The PowerEdge T560 is Dell’s two-socket 4.5U tower built on 4th and 5th Gen Intel Xeon Scalable processors, with 16 DDR5 RDIMM slots, up to 24 drive bays and room for two double-wide GPUs. What a build can run comes down to three choices worked through below: the fan kit and riser layout, which Dell’s guide ties to particular processors, drives and cards, and the power supplies, whose output depends on the mains voltage.
Tower1 or 2 sockets4th Gen Xeon Scalable5th Gen Xeon ScalableiDRAC9
2Front USB 2.0, USB 3.0 and iDRAC Direct (Micro-AB USB)
3Twelve 3.5-inch SAS/SATA bays
Image: Dell Technologies
Form factor
Tower · 2 sockets
Processors
4th Gen Xeon · 5th Gen Xeon
Memory
16 × DDR5 RDIMM · up to 1.5 TB
Drive bays
Up to 24 · 6 drive-bay layouts
Expansion
6 × PCIe · 1 × OCP 3.0
GPUs
Up to 6 · 5 listed
Boot
M.2 and BOSS · 2 boot options
Management
iDRAC9
01 — Overview
The T560 at a glance
Our read of Dell’s documentation: where the T560 is strong, and the limits worth knowing before you spec one.
Strengths
+Two 4th or 5th Gen Xeon Scalable processors, up to 32 cores each, with 80 PCIe 5.0 lanes per processor and up to three UPI links between them.
+Six front storage configurations, from 8 × 2.5-inch to 24 × 2.5-inch or 12 × 3.5-inch SAS/SATA plus an 8 × 3.5-inch + 8 × NVMe mix; the twelve-bay 3.5-inch option is new against the T550.
+Up to six PCIe slots, two of them x16 Gen5 on GPU risers, with room for two double-wide 300 W GPUs or six single-wide cards.
+Eleven power supply choices from 600 W to 2800 W, with DC-input (−48 V) and high-voltage (277 VAC or 336 V DC) versions alongside the AC units.
+The RAID controller mounts on the front storage module (fPERC), up to the PERC H965i with 8 GB of cache, so it spends no PCIe slot.
Watch-outs
!The fan kit sets the ceiling: three or four standard fans stop at 185 W processors, and double-wide 300 W cards need eight high-performance (HPR) fans.
!The technical guide calls it suited to an attended data centre, though it adds that the right hardware or software settings lower the noise, while the spec sheet calls it office-friendly; Dell measured 35–43 dB idle and up to 72 dB operating across its test builds.
!Two-riser GPU layouts need both processors, slots 3 and 4 are wired to processor 2, and the UPI entry for the 5512U reads N/A.
!Dell’s tables cover one DIMM per channel only, 96 GB modules need HPR fans, and the guide’s own comparison table prints 1 TB where the spec sheet says 1.5 TB.
!Heavy and deep: up to 48 kg with twelve 3.5-inch drives, and 678.2 mm front to back with the bezel.
Processors21 SKUs
Cores / CPU8–32
DIMM slots16
Drive layouts6
Max bays24
GPUsup to 6
PSU options11 · to 2,800 W
02 — Processors
21 supported processors, mapped
Dell lists 21 processors for the T560: fifteen 4th Gen Xeon Scalable and six 5th Gen parts, from the 8-core 3408U at 125 W to the 32-core 6448Y, 6438Y+ and 6438M at 205–225 W. The chart sets each against cores and TDP. Nothing on the list exceeds 225 W, although Dell quotes a 250 W platform maximum, and the 5th Gen list stops at 28 cores.
Processor landscape — cores × TDP
21 SKUs · 2 families
4th Gen Xeon Scalable 155th Gen Xeon Scalable 6Bubble size = L3 cache · hover a bubble for the full SKU
Processor explorer
filter · sort · compare
Processor
Cores / threads
Base
L3 cache
TDP
W / core
Memory
Intel Xeon Gold 6448Y
32 / 64
2.1 GHz
60 MB
225 W
7.0
DDR5-4800
Intel Xeon Gold 6438Y+
32 / 64
2 GHz
60 MB
205 W
6.4
DDR5-4800
Intel Xeon Gold 6438M
32 / 64
2.2 GHz
60 MB
205 W
6.4
DDR5-4800
Intel Xeon Gold 5420+
28 / 56
2 GHz
53 MB
205 W
7.3
DDR5-4400
Intel Xeon Gold 5512U
28 / 56
2.1 GHz
52.5 MB
185 W
6.6
DDR5-4800
Intel Xeon Gold 6442Y
24 / 48
2.6 GHz
60 MB
225 W
9.4
DDR5-4800
Intel Xeon Gold 5418Y
24 / 48
2 GHz
45 MB
185 W
7.7
DDR5-4400
Intel Xeon Gold 5412U
24 / 48
2.1 GHz
45 MB
185 W
7.7
DDR5-4400
Intel Xeon Silver 4416+
20 / 40
2 GHz
38 MB
165 W
8.3
DDR5-4000
Intel Xeon Gold 6426Y
16 / 32
2.5 GHz
38 MB
185 W
11.6
DDR5-4800
Intel Xeon Gold 5416S
16 / 32
2 GHz
30 MB
150 W
9.4
DDR5-4400
Intel Xeon Gold 6526Y
16 / 32
2.8 GHz
37.5 MB
195 W
12.2
DDR5-5200
Intel Xeon Silver 4514Y
16 / 32
2 GHz
30 MB
150 W
9.4
DDR5-4400
Intel Xeon Silver 4410Y
12 / 24
2 GHz
30 MB
150 W
12.5
DDR5-4000
Intel Xeon Silver 4510
12 / 24
2.4 GHz
30 MB
150 W
12.5
DDR5-4400
Intel Xeon Silver 4410T
10 / 20
2.7 GHz
27 MB
150 W
15.0
DDR5-4000
Intel Xeon Gold 6434
8 / 16
3.7 GHz
23 MB
205 W
25.6
DDR5-4800
Intel Xeon Gold 5415+
8 / 16
2.9 GHz
23 MB
150 W
18.8
DDR5-4400
Intel Xeon Bronze 3408U
8 / 16
1.8 GHz
23 MB
125 W
15.6
DDR5-4000
Intel Xeon Gold 6534
8 / 16
3.9 GHz
22.5 MB
195 W
24.4
DDR5-4800
Intel Xeon Silver 4509Y
8 / 16
2.6 GHz
23 MB
125 W
15.6
DDR5-4400
Dell’s heat-sink rule is a single threshold: anything over 150 W gets the HPR heat sink, and every part at or under 150 W runs the standard one.
Dell’s restriction matrix caps the processor at 185 W with three or four standard fans; its separate thermal matrix fills the 205–250 W cells for four standard fans with “Not supported: requires < 25°C”.
The 5512U shows no UPI speed (N/A) where every other SKU lists 16 or 20 GT/s, so this page treats it as a single-socket part; the 3408U is the only part without turbo, and no turbo clocks are given.
Memory speed is set per SKU: 4th Gen 64xx parts run 4800 MT/s, 54xx parts 4400 MT/s, and the 44xx parts and 3408U 4000 MT/s; of the 5th Gen parts only the 6526Y reaches 5200 MT/s.
UPI runs at 16 GT/s on 4th Gen parts and at 20 GT/s on the 5th Gen 6534 and 6526Y; the 4514Y, 4510 and 4509Y list 16 GT/s.
03 — Memory
16 DIMM slots, 8 per processor
Sixteen DDR5 ECC RDIMM slots, eight per processor, and Dell’s tables cover one DIMM per channel only. Dell lists 16, 32 and 64 GB modules at 4800 MT/s and 16 to 96 GB at 5600 MT/s; the 5600 MT/s parts are for 5th Gen processors, which run them at up to 5200 MT/s.
Capacity with every slot filled
by DIMM size
Rated memory speed
from the processor table
Processor family
Up to
4th Gen Xeon Scalable
4800 MT/s
5th Gen Xeon Scalable
5200 MT/s
The ceiling depends on which document you read: Table 2 of the technical guide prints 1 TB, while its DIMM tables list a 96 GB module (16 × 96 GB = 1.5 TB) and the spec sheet states 1.5 TB.
The 96 GB module appears only at 5600 MT/s, a rating Dell applies to 5th Gen processors; the largest 4800 MT/s module is 64 GB, which fills 16 slots to 1 TB.
Modules of 96 GB and above require HPR fans; standard and HPR fans both support 64 GB and below.
Dell warns that the processor may run DIMMs below their rated speed, and its processor tables give the speed each SKU supports.
04 — Storage
6 drive-bay layouts, up to 24 bays
Six front configurations; Dell’s internal RAID controllers for them are front PERC modules (fPERC) that leave the PCIe slots free. The 2.5-inch fronts scale through 8, 16 and 24 SAS/SATA bays, the 3.5-inch fronts give 8 or 12, and one mixed layout sets eight NVMe SSDs beside eight 3.5-inch drives. Dell’s riser table allows rear drives in none of its configurations, even though one acoustic test build lists a 2 × 2.5-inch rear backplane.
Headline layouts
front panel view
Front panel
The bay maximum: 24 SAS/SATA bays. Dell’s 2.5-inch list covers 10K SAS hard drives up to 2.4 TB and SAS and SATA SSDs up to 7.68 TB; 44.64 kg fully populated.
SAS/SATANVMeSAS/SATA + NVMe
Controllers & boot
S160 — Software RAID. Entry tier, software RAID for NVMe only
PERC H355 (fPERC) — RAID. Value tier, PERC 11 front PERC (replaces H345)
HBA355i (fPERC) — HBA. Value tier, internal HBA 11 front module
PERC H755 (fPERC) — RAID. Value Performance tier, PERC 11 front PERC; cache size not printed
PERC H755N (fPERC) — RAID. Value Performance tier, PERC 11 NVMe front PERC; cache size not printed
PERC H965i (fPERC) — RAID, 8GB cache. Premium Performance tier, PERC 12 (Avenger), 8GB DDR4 NV cache
BOSS-N1 (HW RAID, 2 x M.2 NVMe SSD) — boot
Internal USB 3.0 (optional) — boot
Not drawn above: the plain 8 × 3.5-inch front (43.16 kg fully populated) and the mixed front of eight 3.5-inch SAS/SATA and eight 2.5-inch NVMe bays (46.84 kg), which Dell supports only with HPR fans.
Controllers: PERC H965i (8 GB DDR4 NV cache), H755, H755N and H355, plus HBA355i and HBA465i, as front modules; HBA355e for external enclosures; S160 software RAID for NVMe only.
Dell’s drive-bay table quotes capacities (360 TB for 24 × 2.5-inch, 180 TB for 12 × 3.5-inch) that do not reconcile with its drive list, which tops out at 7.68 TB for 2.5-inch SAS/SATA and 20 TB for 3.5-inch drives. Size from the drive list.
2.5-inch SAS4 drives need at least eight standard fans; Dell’s drive list includes 24 Gb SAS SSDs.
BOSS-N1 holds two M.2 NVMe SSDs in hardware RAID for boot; in the 8 × 3.5-inch chassis it is not supported with three standard fans.
Every documented layout
6 with drive bays
2.5-inch3.5-inchEDSFF (E1.S / E3.S)
05 — Accelerators & I/O
GPUs, PCIe and networking
Two classes of card. Double-wide NVIDIA A40 or L40 at 300 W, or the 165 W A30, run two at a time on the GPU risers; single-wide cards run up to six (NVIDIA A2) or five (L4). Every GPU configuration depends on the fan kit, and none is supported in ASHRAE A3 or A4. Up to 2 × double-wide 300 W (A40 or L40) with eight HPR fans, or 6 × A2 / 5 × L4 single-wide; the L4 cannot use slot 5.
NVIDIA A40
double-wide
up to 2
NVIDIA L40
double-wide
up to 2
NVIDIA A30
double-wide
up to 2
NVIDIA A2
single-wide
up to 6
NVIDIA L4
single-wide
up to 5
I/O topology
80 lanes per CPU
Each processor provides 80 PCIe 5.0 lanes and up to three UPI links. The rear exposes up to six slots: two x16 Gen5 slots on GPU risers and four Gen4 slots on the system board, two per processor.
Network adapters Dell lists
13 options
Adapter
Ports
Form
Intel 4 x 10GbE OCP 3.0 (port type printed 'V2')
4 × 10GbE
OCP 3.0
Intel 4 x 25GbE OCP 3.0 (port type printed 'V2')
4 × 25GbE
OCP 3.0
Broadcom 4 x 10GbE BT OCP 3.0
4 × 10GbE
OCP 3.0
Broadcom 2 x 10GbE OCP 3.0 (port type printed 'V2')
2 × 10GbE
OCP 3.0
Intel 2 x 10GbE OCP 3.0 (port type printed 'V2')
2 × 10GbE
OCP 3.0
Intel 4 x 1GbE OCP 3.0 (port type printed 'V2')
4 × 1GbE
OCP 3.0
Broadcom 2 x 25GbE OCP 3.0 (port type printed 'V3')
2 × 25GbE
OCP 3.0
Intel 2 x 25GbE OCP 3.0 (port type printed 'V2')
2 × 25GbE
OCP 3.0
Mellanox ConnectX-6 Lx 2 x 25GbE PCIe card
2 × 25GbE
PCIe
Broadcom 57504 4 x 25GbE SFP PCIe card (printed 'SPF')
4 × 25GbE
PCIe
Intel E810-CCV 4 x 25GbE PCIe card
4 × 25GbE
PCIe
Intel XXV710 2 x 25GbE PCIe card
2 × 25GbE
PCIe
Broadcom BCM5720 2 x 1 GbE LOM
2 × 1GbE
LOM
Riser configurations: none (one or two processors), one GPU riser (one or two), or two GPU risers (two processors only). All use the front PERC, and none allows rear storage.
Slots 3 and 4 connect to processor 2 and slots 5 and 6 to processor 1.
The OCP 3.0 slot is small-form-factor Gen4 at x8, or x16 with an OCP cable; Dell’s feature list gives up to 25 GbE, or 100 GbE with that cable, while its supported-card table stops at 25GbE.
PCIe network cards named in Dell’s thermal tables include the Mellanox ConnectX-6 Lx, Broadcom 57504, Intel E810-CCV and Intel XXV710 25GbE adapters.
06 — Power & cooling
11 power supplies, 600–2,800 W
Two supplies, 1+1 redundant, chosen from eleven: 60 mm units from 600 W to 1800 W (including 1100 W −48 V DC and 1400 W 277 VAC / 336 V HVDC) and 86 mm units at 2400 W and 2800 W. Dell’s own GPU acoustic test build ran 2400 W supplies.
AC277 VAC / HVDC−48 V DC
Low-line mains (100–120 V) derates the 1100 W and 1400 W AC supplies to 1050 W apiece and the 2400 W to 1400 W; the 700 W, 1800 W and 2800 W supplies are high-line only (200–240 V AC or 240 V DC).
Leads differ by unit: C13 for the 600 W to 1400 W mixed-mode supplies, C15 for the 1800 W (a C13 lead plus a C14-to-C15 jumper also works), C19 for the 2400 W and C21 for the 2800 W; the −48 V DC unit uses a LOTES APOW0097 cable and the 277 V unit an APP 2006G1.
ASHRAE A3 and A4 operation requires both supplies, and Dell warns that performance may drop if one fails.
Heat dissipation ranges from 2250 BTU/hr for the 600 W supply to 10500 BTU/hr for the 2800 W.
07 — Management, security & OS
Run it, secure it, choose the OS
Management
iDRAC9 (Express, Enterprise and Datacenter licences)
iDRAC Direct (front Micro-AB USB)
Quick Sync 2 wireless module
iDRAC RESTful API with Redfish
iDRAC Service Module
OpenManage Enterprise with Power Manager, Service and Update Manager plugins
CloudIQ for PowerEdge
OpenManage integrations for VMware vCenter, Microsoft System Center and Windows Admin Center
Data at Rest Encryption (SEDs, local or external key management)
System Lockdown (iDRAC9 Enterprise or Datacenter)
Secure Erase
TPM 2.0 FIPS, CC-TCG certified; TPM 2.0 China NationZ
Intel TDX confidential computing (5th Gen Xeon)
Operating systems
Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi
08 — Compare
T550 → T560
Dell’s guide sets the T560 against the T550, its previous-generation tower, with identical external dimensions. Most of the change is inside: DDR5, PCIe Gen5, a twelve-bay 3.5-inch front and a wider power range.
3rd Gen Xeon ScalablePowerEdge T550
4th / 5th Gen Xeon ScalablePowerEdge T560
Processors
2 × 3rd Gen Xeon Scalable, up to 32 cores
2 × 4th Gen (to 32 cores) or 5th Gen (to 28 cores)
Memory
16 × DDR4 RDIMM · up to 3200 MT/s · 1 TB
16 × DDR5 RDIMM · up to 4800 / 5200 MT/s · 1 TB in Table 2, 1.5 TB on the spec sheet
Front bays
8, 16 or 24 × 2.5" · 8 × 3.5" · 8 × 3.5" + 8 NVMe
The same, plus 12 × 3.5"
Controllers
PERC H345, H755, H755N · HBA355i · external PERC H840
fPERC H965i, H755, H755N, H355 · HBA355i, HBA465i
Boot
Internal dual SD module or BOSS-S2
BOSS-N1 (2 × M.2 NVMe) or USB
PCIe
3 × Gen4 x16 + 1 × Gen3 x8 · up to 2 × x16 double-wide for GPU (upsell)
Up to 6: 2 × Gen5 x16 + 4 × Gen4
OCP
OCP x16 Mezz 3.0
OCP 3.0 x8
GPUs
2 × double-wide 300 W or 5 × single-wide 70 W
2 × double-wide 300 W or 6 × single-wide 75 W
Power
600–2400 W AC · 240 V DC variants · 1100 W −48 V DC
600–2800 W AC · 1100 W −48 V DC · 1400 W 277 VAC / 336 V DC
Management
iDRAC9 · iDRAC Direct and Quick Sync 2 as upsells
iDRAC9 · iDRAC Direct · Quick Sync 2
Bezel
Optional LCD or security bezel
Security bezel
Size (H × W × D)
464 × 200 × 678.2 mm
464 × 200 × 678.2 mm
Source: Dell PowerEdge T560 Technical Guide (December 2024, Rev. A04), Table 2 (T560 vs T550 features comparison).
The T560 family side by side
Dell’s tower range here runs from the compact single-socket T160 through the T360 to the two-socket T560. In the rack line, the 2U R760xs shares the T560’s 4th and 5th Gen Xeon Scalable platforms and 16 DIMM slots, while the 2U R760 doubles the slot count to 32. The bars set out the documented limits of each.
This modelSiblings and successorEach value from that model’s own verified spec file · bars scale per column
Head-to-head comparisons
Every figure on this page, set against the machines buyers weigh it up with.
Four builds checked against Dell’s fan, riser and thermal tables for the T560, using parts our configurator offers for this model; each loads into the configurator for editing.
Virtualisation
Two-socket host with an NVMe tier
Two 16-core Xeon 6526Y processors are the only T560 parts that run memory at 5200 MT/s, and sixteen 64 GB RDIMMs give 1 TB. The mixed front puts eight NVMe SSDs for VM storage beside eight 3.5-inch drives for file and backup data, with BOSS-N1 holding the hypervisor.
2 × Xeon Gold 6526Y — 16 cores @ 2.8 GHz, 195 W each
16 × 64 GB DDR5-5600 RDIMM — 1 TB (runs at up to 5200 MT/s with this processor)
8 × 3.84 TB 2.5-inch NVMe Gen4 SSD — 30.72 TB raw
8 × 8 TB 3.5-inch SATA HDD — 64 TB raw
PERC H755 front controller (fPERC)
BOSS-N1 boot module (2 × M.2 NVMe, hardware RAID)
Intel 2 × 25GbE OCP 3.0
2 × 1400 W Platinum (1+1)
VMware ESXi 8.0
ProSupport Plus, 5 years
Dell supports the 8 × 3.5-inch + 8 × NVMe front only with HPR fans, and 195 W processors take the HPR heat sink. At 100–120 V the 1400 W Platinum supplies are derated to 1050 W.
Where a database is licensed per core, two 8-core Xeon 6534 processors at a 3.9 GHz base keep the count at 16. The 24-bay front holds a large SAS SSD set behind the PERC H965i and its 8 GB cache, and because that controller is a front module every PCIe slot stays free for networking.
2 × Xeon Gold 6534 — 8 cores @ 3.9 GHz, 195 W each
16 × 64 GB DDR5-5600 RDIMM — 1 TB (runs at up to 4800 MT/s with this processor)
The 195 W 6534 needs the HPR heat sink, and if the SSDs are 24 Gb SAS4 parts Dell requires at least eight standard fans. At 100–120 V the 1100 W supplies are derated to 1050 W.
Two 300 W NVIDIA L40 cards take slots 1 and 2 on the GPU risers, with the eight HPR fans Dell’s GPU matrix requires at 300 W; its riser table ties the two-riser layout to two processors. The rest follows the shape of Dell’s GPU acoustic test build: 225 W processors, sixteen 64 GB RDIMMs, a 24-bay 2.5-inch front and 2400 W supplies.
2 × Xeon Gold 6442Y — 24 cores @ 2.6 GHz, 225 W each
2 × NVIDIA L40 on GPU risers (double-width, 300 W)
GPUs are not supported in ASHRAE A3/A4, and the technical guide rates T560 acoustics for an attended data centre, with its loudest tested build at 72 dB operating. The 2400 W supplies take C19 leads and fall to 1400 W at 100–120 V.
The 28-core Xeon 5512U is listed without a UPI link, so it suits a one-processor build. Eight RDIMMs fill that socket’s slots, and the twelve-bay 3.5-inch front with Dell’s largest 20 TB drives reaches 240 TB raw behind a PERC H755.
1 × Xeon Gold 5512U — 28 cores @ 2.1 GHz, 185 W
8 × 32 GB DDR5-5600 RDIMM — 256 GB (runs at up to 4800 MT/s with this processor)
12 × 20 TB 3.5-inch SATA HDD — 240 TB raw
PERC H755 front controller (fPERC)
BOSS-N1 boot module (2 × M.2 NVMe, hardware RAID)
Broadcom 4 × 10GbE BT OCP 3.0
2 × 1400 W Titanium (1+1)
Windows Server 2025
ProSupport, 5 years
Dell wires slots 3 and 4 to processor 2, so plan expansion around slots 5 and 6 and a single GPU riser; two-riser layouts need both sockets. The twelve-drive chassis is the heaviest T560, at up to 48 kg.
Our refurbished PowerEdge configurator offers rack servers rather than towers. If the T560 would end up in a comms room or data centre anyway, these earlier two-socket PowerEdge models cover similar storage-heavy roles.
14G · re-certified
PowerEdge R740xd
2U rack · 2 × Xeon Scalable
24 DIMM slots · up to 3 TB DDR4
24 × 2.5" or 12 × 3.5" bays
iDRAC9
The same 24-small or 12-large bay counts as the T560, in 2U, for file, backup and software-defined storage.
1 × OCP 3.0 SFF, Gen4, x8 (x16 with cable) · 1, 10 or 25GbE cards listed
LOM
2 × 1GbE (Broadcom BCM5720), usable alongside the OCP card
Accelerators
Double-wide
Up to 2 × NVIDIA A40 or L40 (300 W), or 2 × A30 (165 W) — HPR ×8 fans
Single-wide
Up to 6 × NVIDIA A2 or 5 × NVIDIA L4 (under 75 W)
Restrictions
Not in ASHRAE A3/A4 · L4 not in slot 5 · one A30 on riser 2 only with HPR ×7
Power
Supplies
Two, 1+1 redundant · 60 mm (600–1800 W) or 86 mm (2400 / 2800 W)
AC
600 W Pt · 700 W Ti (HLAC) · 800 W Pt · 1100 W Ti · 1400 W Pt · 1400 W Ti · 1800 W Ti (HLAC) · 2400 W Pt · 2800 W Ti (HLAC)
Other inputs
1100 W −48 to −60 V DC · 1400 W Titanium 277 VAC / 336 V DC
Ports & video
Front
1 × USB 2.0 · 1 × USB 3.0 · 1 × iDRAC Direct (Micro-AB USB)
Rear
1 × USB 2.0 · 1 × USB 3.0 · 2 × 1GbE · dedicated iDRAC RJ45 · VGA · optional serial
Internal
1 × USB 3.0 (optional)
Video
Matrox G200, 16 MB frame buffer · up to 1920 × 1200 at 60 Hz
Environment & acoustics
ASHRAE A2
10–35°C to 900 m, de-rated 1°C per 300 m above
ASHRAE A3 / A4
5–40°C / 5–45°C: two PSUs, no GPU or TBU, fan and TDP limits
Rugged environment
5–55°C continuous operation
Operating altitude
Up to 3,048 m
Acoustics (25°C)
35–43 dB idle · up to 72 dB operating (bystander position)
12 — FAQ
T560 questions, answered from the documentation
What is the maximum memory of the Dell PowerEdge T560?
Sixteen DDR5 RDIMM slots, eight per processor. With the 96 GB module Dell lists, all sixteen slots give 1.5 TB, the figure on Dell’s spec sheet; the technical guide’s comparison table prints 1 TB. The 96 GB module is a 5600 MT/s part, a rating Dell applies to 5th Gen processors, and it needs HPR fans.
Which processors does the T560 support?
Twenty-one. Fifteen are 4th Gen Xeon Scalable (up to 32 cores) and six are 5th Gen (up to 28), with TDPs from 125 W to 225 W. One or two can be fitted; the exception is the 5512U, which Dell’s table lists with no UPI link, so plan it as a single-processor build.
How many drive bays does the T560 have?
Up to 24 at the front with 2.5-inch SAS/SATA drives, or 12 with 3.5-inch drives. Dell also offers 8 and 16 × 2.5-inch, 8 × 3.5-inch, and 8 × 3.5-inch plus 8 × 2.5-inch NVMe. Dell’s riser table rules out rear storage in every configuration (one acoustic test build does list a two-bay rear backplane); boot can go on a BOSS-N1 M.2 module instead.
How many GPUs can the T560 take?
Two double-wide cards — NVIDIA A40 or L40 at 300 W, or the 165 W A30 — or up to six single-wide A2 or five L4 cards. Double-wide 300 W cards need eight HPR fans, dual-riser layouts need two processors, and no GPU is supported in ASHRAE A3 or A4.
How many PCIe slots does the T560 have?
Up to six. Slots 1 and 2 are x16 Gen5, full length, on the GPU risers; slots 3, 4 and 6 are x16 Gen4 and slot 5 is an x16 connector with eight lanes. There is also one OCP 3.0 slot (Gen4, x8, or x16 with an OCP cable) and a 2 × 1GbE LOM.
What power supplies does the T560 support?
Two supplies in 1+1 redundancy, picked from eleven options between 600 W and 2800 W. Two take non-standard feeds: a −48 V DC model at 1100 W, and a 1400 W Titanium rated for 277 VAC or 336 V DC. Fed from 100–120 V, both 1100 W and 1400 W AC models are cut back to 1050 W and the 2400 W model to 1400 W, while the 700 W, 1800 W and 2800 W need a 200–240 V feed.
Is the T560 practical in an office?
Dell’s documents disagree: the spec sheet promises office-friendly acoustics, but the technical guide calls the T560 appropriate for an attended data centre, adding that the right hardware or software configuration can lower its output, and measured 35–43 dB idle and up to 72 dB operating across its test builds. It is also a large machine — 464 mm tall on its feet, 200 mm wide, 678.2 mm deep with the bezel and up to 48 kg fully populated. 25 Gb NICs, GPUs of 75 W or more, NVMe drives and higher-TDP processors all push the fans harder.
Should I choose the T560 or the T360?
The T360 is the single-socket option: one Xeon 6300, E-2400 or Pentium, four UDIMM slots capped at 128 GB, up to eight 3.5-inch bays and one 60 W A2 GPU. The T560 takes one or two Xeon Scalable processors, 16 RDIMM slots, up to 24 bays and two double-wide 300 W GPUs. Dell’s T360 guide calls that model appropriate for typical offices, whereas the T560 guide points to an attended data centre (the T560 spec sheet, though, calls it office-friendly).
What changed from the T550 to the T560?
The chassis dimensions are the same, but the T560 moves from 3rd Gen Xeon and DDR4-3200 to 4th and 5th Gen Xeon with DDR5 at up to 5200 MT/s, lists two of its six slots as x16 Gen5 (the T550 listed Gen4 and Gen3 slots plus two x16 GPU slots as an upsell), and adds a 12 × 3.5-inch front, a sixth single-wide GPU and supplies up to 2800 W. Dell lists its OCP slot as x8, against x16 on the T550.
Is the Dell PowerEdge T560 end of life?
Dell’s T560 technical guide (December 2024, Rev. A04) gives no date for end of sale or end of service. Post Standard Support appears in its services appendix, lengthening hardware cover by up to five years once ProSupport’s first seven years are over. For current status, see our end-of-life checker.
Specifications are extracted from Dell’s published documents and independently re-checked line by line. Configurations are quote-based; availability and exact options are confirmed at quotation. Last reviewed 2026-09-11.