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Technical data sheet · PowerEdge 16G · 4U four-socket

Dell PowerEdge R960Specifications, configurations & comparisons

Dell’s R960 is a 4U, four-socket server for 4th Gen Intel Xeon Scalable. It shares the 2U R860’s processors and 64 DDR5 slots but adds room for double-wide GPUs, twelve Gen5 slots, 32 front bays and four supplies. We map each of those — five riser layouts, seven storage fronts, 2+2 power — and the thermal and environmental rules attached to them.

4U Rack2 or 4 sockets4th Gen Xeon ScalableiDRAC9
4processor socketsup to 240 cores in total
16TBDDR5 maximum64 slots · 64 × 256 GB
32front drive bays2.5" SAS4/SATA · no rear bays
12PCIe Gen5 x16 slotsmaximum-I/O riser layout
4double-wide GPUsup to 400 W · GPU riser layout
4power supplies2+2 · up to 2800 W each

Every figure checked against the Dell PowerEdge R960 Technical Guide (December 2024, Rev. A05)

Form factor
4U Rack · 4 sockets
Processors
4th Gen Xeon
Memory
64 × DDR5 RDIMM · up to 16 TB
Drive bays
Up to 32 · 7 drive-bay layouts
Expansion
12 × PCIe · 1 × OCP 3.0
GPUs
Up to 4 · 1 listed
Boot
BOSS-N1
Management
iDRAC9
01 — Overview

The R960 at a glance

Our read of Dell’s documentation: where the R960 is strong, and the limits worth knowing before you spec one.

Strengths

  • Four sockets with room for accelerators: the GPU riser layout takes four full-length double-wide cards, which the 2U R860 cannot.
  • Up to twelve PCIe Gen5 x16 slots with four processors — half as many again as the R860 — for fabric, storage and network adapters.
  • Thirty-two front 2.5-inch bays in a dual-controller layout, or 24 NVMe, or 16 E3.S Gen5 alongside eight SAS4/SATA.
  • Four supplies in 2+2 redundancy, with a −48 to −60 V DC model rated 1100 W among the options for DC-powered rooms.
  • On air, even the 330 W and 350 W processors are rated for 35°C inlet in every storage layout, and the lower-power parts reach 40–45°C in the all-SAS 8-, 16- and 32-bay layouts.

Watch-outs

  • Two processors leave just two usable PCIe slots (3 and 11 in riser configuration 0-2); the scale-out, maximum-I/O and GPU layouts all need four.
  • No riser configuration allows rear drives, so apart from the BOSS-N1 boot module every drive has to sit in the front bays.
  • Double-wide GPUs are ruled out with the 32-bay SAS and the 16 + 8 NVMe fronts, need the GPU air shroud, and are barred entirely from ASHRAE A3 and A4 rooms.
  • At 4U and up to 60.2 kg it takes twice the rack height of the R860 for the same processor and memory ceiling.
  • Using slots 4 and 9 brings a 35°C limit with seven of the ten processors, and on air those two slots are unsupported in A3 and A4.
Processors10 SKUs
Cores / CPU8–60
DIMM slots64
Drive layouts7
Max bays32
GPUsup to 4
PSU options6 · to 2,800 W
02 — Processors

10 supported processors, mapped

The same ten 4th Gen Xeon Scalable H-series processors as the R860, from the 8-core, 3.7 GHz Gold 6434H to the 60-core Platinum 8490H. The chart places each by cores and TDP. Dell’s thermal tables are also more generous here: the storage layout constrains the processor choice far less than in the 2U sibling.

Processor landscape — cores × TDP

10 SKUs · 1 family
Dell PowerEdge R960: every supported processor by cores and TDP0816243240485664150 W200 W250 W300 W350 WCores per processorIntel Xeon Platinum 8490H — 60 cores / 120 threads · 350 W · 1.9 GHz base · 113 MB cache · DDR5-4800Intel Xeon Platinum 8468H — 48 cores / 96 threads · 330 W · 2.1 GHz base · 105 MB cache · DDR5-4800Intel Xeon Platinum 8460H — 40 cores / 80 threads · 330 W · 2.2 GHz base · 105 MB cache · DDR5-4800Intel Xeon Platinum 8454H — 32 cores / 64 threads · 270 W · 2.1 GHz base · 83 MB cache · DDR5-4800Intel Xeon Gold 6448H — 32 cores / 64 threads · 250 W · 2.4 GHz base · 60 MB cache · DDR5-4800Intel Xeon Platinum 8450H — 28 cores / 56 threads · 250 W · 2 GHz base · 75 MB cache · DDR5-4800Intel Xeon Gold 6418H — 24 cores / 48 threads · 185 W · 2.1 GHz base · 60 MB cache · DDR5-4800Intel Xeon Gold 6416H — 18 cores / 36 threads · 165 W · 2.2 GHz base · 45 MB cache · DDR5-4800Intel Xeon Platinum 8444H — 16 cores / 32 threads · 270 W · 2.9 GHz base · 45 MB cache · DDR5-4800Intel Xeon Gold 6434H — 8 cores / 16 threads · 195 W · 3.7 GHz base · 23 MB cache · DDR5-48008490H60 cores · 5.8 W/core — top SKU and most efficient
4th Gen Xeon Scalable 10Bubble size = L3 cache · hover a bubble for the full SKU

Processor explorer

filter · sort · compare
ProcessorCores / threadsBaseL3 cacheTDPW / coreMemory
Intel Xeon Platinum 8490H60 / 1201.9 GHz113 MB350 W5.8DDR5-4800
Intel Xeon Platinum 8468H48 / 962.1 GHz105 MB330 W6.9DDR5-4800
Intel Xeon Platinum 8460H40 / 802.2 GHz105 MB330 W8.3DDR5-4800
Intel Xeon Platinum 8454H32 / 642.1 GHz83 MB270 W8.4DDR5-4800
Intel Xeon Gold 6448H32 / 642.4 GHz60 MB250 W7.8DDR5-4800
Intel Xeon Platinum 8450H28 / 562 GHz75 MB250 W8.9DDR5-4800
Intel Xeon Gold 6418H24 / 482.1 GHz60 MB185 W7.7DDR5-4800
Intel Xeon Gold 6416H18 / 362.2 GHz45 MB165 W9.2DDR5-4800
Intel Xeon Platinum 8444H16 / 322.9 GHz45 MB270 W16.9DDR5-4800
Intel Xeon Gold 6434H8 / 163.7 GHz23 MB195 W24.4DDR5-4800
  • Dell does not recommend mixing processor models when all four sockets are populated.
  • 96 GB RDIMMs are limited to the Platinum 8400H processors.
  • Processors up to 185 W use the standard heat sink; 195 W and above use the L-type.
  • On air, ASHRAE A3 rooms exclude processors of 330 W or more, and A4 rooms those of 250 W or more.
03 — Memory

64 DIMM slots, 16 per processor

Sixty-four DDR5 RDIMM slots, sixteen per processor, give 16 TB when filled with 256 GB modules. The processors, not the module label, set the speed: every DIMM, 5600-rated parts included, runs at 4800 MT/s alone on its channel and at 4400 MT/s when a second shares it.

Capacity with every slot filled

by DIMM size
16 GB1 TB32 GB2 TB64 GB4 TB96 GB6 TBPlatinum 8400H only · 8 or 16 per CPU128 GB8 TB256 GB16 TB64 slots · 16 per processor · each tick = one DIMM

Operating speed

per Dell memory tables
Processor1 DIMM / channel2 DIMMs / channel
4th Gen Xeon Scalable (H-series)4800 MT/s4400 MT/s
  • Unlike the R860 guide, the R960 guide places no one-per-channel limit on 256 GB RDIMMs, and its thermal matrix rates them for 35°C in every layout.
  • 96 GB modules need 8 or 16 DIMMs per processor; on air they are rated for 40°C in the 32-, 16- and 8-bay SAS layouts and 35°C elsewhere.
  • Empty slots take DIMM blanks.
  • ASHRAE A3 and A4 rooms exclude 128 GB and larger RDIMMs.
04 — Storage

7 drive-bay layouts, up to 32 bays

Seven layouts, all at the front: 8 × 2.5-inch SAS/SATA, 16 or 32 × 2.5-inch SAS4/SATA, 24 × 2.5-inch NVMe, a 16 + 8 SAS/NVMe split, and two EDSFF E3.S Gen5 options. None of the five riser configurations allows rear drives, so every drive sits behind the front bezel.

Headline layouts

front panel view

Front panel

The bay-count maximum: 32 SAS4/SATA bays in Dell’s dual-controller Smart Flow layout.

SAS/SATANVMeSAS/SATA + NVMe

Controllers & boot

  • S160 — Software RAID. Entry tier (OS RAID / S160)
  • PERC H355 — RAID. Value tier, PERC 11 (replaces H345 from Dec 2021; H345 deprecated Jan 2022)
  • HBA355i — HBA. Value tier, HBA 11 internal
  • HBA355e — HBA. Value tier, HBA 11 external
  • HBA465i — HBA. Value tier, HBA 12 internal (Table 6 prints 'H465 (internal/external)'; Table 2 prints HBA465i)
  • HBA465e — HBA. Value tier, HBA 12 external
  • PERC H755 — RAID. Value Performance tier, PERC 11 (front PERC)
  • PERC H965i — RAID. Premium Performance tier, PERC 12 (Avenger), front PERC
  • BOSS-N1 — boot
All 9 controllers and 1 boot options
  • PERC H965e — RAID. Premium Performance tier, PERC 12 external
  • On the Universal backplane, SAS/SATA drives get hardware RAID while NVMe drives are direct-attached.
  • Dell does not support Tri-Mode on PowerEdge, meaning SAS, SATA and NVMe drives cannot all be mixed behind one controller.
  • Dell’s drive table lists E3.S at 3.84 and 7.68 TB and 10K SAS disks from 600 GB to 2.4 TB.
  • BOSS-N1 and 2.5-inch NVMe are unsupported in ASHRAE A3 and A4, as are PCIe slots 4 and 9 on air-cooled systems.

Every documented layout

7 with drive bays
32 x 2.5-inch (SAS/SATA) - Dual Controller (Smart …32 x 2.5-inch (SAS4/SATA) - Dual Controller (Smart Flow)3216 x 2.5-inch (SAS/SATA) + 8 x 2.5-inch NVMe16 x 2.5-inch (SAS4/SATA) + 8 x 2.5-inch NVMe2424 x 2.5-inch (NVMe Gen4) Passive24 x 2.5-inch (NVMe Gen4) Passive2416 x 2.5-inch (SAS/SATA) - Smart Flow16 x 2.5-inch (SAS4/SATA) - Smart Flow168 x 2.5-inch (SAS/SATA) - Smart Flow8 x 2.5-inch (SAS/SATA) - Smart Flow816 x EDSFF E3.S (NVMe Gen5) + 8 x 2.5-inch (SAS/SA…16 x EDSFF E3.S (NVMe Gen5) + 8 x 2.5-inch (SAS4/SATA)2416 x EDSFF E3.S (NVMe Gen5)16 x EDSFF E3.S (NVMe Gen5)16Bays · solid = front · dashed = rear · brighter = NVMe-only
2.5-inch3.5-inchEDSFF (E1.S / E3.S)
05Accelerators & I/O

GPUs, PCIe and networking

Double-wide cards need riser configuration 3, Dell’s GPU layout and the only one with double-wide slots: four full-length Gen5 x16 positions (3, 6, 8 and 11) alongside single-wide and low-profile slots. Any installed GPU also needs the GPU air shroud. Dell’s option tables name no specific cards; one acoustic test system carries two NVIDIA A16s at 250 W, in slots 2 and 10. Up to four double-wide cards at 400 W per the feature table; the thermal matrix row covers 300 W double-width cards at 35°C.

Double-wide GPU (model not named in guide; feature table: 'Up to four double wide 400 W'; thermal table row: 'Double width (300 W)')

double-wide
up to 4

I/O topology

80 lanes per CPU
CPU 180 × PCIe 5.016 DIMMCPU 280 × PCIe 5.016 DIMMCPU 380 × PCIe 5.016 DIMMCPU 480 × PCIe 5.016 DIMMUPI 4 links · up to 16 GT/sUp to 12 × Gen5 x16maximum-I/O layout · four CPUsGPU: 4 × DW Gen5 x16riser config 3 · slots 3, 6, 8, 11OCP NIC 3.0 (Gen4 x16)up to 4 ports · 100 GbEOptional 2 × 1GbE LOMBCM5720 · fits alongside OCP

Each processor brings 80 PCIe 5.0 lanes. Dell lists five riser configurations, from a two-processor entry layout with two usable slots to a four-processor layout with twelve.

Network adapters Dell lists

15 options
AdapterPortsForm
Broadcom 4 x 25 GbE SFP28 OCP 3.04 × 25GbEOCP 3.0
Broadcom 2 x 25 GbE SFP28 OCP 3.02 × 25GbEOCP 3.0
Intel 4 x 25 GbE SFP28 OCP 3.04 × 25GbEOCP 3.0
Intel 2 x 25 GbE SFP28 OCP 3.02 × 25GbEOCP 3.0
Broadcom 4 x 10 GbE BT OCP 3.04 × 10GbEOCP 3.0
Broadcom 2 x 10 GbE SFP+ OCP 3.02 × 10GbEOCP 3.0
Broadcom 4 x 1 GbE BT OCP 3.04 × 1GbEOCP 3.0
Intel 4 x 1 GbE SFP+ OCP 3.0 (as printed)4 × 1GbEOCP 3.0
Broadcom 2 x 100 GbE QSFP56 OCP 3.02 × 100GbEOCP 3.0
Mellanox 2 x 100 GbE QSFP56 OCP 3.02 × 100GbEOCP 3.0
Mellanox 2 x 25 GbE SFP28 OCP 3.02 × 25GbEOCP 3.0
Intel 4 x 1 GbE SFP+ OCP 3.0 (as printed; duplicate row in Table 10)4 × 1GbEOCP 3.0
Intel 4 x 10 GbE SFP+ OCP 3.04 × 10GbEOCP 3.0
Intel 2 x 10 GbE SFP+ OCP 3.02 × 10GbEOCP 3.0
Broadcom 5720 (BCM5720) 2 x 1 GbE LOM (optional)2 × 1GbELOM
  • Riser configuration 0-1 gives four Gen5 x16 slots with four processors; 0-2 leaves only slots 3 and 11 active with two.
  • The scale-out configuration provides eight full-height slots; maximum I/O adds two low-profile slots (4 and 9) and two more full-height ones.
  • OCP cards draw 15–35 W; in A3/A4 rooms they need 85°C-rated active optical cables, and cards above cooling tier 5 are excluded (above tier 4 for liquid-cooled systems in A4).
06 — Power & cooling

6 power supplies, 1,100–2,800 W

Up to four hot-plug supplies in 2+2 redundancy. AC options run from 1100 W to 2800 W across the 60 mm and 86 mm form factors, and a 60 mm 1100 W unit takes −48 to −60 V DC input.

0500100015002000250030001100 W N/A (-48 V DC) — -(48-60) V DC input (LVDC), 27 A; 60 mm; LOTES APOW0097 cord1100DC1100 W Titanium — Mixed mode (100-240 V AC / 240 V DC); 1050 W at low line 100-120 V AC; 60 mm; C13 cord10501100Titanium1400 W Platinum — Mixed mode (100-240 V AC / 240 V DC); 1050 W at low line 100-120 V AC; 60 mm; C13 cord10501400Platinum1800 W Titanium — Mixed mode HLAC (200-240 V AC / 240 V DC); no low-line operation; 60 mm; C15 cord1800Titanium2400 W Platinum — Mixed mode (100-240 V AC / 240 V DC); 1400 W at low line 100-120 V AC; 86 mm14002400Platinum2800 W Titanium — Mixed mode HLAC (200-240 V AC / 240 V DC); no low-line operation; 86 mm2800TitaniumWatts · dashed line = output at 100–120 V low line
AC−48 V DC
  • The supplies work as two sets: if the sets differ at iDRAC boot, the higher-capacity set is enabled, and a set added later must match the first.
  • Low-line (100–120 V AC) ratings: 1400 W for the 2400 W unit, 1050 W each for the 1100 W and 1400 W units, and none for the 1800 W and 2800 W units.
  • The −48 V DC supply draws 27 A, dissipates 4267 BTU/hr, reaches 92% efficiency at half load and uses a LOTES APOW0097 cord.
  • All four supplies must be fitted for ASHRAE A3 or A4 operation.
  • Dell’s loudest test system — four 350 W processors, 64 DIMMs, 32 drives and four 2800 W supplies — measured 77 dB(A) at maximum load and 35°C.
07 — Management, security & OS

Run it, secure it, choose the OS

Management

  • iDRAC9 with iDRAC Direct (front micro-AB USB)
  • iDRAC RESTful API with Redfish
  • iDRAC Service Module
  • Quick Sync 2 wireless module
  • OpenManage Enterprise with Power Manager, Service and Update Manager plug-ins
  • CloudIQ for PowerEdge
  • OpenManage integrations for VMware vCenter, Microsoft System Center, Windows Admin Center and ServiceNow
  • Red Hat Ansible modules and Terraform providers

Security

  • Silicon Root of Trust
  • Cryptographically signed firmware
  • Secure Boot
  • Secure Erase
  • Secured Component Verification (hardware integrity check)
  • Data at Rest Encryption (SEDs, local or external key management)
  • System Lockdown (iDRAC9 Enterprise or Datacenter)
  • TPM 2.0 FIPS, CC-TCG certified; TPM 2.0 China NationZ

Operating systems

  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi
08 — Compare

R940xa → R960

Dell’s guide measures the R960 against the GPU-capable R940xa. There is no successor comparison, so the table shows that single step.

Previous generationPowerEdge R940xa
16GPowerEdge R960
Processors
4 × 2nd Gen Intel Xeon Scalable
4 × 4th Gen Intel Xeon Scalable
Memory
48 × DDR4 RDIMM / LRDIMM · 24 × Optane PMem · 12 × NVDIMM
64 × DDR5 RDIMM · 4800 / 4400 MT/s
Front bays
2.5" 12 Gb SAS, 6 Gb SATA, Gen3 NVMe
2.5" 24 Gb SAS, 6 Gb SATA, Gen3/4 NVMe · E3.S Gen5
GPUs
Up to 2 × double-wide 300 W or 8 × single-wide 75 W
Up to 4 × double-wide 400 W
PCIe
Up to 12 × Gen3 (6 × x16, or 2 × x16 + 10 × x8)
Up to 12 × Gen5
Power
750–2600 W AC · 1100 W −48 V DC
1100–2800 W AC · 1100 W DC
Networking
Optional 4 × 1GbE daughter card
Optional 2 × 1GbE LOM · OCP 3.0 x16
Cooling
Air
Air, or optional DLC
Height
174.3 mm
174.3 mm
Width
441.16 mm
482 mm
Depth (with bezel)
877.84 mm
883.195 mm

Source: Dell PowerEdge R960 Technical Guide (December 2024, Rev. A05), Table 2 (R960 vs R940xa).

The R960 family side by side

The R960 sits above the 2U R860, which shares its processors and memory; the GPU-dense R760xa and XE8640 are two-socket accelerator alternatives. The bars compare what Dell documents for each.

R960R860R760xaXE8640R760Cores / CPUR960: 6060R860: 6060R760xa: 6464XE8640: 6464R760: 6464DIMM slotsR960: 6464R860: 6464R760xa: 3232XE8640: 3232R760: 3232Max memoryR960: 16 TB16R860: 16 TB16R760xa: 8 TB8XE8640: 4 TB4R760: 8 TB8Max drive baysR960: 3232R860: 2828R760xa: 88XE8640: 88R760: 2828Max GPUsR960: 44R860: 00R760xa: 1212XE8640: 44R760: 66Largest PSUR960: 2,800 W2,800R860: 2,800 W2,800R760xa: 3,200 W3,200XE8640: 3,200 W3,200R760: 3,200 W3,200
This modelSiblings and successorEach value from that model’s own verified spec file · bars scale per column
09 — Use cases

Four builds that suit the R960

Four builds for the scale-up work Dell aims the R960 at, each checked against its thermal and environmental tables. Only parts our configurator lists for the R960 are used, and each build opens there for changes.

Mission-critical ERP

16 TB scale-up ERP and database host

SAP HANA, Oracle and ERP lead Dell’s workload list for the R960, and here the full 16 TB carries no layout caveat: 64 × 256 GB modules, rated for 35°C in every storage layout, behind four 48-core Platinum 8468H processors.

  • 4 × Xeon Platinum 8468H48 cores @ 2.1 GHz, 330 W each
  • 64 × 256 GB DDR5-4800 RDIMM — 16 TB
  • 12 × 7.68 TB NVMe on the 24-bay passive NVMe backplane
  • BOSS-N1 boot device
  • Broadcom 2 × 100GbE QSFP56 OCP 3.0
  • 4 × 2800 W Titanium, 200–240 V (2+2)
  • SUSE Linux Enterprise Server

On air, 330 W processors are unsupported in ASHRAE A3 rooms, and 128 GB+ DIMMs are excluded in A3 and A4, so this build needs an A2 (10–35°C) environment.

Open this build in the configurator →
VM consolidation

32-bay consolidation host

The R860 guide lists no 32-bay front, so this Smart Flow layout is one the R960 has over its 2U sibling. Four 32-core Gold 6448H processors give 128 cores, and on air Dell rates these 250 W parts to 40°C inlet in this layout.

  • 4 × Xeon Gold 6448H32 cores @ 2.4 GHz, 250 W each
  • 64 × 64 GB DDR5-4800 RDIMM — 4 TB
  • 32 × 3.84 TB SAS SSD — 122.88 TB raw
  • PERC H965i front controller
  • BOSS-N1 boot device
  • Broadcom 4 × 25GbE SFP28 OCP 3.0
  • 4 × 2400 W Platinum (2+2)
  • VMware ESXi

Dell lists the 32-bay layout as dual-controller; we confirm the controller pairing when we quote. Double-wide GPUs are not supported with this front.

Open this build in the configurator →
Data warehouse & BI

E3.S Gen5 analytics engine

Sixteen EDSFF E3.S Gen5 drives feed four 60-core Platinum 8490H processors for data warehousing and business intelligence. The E3.S layout keeps the 350 W parts at 35°C on air and still allows double-wide GPUs if the workload later needs them.

  • 4 × Xeon Platinum 8490H60 cores @ 1.9 GHz, 350 W each
  • 64 × 128 GB DDR5 RDIMM — 8 TB
  • 16 × 7.68 TB E3.S Gen5 NVMe — 122.88 TB raw
  • BOSS-N1 boot device
  • Mellanox 2 × 100GbE QSFP56 OCP 3.0
  • 4 × 2800 W Titanium (2+2)
  • Red Hat Enterprise Linux

Adding double-wide GPUs means moving to riser configuration 3, the only layout with double-wide slots, and fitting the GPU air shroud; GPUs are not supported in ASHRAE A3 or A4.

Open this build in the configurator →
DC-powered sites

Four-socket host on −48 V DC

Unlike the R860, whose supplies are all mixed-mode AC and 240 V DC units, the R960 offers a −48 to −60 V DC supply. Four 1100 W DC units in 2+2 pair with a moderate build: four 18-core Gold 6416H processors at 165 W, which Dell rates for 45°C inlet on air in the all-SAS layouts.

  • 4 × Xeon Gold 6416H18 cores @ 2.2 GHz, 165 W each
  • 32 × 32 GB DDR5-4800 RDIMM — 1 TB, eight per processor
  • 8 × 1.92 TB SAS SSD on the 16-bay SAS4/SATA backplane
  • PERC H755 hardware RAID
  • BOSS-N1 boot device
  • Intel 4 × 10GbE SFP+ OCP 3.0
  • 4 × 1100 W −48 to −60 V DC (2+2)
  • Ubuntu Server LTS

Dell’s R960 guide does not mention NEBS; check site standards before deploying in a telecom central office.

Open this build in the configurator →
10 — Refurbished alternatives

When a refurbished PowerEdge makes more sense

None of the refurbished PowerEdge servers we configure has four sockets. Where an R960 is being considered for GPU or memory headroom rather than socket count, these two-socket models are the closest refurbished options.

14G · re-certified

PowerEdge R7425

  • 2U · 2 × AMD EPYC 7001, up to 64 cores
  • 32 DIMM slots · up to 4 TB DDR4
  • 24 × 2.5" or 12 × 3.5" bays
  • GPU-capable · iDRAC9

Up to 64 cores, 4 TB and GPU capability in 2U, for teams comfortable with DDR4 and AMD EPYC 7001.

Configure a refurbished R7425
14G · re-certified

PowerEdge R740

  • 2U · 2 × Xeon Scalable
  • 24 DIMM slots · up to 3 TB DDR4
  • 16 × 2.5" or 8 × 3.5" bays
  • GPU-capable · iDRAC9

GPU-capable two-socket Xeon hosts for smaller accelerated or virtualised workloads, capped at 3 TB of DDR4.

Configure a refurbished R740
11 — Full specifications

Dell PowerEdge R960 specifications

Chassis & cooling

Form factor4U rack server
Dimensions (H × W × D)174.3 × 482 × 883.195 mm with bezel · 869.195 mm deep without
WeightUp to 60.2 kg fully populated
CoolingAir, or optional Direct Liquid Cooling (rack manifolds and CDU required)
FansUp to six Standard (STD) dual-fan modules, which Dell requires in every configuration · N+1 fan redundancy
BezelOptional LCD bezel or security bezel
RailsB19 Stab-in/Drop-in sliding rails (4-post) · optional CMA or strain relief bar

Processor

SocketsTwo or four
Family4th Gen Intel Xeon Scalable, 10 H-series SKUs
Cores per processor8 to 60
TDP range165 W to 350 W
UPIUp to 4 links per processor · 16 GT/s
PCIe lanes80 × PCIe 5.0 per processor

Memory

Slots64 DDR5 ECC RDIMM · 16 per processor
DIMM sizes16, 32, 64, 96, 128 and 256 GB
Speed4800 MT/s (1 DPC) / 4400 MT/s (2 DPC) regardless of module rating
Maximum16 TB (64 × 256 GB)
Voltage1.1 V

Storage

Front8 × 2.5" SAS/SATA or 16 × 2.5" SAS4/SATA (both Smart Flow) · 32 × 2.5" SAS4/SATA (Smart Flow, dual controller) · 24 × 2.5" NVMe Gen4 passive · 16 × 2.5" SAS4/SATA + 8 × NVMe · 16 × E3.S Gen5 · 16 × E3.S + 8 × 2.5" SAS4/SATA
RearNone
ControllersPERC H355, H755, H965i, H965e · HBA355i, HBA355e, HBA465i, HBA465e · S160
BootBOSS-N1
ExternalUSB tape, NAS software stack, 12 Gb MD-series JBODs

Expansion & networking

PCIe slotsUp to 12 × Gen5 x16 (four CPUs) · 2 × Gen5 x16 with two CPUs
OCPOCP NIC 3.0 SFF, Gen4 x16: 4 × 1GbE, 2 or 4 × 10GbE, 2 or 4 × 25GbE, 2 × 100GbE
LOMOptional 2 × 1GbE (Broadcom BCM5720)

Accelerators

GPU envelopeUp to 4 × double-wide 400 W (riser configuration 3)
RestrictionsGPU air shroud required · double-wide cards not with 32 × 2.5" SAS or 16 + 8 NVMe fronts · no GPUs in ASHRAE A3/A4

Power

SuppliesUp to four hot-plug, 2+2 redundant
60 mm1100 W Titanium · 1400 W Platinum · 1800 W Titanium (200–240 V only) · 1100 W −48 to −60 V DC
86 mm2400 W Platinum · 2800 W Titanium (200–240 V only)

Ports & video

Front1 × USB 2.0 · 1 × VGA · 1 × iDRAC Direct (micro-AB USB)
Rear1 × USB 2.0 · 1 × USB 3.0 · 1 × VGA · 1 × dedicated iDRAC Ethernet · optional serial
Internal1 × USB 3.0 (optional)
VideoIntegrated Matrox G200, 16 MB

Environment

ASHRAE A210–35°C below 900 m
ASHRAE A35–40°C · no GPUs, 128 GB+ DIMMs, 2.5" NVMe or BOSS-N1 · on air, processors below 330 W and no slots 4 or 9
ASHRAE A45–45°C · same GPU, DIMM, NVMe and BOSS-N1 exclusions · on air, processors below 250 W and no slots 4 or 9
AcousticsFour 350 W processors, 64 DIMMs, 32 drives: 77 dB(A) at maximum load (35°C)
12 — FAQ

R960 questions, answered from the documentation

What is the maximum memory of the Dell PowerEdge R960?

The R960 has 64 DDR5 RDIMM slots, 16 per processor, and Dell states a 16 TB maximum — 64 × 256 GB. Its thermal matrix rates 256 GB modules for 35°C in every storage layout, and the guide sets no one-per-channel limit on them. Filling both DIMMs of a channel lowers the speed from 4800 to 4400 MT/s.

How many GPUs does the R960 support?

Up to four double-wide cards at 400 W, according to Dell’s feature table, in riser configuration 3 with a GPU air shroud. The thermal matrix lists 300 W double-width cards at 35°C and excludes them with the 32-bay SAS and 16 + 8 NVMe fronts. ASHRAE A3 and A4 rooms do not allow GPUs at all.

Which processors does the R960 support?

Exactly the R860’s list: ten H-series chips from Intel’s 4th Gen Xeon Scalable range, the smallest an 8-core Gold 6434H at 3.7 GHz and the largest the 60-core, 350 W Platinum 8490H. Up to four can be fitted, and Dell recommends against mixing models in a four-socket build.

How many drive bays does the R960 have?

Up to 32 × 2.5-inch SAS4/SATA drives at the front in a dual-controller layout. NVMe options are 24 × 2.5-inch Gen4 drives, 16 SAS4/SATA plus 8 NVMe, 16 EDSFF E3.S Gen5, or 16 E3.S with 8 SAS4/SATA. There are no rear drive bays.

How many PCIe slots does the R960 have?

Up to twelve PCIe Gen5 x16 slots in the maximum-I/O layout (ten full-height, two low-profile), eight in the scale-out layout and four in the basic four-processor layout. With two processors only slots 3 and 11 are active. Each processor supplies 80 PCIe 5.0 lanes, and the OCP 3.0 slot (Gen4 x16) and optional 2 × 1GbE LOM are separate.

What power supplies does the R960 use?

Four hot-plug supplies in 2+2: 1100 W Titanium, 1400 W Platinum, 1800 W Titanium, 2400 W Platinum or 2800 W Titanium AC, plus a DC-only 1100 W model for −48 to −60 V feeds. At 100–120 V the 2400 W model is rated 1400 W and the two smallest AC models 1050 W, while the 1800 W and 2800 W models need high line.

How big and heavy is the PowerEdge R960?

It is a 4U server, 174.3 mm high, 482 mm wide and 883.195 mm deep with the bezel (869.195 mm without). Fully populated it weighs up to 60.2 kg; Dell gives no figure for a system without drives and supplies.

How does the R960 differ from the R860?

Processor choice, DIMM slot count and memory ceiling are shared. The R960 spends its extra 2U on I/O and power: twelve Gen5 slots against eight, four double-wide GPUs against none, 32 front bays against 24 (the R860 adds rear bays for 28), and a 2+2 bank of four supplies with a −48 V DC choice, where the R860 has two in 1+1.

What changed from the R940xa to the R960?

Dell compares the R960 with the R940xa: 2nd Gen Xeon becomes 4th Gen, 48 DDR4 slots with PMem and NVDIMM become 64 DDR5, and twelve Gen3 slots become twelve Gen5. The GPU envelope moves from two 300 W double-wide or eight single-wide cards to four 400 W double-wide, E3.S Gen5 drives and optional liquid cooling arrive, and the height stays at 174.3 mm.

Is the Dell PowerEdge R960 end of life?

The December 2024 R960 guide lists no end-of-sale or end-of-service date. It does describe Post Standard Support, extending hardware coverage by up to five years beyond the first seven years of ProSupport. We add Dell’s lifecycle dates to our end-of-life checker as they appear.

Sources & verification

Where these figures come from

Specifications are extracted from Dell’s published documents and independently re-checked line by line. Configurations are quote-based; availability and exact options are confirmed at quotation. Last reviewed 2026-09-11.

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