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Technical data sheet · ProLiant Compute XD · 1U dual-socket HPC node, CLC or DLC

HPE ProLiant Compute XD230Specifications, configurations & comparisons

The ProLiant Compute XD230 is HPE’s 1U two-socket building block for HPC clusters: a pair of Xeon 6900P-series processors of up to 128 cores and 500 W each, twelve DDR5 channels per socket and no GPU option at all. HPE lists closed-loop and direct liquid cooling kits for it and no air-only kit, and that cooling choice decides which memory modules, how many drive kits and which riser mix a build can take. This page maps those trade-offs.

1U Rack2 socketsXeon 6 6900PHPE iLO 7
128cores per processor, maxXeon 6980P · 72–128 across 5 models
8800MT/sMRDIMM memory speed24 slots · 12 channels per CPU
3TBRDIMM maximum24 × 128 GB at 6400 MT/s
20E3.S EDSFF NVMe baysor 10 SFF U.3 NVMe bays
3PCIe 5.0 x16 slots, maxplus OCP A and OCP B
23.32kgnet weight1U · CLC or DLC cooling kit

Every figure checked against the HPE ProLiant Compute XD230 QuickSpecs (Version 18 - 03-Aug-2026)

Form factor
1U Rack · 2 sockets
Processors
Xeon 6 6900P
Memory
24 × DDR5 RDIMM · up to 3 TB
Drive bays
Up to 20 · 2 drive-cage kits
Expansion
3 × PCIe · 2 × OCP 3.0
Boot
NS204i · 2 boot options
Management
HPE iLO 7
01 — Overview

The XD230 at a glance

Our read of HPE’s documentation: where the XD230 is strong, and the limits worth knowing before you spec one.

Strengths

  • Up to 128 cores per socket from five Xeon 6900P models (72 to 128 cores, 400 W or 500 W), each rated for DDR5-6400 and for 8800 MT/s multiplexed-rank memory.
  • Twelve memory channels per processor with one DIMM each: 3 TB of RDIMM at 6400 MT/s, or MRDIMMs at 8800 MT/s where memory bandwidth is the bottleneck.
  • Two drive chassis types in 1U — twenty E3.S EC1 NVMe bays or ten SFF U.3 NVMe bays — plus a hot-plug NS204i-u M.2 boot device with RAID.
  • Made for rack-scale DLC: HPE’s rack manifolds connect 72 servers in a 42U rack or 84 in a 48U rack, fed by a 75 kW in-rack coolant distribution unit.
  • Two OCP 3.0 slots plus as many as three PCIe 5.0 x16 slots take InfiniBand (NDR, NDR200) and Ethernet cards, and iLO 7 manages the node with an OpenBMC route through Transfer of Ownership.

Watch-outs

  • The QuickSpecs list no GPU or other accelerator anywhere: this is a CPU-only node.
  • Closed-loop cooling with two processors caps EDSFF storage at two four-drive kits (eight E3.S), and the 64 GB MRDIMM is allowed only with the DLC kit.
  • DLC orders need HPE racks for factory integration, HPE’s DLC option list adds a CDU, a rack manifold and hose kits at one per rack, and a DLC build keeps just one low-profile and/or one full-height riser.
  • Every listed drive is NVMe — there are no SAS or SATA options — and the storage-controller notes contradict each other on which drive cages one controller can serve.
  • The printed depth does not add up: 30.04 in and 86.47 cm are given for the same dimension.
Processors5 SKUs
Cores / CPU72–128
DIMM slots24
Drive-cage kits2
Max bays20
PSU options3 · to 3,200 W
02 — Processors

5 supported processors, mapped

Five Xeon 6900P-series parts with P-cores, all supplied as factory-integrated kits: 72, 96, 120 and 128 cores, with the 96-core 6952P the only one rated at 400 W instead of 500 W. Every model reaches 3.9 GHz and supports DDR5-6400 and 8800 MT/s MCR memory.

Processor landscape — cores × TDP

5 SKUs · 1 family
HPE ProLiant Compute XD230: every supported processor by cores and TDP081624324048566472808896104112120128400 W450 W500 WCores per processorIntel Xeon 6980P — 128 cores · 500 W · 2 GHz base · 504 MB cache · DDR5-6400Intel Xeon 6978P — 120 cores · 500 W · 2.1 GHz base · 504 MB cache · DDR5-6400Intel Xeon 6972P — 96 cores · 500 W · 2.4 GHz base · 480 MB cache · DDR5-6400Intel Xeon 6952P — 96 cores · 400 W · 2.1 GHz base · 480 MB cache · DDR5-6400Intel Xeon 6960P — 72 cores · 500 W · 2.7 GHz base · 432 MB cache · DDR5-64006980P128 cores · 3.9 W/core — top SKU and most efficient
Xeon 6 6900P 5Bubble size = L3 cache · hover a bubble for the full SKU

Processor explorer

filter · sort · compare
ProcessorCores / threadsBaseL3 cacheTDPW / coreMemory
Intel Xeon 6980P1282 GHz504 MB500 W3.9DDR5-6400
Intel Xeon 6978P1202.1 GHz504 MB500 W4.2DDR5-6400
Intel Xeon 6972P962.4 GHz480 MB500 W5.2DDR5-6400
Intel Xeon 6952P962.1 GHz480 MB400 W4.2DDR5-6400
Intel Xeon 6960P722.7 GHz432 MB500 W6.9DDR5-6400
  • The Standard Features text quotes base clocks of “up to 2.0 GHz”, but the processor table and kit names run from 2.0 GHz (6980P) to 2.7 GHz (6960P); the page shows the per-model figures.
  • Processors cannot be mixed, and HPE warns that limitations may apply to some models without naming them.
  • Per-processor entries in HPE’s table: cache from 432 MB (6960P) to 504 MB (6980P and 6978P), and a 3 TB maximum-memory figure for every model.
  • The QuickSpecs do not describe the socket-to-socket interconnect; the overview credits each processor with 96 PCIe lanes.
03 — Memory

24 DIMM slots, 12 per processor

Twenty-four DIMM slots, twelve per processor on twelve channels, one DIMM per channel. Registered DDR5-6400 modules from 32 GB to 128 GB reach 3 TB; the multiplexed-rank modules (32 GB and 64 GB) run at 8800 MT/s, which with 24 × 64 GB comes to 1.5 TB by our arithmetic.

Capacity with every slot filled

by DIMM size
32 GB768 GB64 GB1.5 TB96 GB2.3 TB128 GB3 TB24 slots · 12 per processor · each tick = one DIMM

Rated memory speed

from the processor table
Processor familyUp to
Xeon 6 6900P6400 MT/s
  • The 64 GB MRDIMM (P76828-H21) is allowed only with the Direct Liquid Cooling kit, so a closed-loop build that wants 8800 MT/s tops out at 24 × 32 GB — 768 GB.
  • Picking the 128 GB RDIMM or the 32 GB MRDIMM together with the closed-loop kit limits the server to two 4EDSFF backplane kits.
  • DIMM types and sizes cannot be mixed. HPE calls the fast modules MCRDIMM in the memory table and “DDR5-88/44 … Multiplexed Rank” kits in the part list.
  • HPE notes that a DIMM’s availability on the platform depends on completing certification testing.
04 — Storage

2 drive-cage kits, up to 20 bays

HPE builds the XD230 in one of two drive chassis: an EDSFF version with five four-bay E3.S backplane kits (20 EC1 bays) or an SFF version with five two-bay U.3 kits (10 BC bays). The drive count follows the number of kits ordered, every listed drive is NVMe, and an optional NS204i-u boot device holds two M.2 SSDs with RAID.

Headline layouts

front panel view

Front panel

Five 4EDSFF NVMe stacking backplane kits (P72221-B21). The closed-loop cooling rules stop short of this: with two processors, CLC orders take two kits at most.

SAS/SATANVMeSAS/SATA + NVMe

Controllers & boot

  • HPE NS204i-u Gen11 NVMe Hot Plug Boot Optimized Storage Device — Boot. RAID1 hot-plug M.2 NVMe boot device; connects to Boot Optimized Storage Device connector (NS204i-u signal); Step 4 factory-integrated option
  • HPE NS204i-u v2 960GB NVMe SED Hot Plug Boot Optimized Storage Device — Boot. RAID1 hot-plug M.2 NVMe boot device; connects to Boot Optimized Storage Device connector (NS204i-u signal); Step 4 factory-integrated option; self-encrypting
  • HPE MR416i-p Gen11 x16 Lanes 8GB Cache PCI SPDM Plug-in Storage Controller — RAID, 8GB cache. PCIe plug-in; requires battery/hybrid capacitor and 'HPE XD230 Controller Signal Cable Kit'
  • HPE MR416i-o Gen11 x16 Lanes 8GB Cache OCP SPDM Storage Controller — RAID, 8GB cache. OCP (OROC); requires battery/hybrid capacitor and 'HPE XD230 OROC Signal Cable'
  • HPE MR216i-p Gen11 x16 Lanes without Cache PCI SPDM Plug-in Storage Controller — RAID. PCIe plug-in; no cache
  • HPE MR216i-o Gen11 x16 Lanes without Cache OCP SPDM Storage Controller — RAID. OCP (OROC); no cache
  • HPE MR408i-o Gen11 x8 Lanes 4GB Cache OCP SPDM Storage Controller — RAID, 4GB cache. OCP (OROC); requires battery/hybrid capacitor and 'HPE XD230 OROC Signal Cable' or 'HPE XD230 MR408i-o Signal Cable Kit'
  • HPE MR408i-p Gen11 x8 Lanes 4GB Cache PCI SPDM Plug-in Storage Controller — RAID, 4GB cache. PCIe plug-in; requires battery/hybrid capacitor and 'HPE XD230 Controller Signal Cable Kit' or 'HPE XD230 MR408i-p Signal Cable Kit'
  • HPE NS204i-u Gen11 NVMe Hot Plug Boot Optimized Storage Device (P48183-B21) — boot
  • HPE NS204i-u v2 960GB NVMe SED Hot Plug Boot Optimized Storage Device (P81162-B21) — boot
All 9 controllers and 2 boot options
  • HPE MR932i-p x32 Lanes PCIe Gen5 SPDM Plug-in Storage Controller — RAID. PCIe Gen5 plug-in, x32 lanes; cache not stated in this document; added in Version 17
  • E3.S EC1 options are PCIe Gen5 SSDs from 1.6 TB to 15.36 TB across Mainstream CD8P, High Performance PS1010 and PS1030, and FIPS 140-3 CM7 self-encrypting models.
  • SFF BC options are U.3 NVMe Gen4 SSDs from 800 GB to 15.36 TB, including FIPS 140-3 CM7 self-encrypting drives.
  • The controller notes clash: one says a controller serves up to two SFF cages or one EDSFF cage, others say one SFF cage only and never an EDSFF cage. Each MR controller needs an HPE battery or hybrid capacitor.
  • Boot capacity is inconsistent too: the internal-storage table shows 2 × 480 GB (960 GB), while Standard Features also offers two 960 GB SSDs with the NS204i-u.
  • The QuickSpecs list no software RAID option.

Every documented drive-cage kit

2 with drive bays
HPE ProLiant Compute DL3XX Gen12 1U 2SFF x4 Tri-Mo…HPE ProLiant Compute DL3XX Gen12 1U 2SFF x4 Tri-Mode U.3 Stacking Backplane Kit2HPE ProLiant Compute DL3XX Gen12 1U 4EDSFF NVMe St…HPE ProLiant Compute DL3XX Gen12 1U 4EDSFF NVMe Stacking Backplane Kit4Bays · solid = front · dashed = rear · brighter = NVMe-only
2.5-inch3.5-inchEDSFF (E1.S / E3.S)
05I/O & networking

PCIe and networking

I/O topology

96 lanes per CPU
CPU 196 × PCIe 5.012 ch · 12 DIMMCPU 296 × PCIe 5.012 ch · 12 DIMMUp to 3 × PCIe 5.0 x16FH or LP riser kits · CPU1 & 2DLC: 1 FH and/or 1 LPCLC: 2 FHHL or 3 HHHL2 × OCP 3.0 (A and B)10 GbE to 100 GbE adaptersiLO 7 on DC-SCM modulerear iLO port + front service port

HPE’s overview gives each Xeon 6900P socket 96 PCIe lanes. At the rear, full-height or low-profile x16 PCIe 5.0 riser kits wired to both processors provide up to three slots, beside OCP A, OCP B and a dedicated iLO port.

Network adapters HPE lists

11 options
AdapterPortsForm
Broadcom BCM57416 Ethernet 10Gb 2-port BASE-T OCP3 Adapter for HPE2 × 10GbEOCP 3.0
Intel E810-XXVDA2 Ethernet 10/25Gb 2-port SFP28 OCP3 Adapter for HPE2 × 10/25GbEOCP 3.0
Broadcom BCM57414 Ethernet 10/25Gb 2-port SFP28 OCP3 Adapter for HPE2 × 10/25GbEOCP 3.0
Intel E810-CQDA2 Ethernet 100Gb 2-port QSFP28 OCP3 Adapter for HPE2 × 100GbEOCP 3.0
Broadcom BCM57412 Ethernet 10Gb 2-port SFP+ OCP3 Adapter for HPE2 × 10GbEOCP 3.0
Broadcom BCM57504 Ethernet 10/25Gb 4-port SFP28 OCP3 Adapter for HPE4 × 10/25GbEOCP 3.0
Intel E810-XXVDA4 Ethernet 10/25Gb 4-port SFP28 OCP3 Adapter for HPE4 × 10/25GbEOCP 3.0
Mellanox MCX631432AS-ADAI Ethernet 10/25Gb 2-port SFP28 OCP3 Adapter for HPE2 × 10/25GbEOCP 3.0
HPE InfiniBand NDR/Ethernet 400Gb 1-port OSFP PCIe5 x16 MCX75310AAS-NEAT Adapter1 × 400Gb InfiniBand NDR / 400GbEPCIe
HPE InfiniBand NDR200/Ethernet 200GbE 2-port QSFP112 PCIe5 x16 MCX755106AC-HEAT Adapter2 × 200Gb InfiniBand NDR200 / 200GbEPCIe
HPE InfiniBand NDR/Ethernet 400 GB 1-port OSFP Gen Adapter1 × 400Gb InfiniBand NDR / 400GbEPCIe
  • Riser rules: one full-height riser leaves room for one low-profile riser, two full-height risers leave none, and with no full-height riser up to three low-profile risers fit.
  • With the DLC kit the only riser choices are one low-profile and/or one full-height; HPE shows the closed-loop rear as two FHHL or three HHHL slots and the DLC rear as one of each.
  • Fabric cards listed: HPE NDR 400Gb 1-port OSFP (MCX75310AAS-NEAT, plus a “Gen” variant, P45641-H24) and NDR200 / 200GbE 2-port QSFP112 (MCX755106AC-HEAT), both PCIe5 x16. The overview mentions Slingshot at 200 and 400 Gbps, yet no Slingshot adapter is listed.
  • Eight OCP 3.0 Ethernet cards run from 2 × 10GBASE-T to 2 × 100 GbE QSFP28; the only built-in network port HPE lists is for iLO.
06 — Power & cooling

3 power supplies, 2,400–3,200 W

One or two M-CRPS Titanium supplies per server, at least one required, chosen from 2400 W and 3200 W units with C20 inlets or a 2800 W 277 V AC unit. All three are rated at 96% efficiency, and HPE quotes up to 6400 W of power for a single node fitted with two 3200 W units.

05001000150020002500300035002400 W Titanium — HPE 2400W M-CRPS Titanium Hot Plug Power Supply Kit; M-CRPS family; C20 connector; rated 96% efficiency; input voltage range not printed in this doc2400Titanium2800 W Titanium — HPE 2800W M-CRPS 277VAC Titanium Hot Plug Power Supply Kit; M-CRPS family; rated 96% efficiency; added in Version 172800Titanium3200 W Titanium — HPE 3200W M-CRPS Titanium Hot Plug Power Supply Kit; M-CRPS family; C20 connector; rated 96% efficiency; input voltage range not printed in this doc3200TitaniumWatts · dashed line = output at 100–120 V low line
AC277 VAC / HVDC
  • HPE points to its Power Advisor tool for the draw of a given configuration rather than printing figures in the QuickSpecs.
  • The order steps offer only the closed-loop and DLC kits, yet the ARCS and rear-door heat exchanger paragraphs refer to “air cooled” XD230 racks; the document does not say which build that means.
  • For DLC racks HPE lists a 75 kW, 208 V in-rack CDU (4U, mounted at the bottom of the rack) along with leak-detection, fill-and-drain and hose kits.
  • HPE’s PDU list includes HPE Cray Supercomputer three-phase “24 CX” units at 60 A 415 V and 63 A 400 V, and metered three-phase models from 34.5 kVA to 69.1 kVA.
  • The internal view shows seven fans. Standard inlet is 10–35 °C; 5–10 °C, 35–40 °C and 40–45 °C apply only to approved configurations, and above 30 °C inlet, or with one fan down, HPE says performance may fall.
07 — Management, security & OS

Run it, secure it, choose the OS

Management

  • HPE iLO 7 on a factory-fitted DC-SCM module (P77597-B21)
  • Optional iLO Advanced and HPE OneView Advanced licences
  • HPE Performance Cluster Manager — one licence per node
  • OpenBMC through the iLO Transfer of Ownership process
  • Redfish API · HPE MPI and Mellanox UFM fabric software

Security

  • HPE XD Hardware Root of Trust
  • UEFI Secure Boot and Secure Start
  • Digitally signed updates and Secure Recovery
  • Runtime Firmware Validation
  • Optional TPM module kit
  • OpenSSL 3.0

Operating systems

  • Families named: Windows Server, VMware ESXi, RHEL, SLES and Ubuntu
  • Releases and certification: HPE Servers Support & Certification Matrices
08 — Compare

How the XD230 compares with its family

Of the three XD systems on this site, the XD230 is the CPU-only one; the XD685 (AMD EPYC) and XD690 (Xeon 6) each carry an eight-GPU board. Its drive kits carry “DL3XX Gen12 1U” part names, and in the ProLiant DL line the 1U DL360 Gen12 and the 4U DL380a Gen12 also run Xeon 6.

XD230XD685Compute XD690DL360 Gen12DL380a Gen12Cores / CPUXD230: 128128XD685: 9696Compute XD690: 6464DL360 Gen12: 144144DL380a Gen12: 144144DIMM slotsXD230: 2424XD685: 2424Compute XD690: 3232DL360 Gen12: 3232DL380a Gen12: 3232Max memoryXD230: 3 TB3XD685: 3 TB3Compute XD690: 3 TB3DL360 Gen12: 8 TB8DL380a Gen12: 8 TB8Max drive baysXD230: 2020XD685: 1212Compute XD690: 88DL360 Gen12: 2020DL380a Gen12: 1616Max GPUsXD230: 00XD685: 88Compute XD690: 88DL360 Gen12: 33DL380a Gen12: 1010Largest PSUXD230: 3,200 W3,200XD685: 3,000 W3,000Compute XD690: 3,200 W3,200DL360 Gen12: 2,200 W2,200DL380a Gen12: 3,200 W3,200
This modelSiblings and successorEach value from that model’s own verified spec file · bars scale per column
09 — Use cases

Four builds that suit the XD230

Four XD230 builds, each tied to a cooling kit because the kit decides which memory and storage rules apply. Every part passes the configurator’s XD230 checks; the cooling kit, riser kits and extra backplane kits are added when we quote.

Bandwidth-bound HPC

DLC node on 8800 MT/s MRDIMM

HPE presents MRDIMMs as a way to ease memory-bandwidth bottlenecks in HPC applications. The 64 GB module is the larger of the two and needs the DLC kit; twenty-four of them give 1.5 TB at 8800 MT/s behind two 128-core 6980P processors.

  • 2 × Xeon 6980P128 cores @ 2 GHz, 500 W each
  • 24 × 64 GB DDR5-8800 MRDIMM — 1.5 TB, one per channel
  • XD230 Direct Liquid Cooling FIO kit (P76166-B21), required by this MRDIMM — added at quote
  • 4 × 7.68 TB E3.S EC1 NVMe on one 4EDSFF stacking backplane kit
  • NS204i-u boot device — two M.2 NVMe SSDs with RAID
  • HPE NDR200 / 200GbE 2-port QSFP112 PCIe5 adapter
  • 2 × 3200 W M-CRPS Titanium supplies
  • Red Hat Enterprise Linux 9, three-year subscription

DLC needs HPE racks for factory integration, an in-rack CDU and a rack manifold, and it limits the server to one low-profile and/or one full-height riser. We confirm the RHEL release against HPE’s certification matrix.

Open this build in the configurator →
Large-memory nodes

3 TB closed-loop node

For jobs that need capacity more than peak bandwidth, 128 GB RDIMMs fill all 24 slots to the 3 TB maximum at 6400 MT/s. The closed-loop kit keeps the order clear of the DLC rack items — CDU, manifold and hoses — at the cost of a two-kit EDSFF limit.

  • 2 × Xeon 6978P120 cores @ 2.1 GHz, 500 W each
  • 24 × 128 GB DDR5-6400 RDIMM — 3 TB, the documented maximum
  • XD230 Closed-loop Liquid Cooling FIO kit (P76165-B21) — added at quote
  • 4 × 7.68 TB E3.S EC1 NVMe — one more 4EDSFF kit is the most CLC allows
  • NS204i-u boot device — two M.2 NVMe SSDs with RAID
  • Intel E810-CQDA2 2 × 100 GbE QSFP28 OCP3 adapter
  • 2 × 3200 W M-CRPS Titanium supplies
  • SUSE Linux Enterprise Server

With 128 GB RDIMMs and the closed-loop kit, HPE allows no more than two 4EDSFF backplane kits, so eight E3.S drives.

Open this build in the configurator →
Local NVMe scratch

SFF chassis node with U.3 drives

The SFF chassis trades EDSFF for ten U.3 bays across five two-drive kits, for nodes that stage job data on local 2.5-inch NVMe. The 72-core 6960P has the highest base clock in the range, 2.7 GHz.

  • 2 × Xeon 6960P72 cores @ 2.7 GHz, 500 W each
  • 24 × 64 GB DDR5-6400 RDIMM — 1.5 TB
  • 2 × 7.68 TB SFF U.3 NVMe on one 2SFF x4 tri-mode stacking kit
  • Up to five 2SFF kits (10 bays) — further kits and drives set on the quote
  • NS204i-u boot device — two M.2 NVMe SSDs with RAID
  • Intel E810-XXVDA4 4 × 10/25 GbE SFP28 OCP3 adapter
  • 2 × 2400 W M-CRPS Titanium supplies (C20 inlets)
  • Red Hat Enterprise Linux 9

The cooling kit — closed-loop or DLC — is chosen at quote. HPE’s controller notes disagree on how many SFF cages one MR controller serves, so any hardware-RAID layout is checked with HPE before ordering.

Open this build in the configurator →
Power-limited racks

400 W 6952P node

The 96-core 6952P is the one 400 W part in the range, 100 W per socket under the others, while keeping 96 cores and the same memory support — a fit where the power budget per node is the constraint.

  • 2 × Xeon 6952P96 cores @ 2.1 GHz, 400 W each
  • 24 × 96 GB DDR5-6400 RDIMM — 2.25 TB
  • 2 × 7.68 TB E3.S EC1 NVMe on one 4EDSFF kit
  • NS204i-u boot device — two M.2 NVMe SSDs with RAID
  • Intel E810-XXVDA2 2 × 10/25 GbE SFP28 OCP3 adapter
  • 2 × 2400 W M-CRPS Titanium supplies
  • Operating system supplied by you, e.g. your cluster image

HPE’s Power Advisor gives the actual draw for a configuration. The cooling kit is added at quote.

Open this build in the configurator →
10 — Full specifications

HPE ProLiant Compute XD230 specifications

Chassis & cooling

Form factor1U rack, two sockets
DimensionsH 4.3 cm (1.69 in) · W 43.46 cm (17.11 in) · depth printed as 30.04 in and as 86.47 cm
Net weight23.32 kg (51.41 lb)
Shipping35.55 kg (10 SFF build) · 24.2 × 60 × 110 cm
Cooling kitsClosed-loop Liquid Cooling FIO (P76165-B21) · Direct Liquid Cooling FIO (P76166-B21) with DLC cage kit (P77598-B21)
FansSeven (#1–#7)
Inlet temperature10–35 °C standard · 5–10, 35–40 and 40–45 °C for approved configurations
Rack coolingCompatible with HPE ARCS and RDHX

Processor

SocketsTwo
FamilyIntel Xeon 6900P series (P-cores), five models
Cores72 · 96 · 120 · 128
TDP400 W (6952P) · 500 W (other four)
Clocks2.0–2.7 GHz base · 3.9 GHz maximum
Cache432–504 MB

Memory

Slots24 · 12 channels per processor · 1 DIMM per channel
RDIMM32, 64, 96, 128 GB DDR5-6400
MRDIMM32 and 64 GB DDR5-8800 (64 GB needs the DLC kit)
Maximum3 TB (24 × 128 GB RDIMM)

Storage

EDSFF chassis20 × E3.S EC1 NVMe Gen5 (5 × P72221-B21)
SFF chassis10 × SFF BC U.3 NVMe Gen4 (5 × P72223-B21)
BootNS204i-u Gen11 (P48183-B21) or NS204i-u v2 960GB SED (P81162-B21), RAID
ControllersMR216i-o/-p · MR408i-o/-p · MR416i-o/-p · MR932i-p

Expansion & networking

PCIeUp to 3 × PCIe 5.0 x16 via full-height and low-profile riser kits
OCP2 × OCP 3.0 (slots A and B)
InfiniBandNDR 400Gb OSFP · NDR200 2 × 200GbE QSFP112 (PCIe5 x16)
Built-iniLO management port only

Power

Supplies1–2 M-CRPS Titanium, 96% efficiency
Ratings2400 W (C20) · 3200 W (C20) · 2800 W 277 V AC
Maximum6400 W per node (HPE figure)

Ports & management

FrontiLO service port · USB 3.2 Gen1
ReariLO port · USB 3.2 Gen1 · VGA · OCP A/B
USB total2 external + 1 internal USB 3.2 Gen1
ManagementHPE iLO 7 (DC-SCM module P77597-B21)
Environment8–90% RH operating · 3050 m operating altitude
11 — FAQ

XD230 questions, answered from the documentation

What is the HPE ProLiant Compute XD230?

A 1U, two-socket server that HPE aims at scale-out HPC and enterprise data centres. It takes Intel Xeon 6900P-series processors, 24 DDR5 DIMMs and all-NVMe storage, and HPE lists only liquid cooling kits for it — closed-loop or direct liquid cooling.

Does the XD230 support GPUs?

No. The QuickSpecs list no GPU or accelerator option, and the PCIe cards it does list are networking and storage adapters. HPE’s GPU-dense XD systems are the XD685 and XD690, each built around an eight-GPU board.

How much memory does the XD230 take?

Up to 3 TB: all 24 slots filled with 128 GB DDR5-6400 RDIMMs, since each of the twelve channels per socket takes a single DIMM. MRDIMMs run at 8800 MT/s in 32 GB or 64 GB sizes; the 64 GB module needs the DLC kit, and memory types cannot be mixed.

Which processors does the XD230 support?

Five Xeon 6900P-series models: 6980P (128 cores), 6978P (120), 6972P and 6952P (96 each) and 6960P (72). All are 500 W parts except the 400 W 6952P, and all reach 3.9 GHz. It is a two-processor server and models cannot be mixed.

How many drives fit in the XD230?

Twenty E3.S EC1 NVMe drives in the EDSFF chassis or ten SFF U.3 NVMe drives in the SFF chassis, with one backplane kit per four or two bays. With the closed-loop cooling kit and two processors HPE limits EDSFF builds to two kits, or eight drives. Boot can go on an optional NS204i-u with a RAID-protected pair of M.2 SSDs.

What is the difference between closed-loop and DLC XD230 builds?

Closed-loop builds keep up to three rear PCIe slots (two FHHL or three HHHL) but with two processors are capped at eight E3.S drives, and they cannot take the 64 GB MRDIMM. DLC builds need HPE racks for factory integration, with a coolant distribution unit and rack manifold listed per rack; they allow only one low-profile and/or one full-height riser, and are the only route to the 64 GB MRDIMM.

What power supplies does the XD230 use?

One or two M-CRPS Titanium supplies rated at 96% efficiency: 2400 W or 3200 W with C20 inlets, or a 2800 W 277 V AC model. HPE quotes up to 6400 W for a node running two 3200 W supplies.

How is the XD230 managed?

Through HPE iLO 7 on a factory-fitted DC-SCM module, with a rear iLO port and a front service port. iLO Advanced, OneView Advanced and HPE Performance Cluster Manager are optional, and the node can move to OpenBMC through iLO’s Transfer of Ownership process.

How big and heavy is the XD230?

It is 1U: 4.3 cm high and 43.46 cm wide, and it weighs 23.32 kg. HPE prints the depth as 30.04 in and as 86.47 cm, which are different lengths, so we confirm the depth with HPE before planning rack space.

Is the HPE ProLiant Compute XD230 end of life?

HPE first published its QuickSpecs in February 2025 and revised them to Version 18 in August 2026; the current version gives no end-of-sale or end-of-support date. Once HPE announces dates, they appear in our server end-of-life checker.

Sources & verification

Where these figures come from

Specifications are extracted from HPE’s published documents and independently re-checked line by line. Configurations are quote-based; availability and exact options are confirmed at quotation. Last reviewed 2026-09-11.

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