The R760xs is the leaner 2U two-socket PowerEdge for 4th and 5th Gen Xeon: the same 21 processors and 16-slot memory as the 1U R660xs, with room for 24 × 2.5-inch or 12 × 3.5-inch drives, six PCIe slots and two single-wide NVIDIA A2 GPUs. This page sets out every limit Dell documents, including the trade-offs that come with the 12-bay 3.5-inch chassis.
2U Rack1 or 2 sockets5th Gen Xeon Scalable4th Gen Xeon ScalableiDRAC9
Our read of Dell’s documentation: where the R760xs is strong, and the limits worth knowing before you spec one.
Strengths
+Storage breadth the 1U siblings cannot match: 24 front 2.5-inch bays (16 SAS/SATA plus 8 NVMe, up to 244.48 TB), or 8 or 12 × 3.5-inch bays up to 288 TB.
+Six PCIe slots with two processors — two Gen5 slots on the riser and four Gen4 — against three on the R660xs.
+Room for two single-wide NVIDIA A2 GPUs, which the R750xs before it could not take at all.
+Shorter than the full R760: 721.62 mm with the bezel against 772.13 mm.
+Air cooling only, so there is no liquid loop to plumb, and the supply list runs from a 600 W unit that keeps full output on 100–120 V to an 1800 W high-line model.
Watch-outs
!Memory stops at 1.5 TB: sixteen slots at one DIMM per channel, half the thirty-two of the full R760.
!The 12 × 3.5-inch chassis carries the most caveats: no A2 GPUs, no 100 GbE adapters or 100 Gb OCP, no quad-port 25GbE OCP cards, and 30°C limits for the 250 W processor and 96 GB DIMMs.
!Rear drives go only behind the 12 × 3.5-inch front, so the 24-bay 2.5-inch chassis cannot add any.
!Only one cable riser can be fitted at a time, and the two Gen5 slots exist only on risers 1C and 1D.
!The OCP 3.0 slot is x8 (the R750xs had x16) and SNAPI is not supported; Dell’s OCP feature table stops at 25 GbE, although its slot-priority tables also name a 100 Gb Intel OCP card.
Processors21 SKUs
Cores / CPU8–32
DIMM slots16
Drive layouts7
Max bays24
GPUsup to 2
PSU options9 · to 1,800 W
02 — Processors
21 supported processors, mapped
The processor table matches the R660xs name for name — 21 SKUs, thirteen from the 4th Gen Scalable line (to 32 cores) and eight from 5th Gen (to 28) — but the TDP range here runs from 125 W up to 250 W, because this guide rates the 6414U at 250 W. On every 2.5-inch front, Dell’s ambient table keeps each listed processor at 35°C or higher.
Processor landscape — cores × TDP
21 SKUs · 2 families
5th Gen Xeon Scalable 84th Gen Xeon Scalable 13Bubble size = L3 cache · hover a bubble for the full SKU
Processor explorer
filter · sort · compare
Processor
Cores / threads
Base
L3 cache
TDP
W / core
Memory
Intel Xeon Gold 6414U
32
2 GHz
60 MB
250 W
7.8
DDR5-4800
Intel Xeon Gold 6448Y
32
2.2 GHz
60 MB
225 W
7.0
DDR5-4800
Intel Xeon Gold 6438Y+
32
2 GHz
60 MB
205 W
6.4
DDR5-4800
Intel Xeon Gold 5520+
28
2.2 GHz
52.5 MB
205 W
7.3
DDR5-4800
Intel Xeon Gold 5512U
28
2.1 GHz
52.5 MB
185 W
6.6
DDR5-4800
Intel Xeon Gold 5420+
28
2 GHz
53 MB
205 W
7.3
DDR5-4400
Intel Xeon Silver 4516Y+
24
2.2 GHz
45 MB
185 W
7.7
DDR5-4400
Intel Xeon Gold 6442Y
24
2.6 GHz
45 MB
225 W
9.4
DDR5-4800
Intel Xeon Gold 5418Y
24
2 GHz
45 MB
185 W
7.7
DDR5-4400
Intel Xeon Silver 4416+
20
2 GHz
38 MB
165 W
8.3
DDR5-4000
Intel Xeon Gold 6526Y
16
2.8 GHz
37.5 MB
195 W
12.2
DDR5-5200
Intel Xeon Gold 6426Y
16
2.6 GHz
30 MB
185 W
11.6
DDR5-4800
Intel Xeon Gold 5416S
16
2 GHz
30 MB
150 W
9.4
DDR5-4400
Intel Xeon Silver 4514Y
12
2 GHz
30 MB
150 W
12.5
DDR5-4400
Intel Xeon Silver 4510
12
2.4 GHz
30 MB
150 W
12.5
DDR5-4400
Intel Xeon Silver 4410Y
12
2 GHz
23 MB
150 W
12.5
DDR5-4000
Intel Xeon Silver 4410T
10
2.7 GHz
27 MB
150 W
15.0
DDR5-4000
Intel Xeon Gold 6534
8
3.9 GHz
22.5 MB
195 W
24.4
DDR5-4800
Intel Xeon Silver 4509Y
8
2.6 GHz
23 MB
125 W
15.6
DDR5-4400
Intel Xeon Gold 5415+
8
2.9 GHz
15 MB
150 W
18.8
DDR5-4400
Intel Xeon Bronze 3408U
8
1.8 GHz
15 MB
125 W
15.6
DDR5-4000
Heat sinks: standard below 185 W; the high-performance heat sink from 185 W upwards, and for every processor in the 12 × 3.5-inch chassis.
Dell’s table has N/A in the UPI column for the 5512U; every other SKU shows 16 or 20 GT/s.
This guide gives the 6414U a 250 W TDP and the 4514Y 12 cores; the R660xs guide prints 185 W and 16 cores for the same two SKUs.
The processor table has no thread column and marks turbo only as present, so neither threads nor boost clocks are shown.
03 — Memory
16 DIMM slots, 8 per processor
The memory layout copies the R660xs: 16 DDR5 RDIMM slots, eight on each processor and one per channel, for up to 1.5 TB with 96 GB modules. Dell’s memory matrix pairs every capacity from 16 GB to 96 GB with either a 4800 or a 5600 MT/s rating.
Capacity with every slot filled
by DIMM size
Rated memory speed
from the processor table
Processor family
Up to
5th Gen Xeon Scalable
5200 MT/s
4th Gen Xeon Scalable
4800 MT/s
Up to 5200 MT/s with 5th Gen processors and 5600 MT/s modules, up to 4800 MT/s otherwise; the processor’s own rating (4000–5200 MT/s in Dell’s table) is the final limit.
Per processor, 1, 2, 4, 6 or 8 DIMMs are supported; dual-processor systems take 2, 4, 8, 12 or 16, with both sockets populated to match.
No mixing of DIMM capacities; where speeds differ, the whole set runs at the lowest.
A single-processor build needs a CPU blank in the empty socket, and the 12 × 3.5-inch chassis with the rear module needs DIMM blanks.
04 — Storage
7 drive-bay layouts, up to 24 bays
Six fronts: none, 8 or 12 × 3.5-inch, 8 × 2.5-inch (SAS/SATA or NVMe), 16 × 2.5-inch SAS/SATA, and a 24-bay front that pairs 16 SAS/SATA bays with 8 NVMe. A two-bay 2.5-inch rear module is offered only behind the 12 × 3.5-inch front.
Headline layouts
front panel view
Front panel
The 24-bay maximum, all at the front: sixteen SAS/SATA bays beside eight NVMe bays, up to 244.48 TB. Dell’s fan table does not allow the rear module with it.
SAS/SATANVMeSAS/SATA + NVMe
Controllers & boot
S160 — Software RAID. Entry tier; NVMe Gen4; RAID 0/1/5/10; Windows only per feature matrix
PERC H355 — RAID. Value tier, PERC 11; adapter and front versions; no cache; RAID 0/1/10
HBA355i — HBA. Value tier, 12Gb SAS internal; adapter and front versions
HBA355e — HBA. External 12Gb SAS HBA, 4x4 external ports
HBA465i — HBA. Value tier, 24Gb SAS internal, front version
PERC H755 — RAID, 8GB cache. Value Performance tier, PERC 11; adapter and front (SAS/SATA only) versions; 8GB NV cache
PERC H755N — RAID, 8GB cache. Value Performance tier, PERC 11 front NVMe-only; 8GB NV cache
PERC H965i — RAID, 8GB cache. Premium Performance tier, PERC 12 (Avenger); front and adapter versions; 8GB DDR4 NV cache
Dell’s inside view shows the front PERC mounted behind the drive backplane, and the guide says this fPERC design uses no PCIe slot; the H755N is the NVMe-only choice, and S160 software RAID works under Windows only.
BOSS-N1 is fully hot-plug in this chassis, and fitting it calls for an HPR Gold fan in zone 1.
Kioxia CM6, Samsung PM1735 and Redtail NVMe drives, among others, are barred from the rear module.
Under ASHRAE A3 or A4 the rear drives and BOSS are unsupported, the 12 × 3.5-inch chassis is excluded altogether, and the other drive fronts are limited to A3.
Every documented layout
7 with drive bays
2.5-inch3.5-inchEDSFF (E1.S / E3.S)
05 — Accelerators & I/O
GPUs, PCIe and networking
NVIDIA A2 is the only GPU Dell lists: up to two single-wide cards, placed in slots 3, 4 or 6. Dell’s feature table describes the A2 as a 60 W low-profile card, while its overview counts two 75 W single-wide GPUs. Up to 2 × NVIDIA A2 · HPR Gold fan in zone 1 · not with 12 × 3.5-inch drives · 30–35°C inlet depending on the front.
NVIDIA A2
single-wide
up to 2
I/O topology
80 lanes per CPU
Each processor provides 80 PCIe 5.0 lanes. Without a riser the chassis has two slots per processor; the R1C riser (two processors) or R1D (one) adds the two Gen5 slots, for up to six, all low-profile and half-length.
Network adapters Dell lists
27 options
Adapter
Ports
Form
Broadcom 2 x 10 GbE BT OCP 3.0 (RN1M5)
2 × 10GbE
OCP 3.0
Broadcom 2 x 25 GbE SFP28 OCP 3.0 (24FG6)
2 × 25GbE
OCP 3.0
Broadcom 4 x 25 GbE SFP28 OCP 3.0 (3Y64D)
4 × 25GbE
OCP 3.0
Broadcom 4 x 1 GbE BT OCP 3.0 (VJWVJ)
4 × 1GbE
OCP 3.0
Broadcom 4 x 10 GbE BT OCP 3.0 (W5HC8)
4 × 10GbE
OCP 3.0
Intel 4 x 1 GbE BT OCP 3.0 (HY4CV)
4 × 1GbE
OCP 3.0
Intel 2 x 10 GbE BT OCP 3.0 (F6X1R)
2 × 10GbE
OCP 3.0
Intel 4 x 10 GbE BT OCP 3.0 (XC0M4)
4 × 10GbE
OCP 3.0
Intel 2 x 25 GbE SFP28 OCP 3.0 (PWH3C)
2 × 25GbE
OCP 3.0
Intel 4 x 25 GbE SFP28 OCP 3.0 (Y4VV5)
4 × 25GbE
OCP 3.0
Mellanox NIC: NDR400
× NDR400
PCIe
Mellanox NIC: NDR400 VPI
× NDR400
PCIe
Mellanox NIC: NDR200
× NDR200
PCIe
Mellanox NIC: NDR200 VPI
× NDR200
PCIe
Mellanox HDR100 VPI
× HDR100
PCIe
Mellanox HDR VPI
× HDR
PCIe
Mellanox NIC: 100Gb
× 100GbE
PCIe
Broadcom NIC: 100Gb
× 100GbE
PCIe
Intel NIC: 100Gb
× 100GbE
PCIe
Mellanox NIC: 25Gb
× 25GbE
PCIe
Broadcom NIC: 25Gb
× 25GbE
PCIe
Intel NIC: 25Gb
× 25GbE
PCIe
Broadcom NIC: 10Gb
× 10GbE
PCIe
Intel NIC: 10Gb
× 10GbE
PCIe
Broadcom NIC: 1Gb
× 1GbE
PCIe
Intel NIC: 1Gb
× 1GbE
PCIe
Broadcom BCM5720 2 x 1 GbE LOM
2 × 1GbE
LOM
Only one cable riser fits at a time; Gen5 slots 3 and 4 live on it, while slots 1, 2, 5 and 6 are Gen4.
Mellanox NDR400 adapters need the two-processor R1C riser and go only in slots 4 and 3; CX7 NDR200 cards are held to specific Gen5 and Gen4 slots.
With the 12 × 3.5-inch front, PCIe cards needing more than 300 LFM at 55°C are unsupported and the H965e is limited to slot 3.
Dell’s slot tables list the optional serial port module against slot 2, but a note in the same guide says it is not a true PCIe card and has its own system-board position.
06 — Power & cooling
9 power supplies, 600–1,800 W
Power comes from a 1+1 pair of 60 mm hot-plug supplies, and the choice of nine is identical to the 1U R660xs list: seven AC models spanning 600 W to 1800 W, plus −48 V DC and 277 VAC/336 VDC models.
AC277 VAC / HVDC−48 V DC
Where only 100–120 V is available, the 1100 W and 1400 W AC models give 1050 W, the 600 W and 800 W models lose nothing, and the high-line-only 700 W and 1800 W models cannot be used.
C13 leads serve every mixed-mode model up to 1400 W; the 1800 W model takes C15 (or C13 plus a C14-to-C15 jumper), the −48 V DC model a Lotes connector, and the 277 VAC/336 VDC model Dell’s APP 2006G1 cord.
Dell’s acoustic tests put the quietest build (one 125 W processor, eight 2.5-inch bays) at 32 dB idle, the 12 × 3.5-inch build at 56 dB idle and the A2 GPU build at 64 dB when working.
Fan speed in the 3.5-inch chassis is capped at 90% because of the drives’ dynamic profile.
Extended-ambient (A3/A4) operation needs both supplies and does not tolerate a supply failure.
07 — Management, security & OS
Run it, secure it, choose the OS
Management
iDRAC9 with Lifecycle Controller 3.x
iDRAC Direct (front micro-USB)
iDRAC RESTful API with Redfish
iDRAC Service Module
Quick Sync 2 wireless module
Digital License Key and Easy Restore
OpenManage Enterprise with Power Manager, Service and Update Manager plugins
CloudIQ for PowerEdge
OpenManage integrations for VMware vCenter, Microsoft System Center and Windows Admin Center
Data at Rest Encryption (SEDs, local or external key management)
System Lockdown (iDRAC9 Enterprise or Datacenter)
Secure Erase
TPM 2.0 FIPS, CC-TCG certified; TPM 2.0 China NationZ
Operating systems
Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware vSAN / ESXi
08 — Compare
R750xs → R760xs → R570
The R760xs set against the R750xs that preceded it and the single-socket Xeon 6 R570 that Dell compares it with, using only the comparison tables in the R760xs and R570 technical guides.
Siblings and alternatives: the R760 is the full-feature 2U on the same Xeon generations with 32 DIMM slots, the R660xs carries the same processor list and 16-slot memory in 1U, the R760xd2 gives up slots and processor headroom for 3.5-inch density, the R570 is the single-socket Xeon 6 system Dell compares it with, and the R7615 rounds out the set. The bars chart each model’s documented limits.
This modelSiblings and successorEach value from that model’s own verified spec file · bars scale per column
Four 2U builds: three for workloads Dell names for the R760xs — VDI, virtual machines and software-defined storage — and a single-socket file server. Every part in them is permitted on this model in our configurator.
VDI
Two-A2 virtual desktop host
Two single-wide NVIDIA A2 cards serve GPU-backed desktops, with 64 cores from a pair of 6448Y processors behind them. The eight-bay 2.5-inch front keeps the A2 rated to 35°C, where the 16- and 24-bay fronts pull it down to 30°C.
2 × Xeon Gold 6448Y — 32 cores @ 2.2 GHz, 225 W each
The A2 needs an HPR Gold fan in zone 1 and HPR Silver fans in zones 2–6 here, and it is not supported with the 12 × 3.5-inch front. Slots 3 and 4 need a riser.
Twelve 20 TB drives give 240 TB raw, and the two rear bays — offered only with this front — hold NVMe for cache or metadata. The 185 W 5418Y keeps a 35°C inlet limit in this chassis, and the HBA355i presents the drives directly to the storage software.
2 × Xeon Gold 5418Y — 24 cores @ 2 GHz, 185 W each
16 × 32 GB DDR5-4800 RDIMM — 512 GB
12 × 20 TB 3.5-inch SATA 7.2K — 240 TB raw
2 × 3.84 TB NVMe Gen4 U.2 in the rear module
HBA355i (non-RAID, 12 Gb SAS)
BOSS-N1 boot pair (2 × M.2 NVMe, RAID 1)
Broadcom 2 × 25GbE SFP28 OCP 3.0
1400 W Platinum hot-plug supplies (1+1)
Ubuntu Server 24.04 LTS · ProSupport Plus 3 years
This chassis rules out A2 GPUs, 100 GbE adapters and quad-port 25GbE OCP cards, and needs DIMM blanks with the rear module. Kioxia CM6, Samsung PM1735 and several other NVMe models are not allowed in the rear bays.
Two 28-core 5520+ processors give 56 cores for mixed VMs, and ten SAS SSDs behind a PERC H755 with 8 GB of cache leave six bays free for growth. Windows Server with Hyper-V is on Dell’s supported operating-system list.
2 × Xeon Gold 5520+ — 28 cores @ 2.2 GHz, 205 W each
16 × 64 GB DDR5-5600 RDIMM — 1 TB (up to 4800 MT/s with this processor)
10 × 3.84 TB SAS SSD — 38.4 TB raw, six bays spare
PERC H755 front, 8 GB NV cache
BOSS-N1 boot pair (2 × M.2 NVMe, RAID 1)
Broadcom 4 × 25GbE SFP28 OCP 3.0
1100 W Titanium hot-plug supplies (1+1)
Windows Server 2025 Datacenter · ProSupport 5 years
Quad-port 25GbE OCP cards need optical transceivers rated to at least 85°C. At 205 W the 5520+ is limited to a 35°C inlet.
One 28-core 5512U runs an eight-bay 3.5-inch file server. With no riser a single processor has two low-profile slots, enough for an extra adapter or two, and the eight-bay chassis uses standard fans in zones 2 to 6.
1 × Xeon Gold 5512U — 28 cores @ 2.1 GHz, 185 W
8 × 32 GB DDR5-4800 RDIMM — 256 GB
8 × 12 TB 3.5-inch SATA 7.2K — 96 TB raw
PERC H755, 8 GB NV cache (RAID 6 across all eight)
BOSS-N1 boot pair (2 × M.2 NVMe, RAID 1)
Intel 2 × 10GbE BASE-T OCP 3.0
800 W Platinum hot-plug supplies (full rating on 100–120 V)
Windows Server 2025 · ProSupport 3 years
A one-processor build needs a CPU blank, and BOSS-N1 brings an HPR Gold fan in zone 1. Dell’s processor table lists no UPI speed for the 5512U.
685.78 mm ear to PSU handle (650.24 mm to PSU surface) · 721.62 mm with bezel (spec sheet)
Weight
Up to 28.82 kg (12 × 3.5") · 25.92 kg (16 + 8 × 2.5") · 25.84 kg (8 × 3.5") · 24.58 kg (16 × 2.5") · 21.56 kg (8 × 2.5") · 19.40 kg (no backplane) · spec sheet: max 28.6 kg
Cooling
Air only
Fans
Up to six hot-swap: standard, HPR Silver or HPR Gold · fan zone 1 optional
Bezel
Optional LCD bezel or security bezel
Rails
A11 stab-in/drop-in sliding rails (4-post) · A8 static rails (required for 2-post) · optional CMA and strain relief bar
Processor
Sockets
One or two
Families
4th and 5th Gen Intel Xeon Scalable
Cores per processor
Up to 32 (4th Gen) · up to 28 (5th Gen)
TDP
125–250 W
UPI
Up to 3 links per processor · 16 or 20 GT/s
PCIe lanes
80 × PCIe 5.0 per processor
Chipset
Intel C741
Memory
Slots
16 DDR5 ECC RDIMM · 8 per processor, one DIMM per channel
DIMM sizes
16, 32, 64, 96 GB (4800 or 5600 MT/s ratings)
Speed
Up to 5200 MT/s (5th Gen) · up to 4800 MT/s (4th Gen)
USB tape, NAS software stack, 12 Gb MD-series JBODs
Expansion & networking
PCIe slots
Up to 6: 2 × Gen5 on riser 1C/1D, 4 × Gen4 · low profile, half length
OCP
1 × OCP 3.0 SFF, x8 Gen4 · 1, 10 or 25 GbE, 2 or 4 ports
LOM
2 × 1GbE (Broadcom BCM5720)
GPU
Up to 2 × NVIDIA A2, single-wide
Power
Supplies
Up to two, 60 mm, hot-plug, 1+1 redundant
AC options
600 W Platinum · 700 W Titanium (200–240 V) · 800 W Platinum · 1100 W Titanium · 1400 W Titanium or Platinum · 1800 W Titanium (200–240 V)
277 VAC / HVDC
1400 W Titanium
−48 V DC
1100 W, −48 to −60 V DC
Ports & video
Front
1 × USB 2.0 · 1 × VGA · 1 × iDRAC Direct (micro-AB USB)
Rear
1 × USB 2.0 · 1 × USB 3.0 · 1 × VGA · dedicated iDRAC Ethernet · 2 × 1GbE · optional serial
Internal
1 × USB 3.0 (optional)
Video
Integrated Matrox G200, 16 MB
Environment
ASHRAE A2
10–35°C up to 900 m, de-rated 1°C per 300 m above
ASHRAE A3
5–40°C · processors to 185 W · no 12 × 3.5" chassis, rear drives or BOSS
ASHRAE A4
5–45°C · Dell limits every drive-bay front to A3
12 — FAQ
R760xs questions, answered from the documentation
What is the maximum memory of the Dell PowerEdge R760xs?
The R760xs has 16 DDR5 RDIMM slots — eight per processor, one per channel — and reaches 1.5 TB with 16 × 96 GB. That is half the slot count of the full R760, which takes 32 DIMMs.
How many drive bays does the R760xs have?
Up to 24 × 2.5-inch at the front (16 SAS/SATA plus 8 NVMe), or 12 × 3.5-inch at the front with two 2.5-inch bays at the rear. The other fronts are 8 × 3.5-inch, 8 × 2.5-inch SAS/SATA or NVMe, 16 × 2.5-inch SAS/SATA, or no drives at all.
Does the R760xs support GPUs?
Yes — up to two single-wide NVIDIA A2 cards in slots 3, 4 or 6. They need an HPR Gold fan in zone 1, are not supported with the 12 × 3.5-inch front, and are rated to 35°C with the eight-bay 2.5-inch fronts or no backplane and 30°C with the others.
How many PCIe slots does the R760xs have?
Two processors enable up to six: a pair of Gen5 x16 slots on the riser plus four Gen4 slots. One processor enables up to four — two x8 Gen5, one x16 Gen4 and one x8 Gen4. Networking has its own x8 Gen4 OCP 3.0 slot, rated to 25 GbE.
Which power supplies fit the R760xs?
Nine models fit the two hot-plug bays (1+1): seven AC units from 600 W to 1800 W, one 1100 W −48 V DC unit and one 1400 W 277 VAC/336 VDC unit. Low-line sites get 1050 W from the 1100 W and 1400 W AC models and cannot use the 700 W or 1800 W models at all.
How big and heavy is the R760xs?
Height is 86.8 mm (2U) and width 482 mm. From rack ears to PSU handles it measures 685.78 mm, or 721.62 mm with the bezel on. Fully populated weights run from 19.40 kg for the diskless chassis to 28.82 kg for twelve 3.5-inch drives; the spec sheet quotes a 28.6 kg maximum instead.
How does the R760xs differ from the R760?
The R760 has 32 DIMM slots and lists 256 GB modules, processors up to 64 cores and 350 W, E3.S drives and up to four rear 2.5-inch bays, up to eight Gen4 or four Gen5 slots, two 350 W double-wide or six single-wide GPUs, supplies to 3200 W and optional liquid cooling. The R760xs is 50.51 mm shorter with the bezel and air-cooled only.
How does it compare with the R660xs and R760xd2?
The R660xs is the 1U version of the same recipe — the same 21 processors and 16 DIMM slots — but with three PCIe slots, no GPUs and at most 12 × 2.5-inch drives, or four 3.5-inch plus two rear 2.5-inch. The R760xd2 is a deeper storage server with 24 × 3.5-inch bays plus four rear, processors capped at 185 W and Gen4-only PCIe.
What does Dell compare the R760xs with next?
Dell’s R570 guide places the R570 beside the R760xs. It is a 2U built around one Xeon 6 processor — as many as 144 E-cores or 86 P-cores — with 6400 MT/s DDR5, as many as 32 E3.S bays and support for three 400 W double-wide accelerators, where the R760xs offers two sockets and two 75 W A2 cards.
Is the Dell PowerEdge R760xs end of life?
No model-wide end-of-sale or end-of-service date appears in the R760xs technical guide. Dell’s Post Standard Support offer, described in the guide’s service appendix, adds up to five more years of hardware cover once the initial seven years of ProSupport end. Our end-of-life checker tracks announced dates.
Specifications are extracted from Dell’s published documents and independently re-checked line by line. Configurations are quote-based; availability and exact options are confirmed at quotation. Last reviewed 2026-09-11.
