 1 are on CPU 1 and the other four on CPU 2.

Open this build in the configurator →

Engineering · solvers

High-clock, 3 TB solver node

For solvers that reward clock speed and a large memory footprint, the 6966P-C has the highest base frequency on Lenovo’s list, 3.1 GHz across 96 cores at 550 W, and 24 × 128 GB RDIMMs give the node its full 3 TB.

24 × 128 GB TruDDR5 RDIMM at 6400 MHz — 3 TB
2 × 7.68 TB E3.S NVMe on the processor mounts
Intel VROC RAID1 Only
ConnectX-7 NDR OSFP400 InfiniBand adapter (DWC)
Ubuntu 22.04 LTS

128 GB RDIMMs need the Double Sided Memory Cooling Kit, as does any inlet water at 40 °C or above.

Open this build in the configurator →

10 — Full specifications

Lenovo ThinkSystem SC750 V4 Neptune specifications

Tray, enclosure & cooling

Form factor	Water-cooled tray with two independent 2-socket nodes, installed vertically in the N1380
Machine types	Tray 7DDJ · N1380 enclosure 7DDH · both CTO only, 3-year warranty
Tray dimensions	546 × 53 × 760 mm (W × H × D) · 799 mm deep with the rear water connections
Tray weight	37.2 kg maximum
N1380 enclosure	13U · 540 × 572 × 1302 mm · 8 trays (16 nodes) · up to 3 per 42U or 48U rack
Enclosure weight	94 kg empty · 485 kg with 4 stations and 8 trays (484.5 kg in the physical-specifications section)
Cooling	Direct water cooling of processors, memory, drives and adapters; no system fans
Water	Inlet 2–45 °C (ASHRAE S45) · 3.0 L/min per tray at 45 °C

Processor

Sockets	Two per node (one-processor nodes not supported)
Families	Intel Xeon 6900P (P-cores) · Intel Xeon 6900E+ (E-cores)
Cores	72 to 288 per processor
TDP	400 W to 550 W
UPI	6 × UPI 2.0 links at 24 GT/s
PCIe lanes	96 × PCIe 5.0 per processor

Memory

Slots	24 per node · 12 per processor · 12 channels × 1 DIMM
Population	12 DIMMs per processor only · one part number throughout
With 6900P	32, 64, 96 or 128 GB RDIMM at 6400 MHz · 64 GB MRDIMM at 8800 MHz
With 6990E+	64 GB RDIMM at 8000 MHz (CTO only)
Maximum	3 TB per node (24 × 128 GB RDIMM)
Protection	ECC, Bounded Fault, SDDC and ADDDC (x4 DIMMs), mirroring

Storage

Drives	Up to 6 × E3.S NVMe per node · internal, non-hot-swap
Locations	2 per front slot bay (or 1 × E3.S 2T) · 1 on top of each processor
Maximum	92.16 TB (6 × 15.36 TB)
RAID	Intel VROC on onboard NVMe: RAID1 Only, Standard (0/1/10) or Premium (0/1/10/5)
Optical	None internal · external USB drive

Expansion & networking

PCIe slots	1 or 2 × PCIe 5.0 x16 low profile per node, each in place of a drive bay
Onboard	2 × 25GbE SFP28 (Broadcom 57414) · 1 × 1GbE RJ45 (Intel I210)
Adapters	ConnectX-7 NDR200 / NDR OSFP400, ConnectX-8 8180, Cornelis CN5000 · all DWC · 2 per node
GPU	Not supported
CXL	CXL 2.0 ready

Power (N1380 enclosure)

Power conversion stations	2, 3 or 4 × 15 kW Titanium · water-cooled · hot-swap
Input	380–480 V AC three-phase WYE · 30 A per phase · Harting Han-ECO 10B
Distribution	48 V busbar through the midplane (power and control only)
Capacity	Up to 54 kW DC (3+1) · 45 kW without redundancy (3+0)
Policies	N+0, N+1 with oversubscription, or N+N (2+2)

Ports & video

Front, per node	VGA · USB-C DisplayPort · 2 × USB 3 (5 Gb/s) · RJ-45 XCC · mini-USB serial · diagnostics port
Video	16 MB, integrated in XCC3 · up to 1920 × 1200 at 60 Hz
Enclosure	2 × RJ45 for the SMM3 at the rear

Environment & warranty

Air temperature	5–40 °C operating (ASHRAE A3); 10–35 °C under A2
Humidity	8–85% operating (A3) · maximum dew point 24 °C
Altitude	3,048 m maximum
Warranty	3 years, CRU and onsite, 9 × 5 next business day

11 — FAQ

SC750 V4 questions, answered from the documentation

What is the Lenovo ThinkSystem SC750 V4?

It is a direct-water-cooled tray holding two separate two-socket servers built on Intel Xeon 6900-series processors. The tray runs only inside the 13U ThinkSystem N1380 Neptune enclosure, which holds eight trays — sixteen servers — and supplies their power, water and management.

Can the SC750 V4 run without the N1380 enclosure?

No. The tray has no power supplies or fans of its own: it plugs into the N1380 midplane for 48 V power and control, receives water through the enclosure manifold and is managed through the enclosure’s SMM3. The enclosure itself needs a coolant distribution unit and 380–480 V three-phase power.

What is the maximum memory of the SC750 V4?

3 TB per node, from 24 × 128 GB 6400 MHz RDIMMs with Xeon 6900P processors. All 12 channels per processor must be filled, and 128 GB RDIMMs and MRDIMMs need the Double Sided Memory Cooling Kit. With the Xeon 6990E+ the only supported DIMM is 64 GB, so those nodes reach 1.5 TB.

Which processors does the SC750 V4 support?

Six, fitted in pairs at the factory: the Xeon 6952P, 6960P, 6966P-C, 6972P and 6980P, with 72 to 128 P-cores, and the 288-core Xeon 6990E+. TDPs range from 400 W to 550 W, and single-processor nodes are not supported.

How much storage fits in an SC750 V4 node?

Up to six E3.S NVMe SSDs, all internal and non-hot-swap: two in each front bay and one on top of each processor, for 92.16 TB with 15.36 TB drives. Every front bay given to drives removes a PCIe slot, and RAID comes from Intel VROC rather than a controller.

Does the SC750 V4 support GPUs?

No. Lenovo offers no GPUs in the SC750 V4 and recommends the SC777 V4, SR780a V3 or SD665-N V3 for water-cooled NVIDIA GPUs. The SC777 V4 is a GB200 NVL4 tray for the same N1380 enclosure.

What water temperature does the SC750 V4 need?

The N1380 accepts inlet water between 2 °C and 45 °C (ASHRAE S45), and Lenovo designs it to run as cold as the dew point allows. At 45 °C each tray needs 3.0 L/min and each power conversion station 2.8 L/min, and Lenovo says chillers are unnecessary for most customers.

How is an SC750 V4 enclosure powered?

By two to four water-cooled 15 kW Titanium power conversion stations in the N1380, feeding a 48 V busbar shared by all eight trays. Depending on the policy the enclosure delivers up to 54 kW DC with 3+1 redundancy or 45 kW without, from 380–480 V three-phase WYE inputs at 30 A per phase.

How many SC750 V4 nodes fit in a rack?

Up to three N1380 enclosures fit a 42U or 48U rack, and each holds 16 nodes, so a rack takes 48 nodes and 96 processors. One SMM3 daisy chain can manage all three enclosures through a single Ethernet connection.

Is the Lenovo SC750 V4 end of life?

Lenovo’s July 2026 product guide still carries current ordering information for the SC750 V4 and gives no end-of-service date. The tray and the N1380 enclosure each come with three years of warranty, extendable through Lenovo Services. For lifecycle dates as Lenovo announces them, use the server end-of-life checker on this site.

Sources & verification

Where these figures come from

Lenovo ThinkSystem SC750 V4 Neptune Server (July 27, 2026) — Tray and N1380 specifications (Tables 1–2), processors (Tables 4–6), memory (Tables 7–9), storage and VROC (Tables 10–12), risers and adapters (Tables 13–14), cooling and water connections (Table 15), power conversion stations, policies and cables (Tables 17–19), management, security, OS support, dimensions (Table 28), operating environment and water flow.
Lenovo ThinkSystem SC777 V4 Neptune Server (July 15, 2026) — GB200 NVL4 platform of the sibling SC777 V4 tray named in the accelerators section and FAQ.

Specifications are extracted from Lenovo’s published documents and independently re-checked line by line. Configurations are quote-based; availability and exact options are confirmed at quotation. Last reviewed 2026-09-11.

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The SC750 V4 at a glance

Strengths

Watch-outs

6 supported processors, mapped

Processor landscape — cores × TDP

Processor explorer

24 DIMM slots, 12 per processor

Capacity with every slot filled

Rated memory speed

4 backplane options, up to 6 bays

Headline layouts

Controllers & boot

Every documented backplane

PCIe and networking

I/O topology

Network adapters Lenovo lists

No supplies of its own — powered by the enclosure

Run it, secure it, choose the OS

Management

Security

Operating systems

How the SC750 V4 compares with its family

Four builds that suit the SC750 V4

Bandwidth-hungry CFD node

Core-dense grid and batch node

Six-drive analytics node

High-clock, 3 TB solver node

Lenovo ThinkSystem SC750 V4 Neptune specifications

Tray, enclosure & cooling

Processor

Memory

Storage

Expansion & networking

Power (N1380 enclosure)

Ports & video

Environment & warranty

SC750 V4 questions, answered from the documentation

Where these figures come from

Buy & configure

Guides & family

Plan the water-cooled deployment

Support & lifecycle

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